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PICMG 2.0 CompactPCI
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PICMG 2.0 base specification.设计compactPCI有所帮助。
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PICMG 2.0 D3.0
CompactPCI
CompactPCI CompactPCI
CompactPCI
Specification
September 24, 1999
DRAFT SPECIFICATION
DO NOT CLAIM CONFORMANCE
PICMG 2.0 D3.0 9/24/99
Draft, Not for Distribution – Do Not Claim Conformance
ii
Copyright 1995, 1996, 1997, 1998, 1999 PCI Industrial Computers Manufacturers
Group (PICMG).
The attention of adopters is directed to the possibility that compliance with or adoption of
PICMG specifications may require use of an invention covered by patent rights.
PICMG shall not be responsible for identifying patents for which a license may be
required by any PICMG specification, or for conducting legal inquiries into the legal
validity or scope of those patents that are brought to its attention. PICMG specifications
are prospective and advisory only. Prospective users are responsible for protecting
themselves against liability for infringement of patents.
NOTICE:
The information contained in this document is subject to change without notice. The
material in this document details a PICMG specification in accordance with the license
and notices set forth on this page. This document does not represent a commitment to
implement any portion of this specification in any company's products.
WHILE THE INFORMATION IN THIS PUBLICATION IS BELIEVED TO BE
ACCURATE, PICMG MAKES NO WARRANTY OF ANY KIND, EXPRESS OR
IMPLIED, WITH REGARD TO THIS MATERIAL INCLUDING, BUT NOT LIMITED
TO ANY WARRANTY OF TITLE OR OWNERSHIP, IMPLIED WARRANTY OF
MERCHANTABILITY OR WARRANTY OF FITNESS FOR PARTICULAR
PURPOSE OR USE.
In no event shall PICMG be liable for errors contained herein or for indirect, incidental,
special, consequential, reliance or cover damages, including loss of profits, revenue, data
or use, incurred by any user or any third party.
Compliance with this specification does not absolve manufacturers of CompactPCI
equipment, from the requirements of safety and regulatory agencies (UL, CSA, FCC,
IEC, etc.).
PICMG
, CompactPCI
, and the PICMG
and CompactPCI
logos are registered
trademarks of the PCI Industrial Computers Manufacturers Group.
All other brand or product names may be trademarks or registered trademarks of their re-
spective holders.
CompactPCI
®
Core Specification PICMG 2.0 D3.0 9/24/99
iii
Draft for PICMG Executive Approval
Do not specify or claim conformance to this specification - Not for Distribution
Contents
1 OVERVIEW ........................................................................................................................................ 9
1.1 C
OMPACTPCI OBJECTIVES................................................................................................................ 9
1.2 B
ACKGROUND AND TERMINOLOGY................................................................................................... 9
1.3 D
ESIRED AUDIENCE .......................................................................................................................... 9
1.4 C
OMPACTPCI FEATURES ................................................................................................................ 10
1.5 A
PPLICABLE DOCUMENTS ............................................................................................................... 10
1.6 A
DMINISTRATION ............................................................................................................................ 11
1.7 N
AME AND LOGO USAGE................................................................................................................ 12
2 FEATURE SET ................................................................................................................................. 13
2.1 F
ORM FACTOR................................................................................................................................. 13
2.2 C
ONNECTOR .................................................................................................................................... 15
2.3 M
ODULARITY .................................................................................................................................. 16
2.4 H
OT SWAP CAPABILITY ................................................................................................................... 16
3 ELECTRICAL REQUIREMENTS ................................................................................................. 17
3.1 B
OARD DESIGN RULES .................................................................................................................... 17
3.1.1 Decoupling Requirements..................................................................................................... 17
3.1.2 CompactPCI Signal Additions .............................................................................................. 18
3.1.3 CompactPCI Stub Termination............................................................................................. 18
3.1.4 Peripheral Board Signal Stub Length................................................................................... 18
3.1.5 Characteristic Impedance..................................................................................................... 19
3.1.6 System Slot Board Signal Stub Length.................................................................................. 19
3.1.7 Peripheral Board PCI Clock Signal Length ......................................................................... 19
3.1.8 Pull-Up Location .................................................................................................................. 19
3.1.9 Board Connector Shield Requirements................................................................................. 20
3.2 B
ACKPLANE DESIGN RULES ............................................................................................................ 21
3.2.1 Characteristic Impedance..................................................................................................... 21
