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JEP161 - System Level ESD Part 1
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JEP161 - System Level ESD Part 1
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JEDEC
PUBLICATION
System Level ESD
Part 1: Common Misconceptions and
Recommended Basic Approaches
JEP161
JANUARY 2011
JEDEC SOLID STATE TECHNOLOGY ASSOCIATION
NOTICE
JEDEC standards and publications contain material that has been prepared, reviewed, and
approved through the JEDEC Board of Directors level and subsequently reviewed and approved
by the JEDEC legal counsel.
JEDEC standards and publications are designed to serve the public interest through eliminating
misunderstandings between manufacturers and purchasers, facilitating interchangeability and
improvement of products, and assisting the purchaser in selecting and obtaining with minimum
delay the proper product for use by those other than JEDEC members, whether the standard is to
be used either domestically or internationally.
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the JEDEC standards or publications.
The information included in JEDEC standards and publications represents a sound approach to
product specification and application, principally from the solid state device manufacturer
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publication may be further processed and ultimately become an ANSI standard.
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Published by
©JEDEC Solid State Technology Association 2011
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JEDEC Solid State Technology Association
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Suite 240 South
Arlington, VA 22201-2107
or refer to
www.jedec.org under Standards and Documents
for alternative contact information.
JEDEC Publication No. 161
System Level ESD
Part I: Common Misconceptions and Recommended Basic Approaches
Contents
1
Scope....................................................................................................................................................................1
1.1 Motivation and Purpose..............................................................................................................................1
1.1 Motivation and Purpose (cont’d)................................................................................................................2
1.2 Background ................................................................................................................................................2
1.2 Background (cont’d)...................................................................................................................................3
1.3 Problem ......................................................................................................................................................3
1.4 OEM Requirements....................................................................................................................................4
1.5 System-Efficient ESD Design (SEED).......................................................................................................4
1.6 System Definition (Internal Pins versus External Pins)..............................................................................5
1.7 General Approach and Outline ...................................................................................................................6
2 References............................................................................................................................................................6
2 References (cont’d)..............................................................................................................................................7
2 References (cont’d)..............................................................................................................................................8
2 References (cont’d)..............................................................................................................................................9
3 Terms, Definitions, and Letter Symbols ..............................................................................................................9
4 Test Methods and Their Field of Application ....................................................................................................12
4.1 The Basic System Level Test: IEC 61000-4-2 .........................................................................................12
4.1 The Basic System Level Test: IEC 61000-4-2 (cont’d)............................................................................13
4.2 System Level Test Methods Based on IEC 61000-4-2.............................................................................17
4.3 Device Level Tests Based on IEC 61000-4-2...........................................................................................21
4.4 System Level ESD Tests under Development..........................................................................................28
4.4 System Level ESD Tests under Development (cont’d) ............................................................................29
4.5 Discussion and Conclusions .....................................................................................................................30
5 Proven System Level Fails.................................................................................................................................31
5.1 How to Prove a System Level ESD Fail? .................................................................................................31
5.1 How to Prove a System Level ESD Fail? (cont’d) ...................................................................................32
5.2 System Level Fails – Case Studies ...........................................................................................................32
5.2 System Level Fails – Case Studies (cont’d) .............................................................................................33
5.2 System Level Fails – Case Studies (cont’d) .............................................................................................34
5.2 System Level Fails – Case Studies (cont’d) .............................................................................................35
5.3 Detailed Case Study .................................................................................................................................35
5.3 Detailed Case Study (cont’d)....................................................................................................................36
5.4 Summary ..................................................................................................................................................37
5.5 Conclusion................................................................................................................................................37
6 OEM System Level ESD Needs and Expectations ............................................................................................38
6.1 Paths to ESD Robust Systems ..................................................................................................................38
6.1 Paths to ESD Robust Systems (cont’d) ....................................................................................................39
6.1 Paths to ESD Robust Systems (cont’d) ....................................................................................................40
6.2 An OEM’s ESD Needs and Expectations.................................................................................................41
6.3 ESD Characteristics of ICs and Systems ..................................................................................................42
6.3 ESD Characteristics of ICs and Systems (cont’d) ....................................................................................43
6.4 Industry Specific Concerns.......................................................................................................................43
6.5 Summary of Realizable Needs and Expectations .....................................................................................43
7 Lack of Correlation between HBM/CDM and IEC 61000-4-2 ..........................................................................44
7.1 Correlation between ESD Models ............................................................................................................44
7.1 Correlation between ESD Models (cont’d) ..............................................................................................45
7.2 Differences among Device Level Tests (HBM/CDM) and IEC 61000-4-2..............................................46
7.2 Differences among Device Level Tests (HBM/CDM) and IEC 61000-4-2 (cont’d)................................47
7.3 Relationships among Different Possible Realizations of System-Type Stresses......................................52
7.4 Review of Other Published Case Studies and Investigations ...................................................................56
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