V
DD
to GND .........................................................-0.3V to +2.2V
GND to PGND ......................................................-0.3V to +0.3V
x_DRV, x_LED+ to PGND ....................................-0.3V to +6.0V
All Other Pins to GND ..........................................-0.3V to +6.0V
Output Short-Circuit Current Duration ....................... Continuous
Continuous Input Current into Any Terminal ....................±20mA
Continuous Power Dissipation (T
A
= +70°C)
OESIP (derate 5.8mW/°C above +70°C) ....................464mW
Operating Temperature Range ........................... -40°C to +85°C
Soldering Temperature (reflow) ....................................... +260°C
Storage Temperature Range ............................ -40°C to +105°C
OESIP
Junction-to-AmbientThermalResistance(θ
JA
) ........150°C/W
Junction-to-CaseThermalResistance(θ
JC
) .............170°C/W
(Note 1)
(V
DD
= 1.8V, V
IR_LED+
= V
R_LED+
= 3.3V, T
A
= +25°C, min/max are from T
A
= -40°C to +85°C, unless otherwise noted.) (Note 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
POWER SUPPLY
Power-Supply Voltage V
DD
Guaranteed by RED and IR count tolerance 1.7 1.8 2.0 V
LED Supply Voltage
(R_LED+ or IR_LED+ to PGND)
V
LED+
Guaranteed by PSRR of LED Driver 3.1 3.3 5.0 V
Supply Current I
DD
SpO
2
and heart rate modes,
PW = 200µs, 50sps
600 1200
µA
Heart rate only mode,
PW = 200µs, 50sps
600 1200
Supply Current in Shutdown I
SHDN
T
A
= +25°C, MODE = 0x80 0.7 10 µA
SENSOR CHARACTERISTICS
ADC Resolution 14 bits
Red ADC Count
(Note 3)
RED
C
Propriety ATE setup
RED_PA = 0x05, LED_PW = 0x00,
SPO2_SR = 0x07, T
A
= +25°C
23,000 26,000 29,000 Counts
IR ADC Count
(Note 3)
IR
C
Propriety ATE setup
IR_PA = 0x09, LED_PW = 0x00,
SPO2_SR = 0x07, T
A
= +25°C
23,000 26,000 29,000 Counts
Dark Current Count DC
C
RED_PA = IR_PA = 0x00,
LED_PW = 0x03, SPO2_SR = 0x01
0 3 Counts
DC Ambient Light Rejection
(Note 4)
ALR
Number of ADC counts with
ngeronsensorunderdirect
sunlight (100K lux)
LED_PW = 0x03,
SPO2_SR = 0x01
RED LED 0
Counts
IR LED 0
www.maximintegrated.com
Maxim Integrated
│
2
MAX30100 Pulse Oximeter and Heart-Rate Sensor IC
for Wearable Health
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Absolute Maximum Ratings
Package Thermal Characteristics
Electrical Characteristics