3.2.2 Eight-Slot Backplane Termination........................................................................................ 21
3.2.3 Signaling Environment ......................................................................................................... 22
3.2.4 IDSEL Assignment ................................................................................................................ 22
3.2.5 REQ#/GNT# Assignment ...................................................................................................... 23
3.2.6 PCI Interrupt Binding........................................................................................................... 24
3.2.7 CompactPCI Signal Additions .............................................................................................. 25
3.2.8 Power Distribution................................................................................................................ 28
3.2.9 Power Decoupling ................................................................................................................ 30
3.2.10 Healthy (Healthy#) ............................................................................................................... 31
3.3 33 MH
Z PCI CLOCK DISTRIBUTION ................................................................................................ 31
3.3.1 Backplane Clock Routing Design Rules................................................................................ 32
3.3.2 System Slot Board Clock Routing Design Rules ................................................................... 32
3.4 64-B
IT DESIGN RULES..................................................................................................................... 33
3.5 66 MH
Z ELECTRICAL REQUIREMENTS ............................................................................................ 35
3.5.1 66 MHz Board Design Rules................................................................................................. 35
3.5.2 66 MHz System Board Design Rules..................................................................................... 35
3.5.3 66MHz Backplane Design Rules........................................................................................... 35
3.5.4 66MHz PCI Clock Distribution............................................................................................. 35
3.5.5 66 MHz System Slot Board Clock Routing Design Rules...................................................... 36
3.5.6 66 MHz Hot Swap................................................................................................................. 37
3.6 S
YSTEM AND BOARD GROUNDING .................................................................................................. 37
3.6.1 Board Front Panel Grounding Requirements....................................................................... 37
3.6.2 Backplane Grounding Requirements .................................................................................... 37
3.7 C
OMPACTPCI BUFFER MODELS...................................................................................................... 37
PICMG 2.0 D3.0 9/24/99
Draft, Not for Distribution – Do Not Claim Conformance
iv
4 MECHANICAL REQUIREMENTS ............................................................................................... 39
4.1 B
OARD REQUIREMENTS .................................................................................................................. 39
4.1.1 3U Boards............................................................................................................................. 39
4.1.2 6U Boards............................................................................................................................. 39
4.1.3 Rear-panel I/O Boards.......................................................................................................... 39
4.1.4 ESD Discharge Strip............................................................................................................. 40
4.1.5 ESD Clip ............................................................................................................................... 40
4.1.6 Cross Sectional View ............................................................................................................ 41
4.1.7 Component Outline and Warpage ........................................................................................ 41
4.1.8 Solder Side Cover ................................................................................................................. 41
4.1.9 Front Panels ......................................................................................................................... 51
4.1.10 System Slot Identification...................................................................................................... 52
4.2 R
EAR-PANEL I/O BOARD REQUIREMENTS ...................................................................................... 55
4.2.1 Mechanicals.......................................................................................................................... 55
4.2.2 Power.................................................................................................................................... 55
4.2.3 Rear Panel Keying................................................................................................................ 56
4.3 B
ACKPLANE REQUIREMENTS........................................................................................................... 56
4.3.1 Connector Orientation.......................................................................................................... 56
4.3.2 Slot Spacing .......................................................................................................................... 56
4.3.3 Slot Designation.................................................................................................................... 57
4.3.4 Bus Segments ........................................................................................................................ 57
4.3.5 Backplane Dimensions.......................................................................................................... 57
5 CONNECTOR IMPLEMENTATION............................................................................................ 61
5.1 O
VERVIEW ...................................................................................................................................... 62
5.1.1 Location ................................................................................................................................ 62
5.1.2 Housing Types....................................................................................................................... 62
5.1.3 Connector Tail Lengths......................................................................................................... 62
5.1.4 Backplane / Board Population Options ................................................................................ 62
5.2 J1 (32-B
IT PCI SIGNALS) ................................................................................................................ 63
5.3 J2 C
ONNECTOR ............................................................................................................................... 63
5.3.1 Peripheral Slot 64-Bit PCI.................................................................................................... 63
5.3.2 Peripheral Slot Rear-Panel I/O ............................................................................................ 63
5.3.3 System Slot 64-bit PCI .......................................................................................................... 63
5.3.4 System Slot Rear-Panel I/O .................................................................................................. 63
5.4 B
USSED RESERVED PINS ................................................................................................................. 63
5.5 N
ON-BUSSED RESERVED PINS......................................................................................................... 63
5.6 P
OWER PINS .................................................................................................................................... 63
5.7 5V/3.3V PCI K
EYING ..................................................................................................................... 64
5.8 P
IN ASSIGNMENTS ........................................................................................................................... 65
A. COMPACTPCI BUFFER MODELS .............................................................................................. 71
B. CONNECTOR IMPLEMENTATION............................................................................................ 75
B.1 G
ENERAL ........................................................................................................................................ 75
B.2 C
ONNECTORS .................................................................................................................................. 75
B.3 A
LIGNMENT..................................................................................................................................... 75
B.3.1 Front Plug-In Board Alignment............................................................................................ 75
B.3.2 Rear Panel I/O Board Alignment.......................................................................................... 76
B.3.3 Backward Compatibility for Rear Panel I/O Boards............................................................ 76
CompactPCI
®
Core Specification PICMG 2.0 D3.0 9/24/99
v
Draft for PICMG Executive Approval
Do not specify or claim conformance to this specification - Not for Distribution
Tables
TABLE 1. CODING KEY COLOR ASSIGNMENTS.............................................................................................. 15
T
ABLE 2. BOARD DECOUPLING REQUIREMENTS........................................................................................... 17
T
ABLE 3. STUB TERMINATION RESISTOR...................................................................................................... 18
T
ABLE 4. BOARD CHARACTERISTICS............................................................................................................ 19
T
ABLE 5. PULL-UP RESISTOR VALUES. ......................................................................................................... 20
T
ABLE 6. BACKPLANE CHARACTERISTICS. ................................................................................................... 21
T
ABLE 7. SYSTEM TO LOGICAL SLOT SIGNAL ASSIGNMENTS........................................................................ 23
T
ABLE 8. SYSTEM TO LOGICAL SLOT INTERRUPT ASSIGNMENTS.................................................................. 24
T
ABLE 9. PHYSICAL SLOT ADDRESSES. ........................................................................................................ 27
T
ABLE 10. POWER SPECIFICATIONS.............................................................................................................. 28
T
ABLE 11. BACKPLANE DECOUPLING RECOMMENDATIONS. ........................................................................ 31
T
ABLE 12. CODING KEY COLOR ASSIGNMENTS AND PART NUMBERS.......................................................... 64
T
ABLE 13. COMPACTPCI PERIPHERAL SLOT 64-BIT CONNECTOR PIN ASSIGNMENTS .................................. 65
T
ABLE 14 COMPACTPCI PERIPHERAL SLOT REAR-PANEL I/O CONNECTOR PIN ASSIGNMENTS.................... 66
T
ABLE 15. COMPACTPCI SYSTEM SLOT 64-BIT CONNECTOR PIN ASSIGNMENT............................................ 67
T
ABLE 16. COMPACTPCI SYSTEM SLOT REAR-PANEL I/O CONNECTOR PIN ASSIGNMENTS. ........................ 68
T
ABLE 17. REVISION HISTORY. .................................................................................................................... 70
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资源评论
- ruyu33262012-08-14原始资料,属于工具书,必须具备的参考资料。做CPCI架构开发的,必须具备此资料。
jessesung
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