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超微H12DSU-IN用户手册
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USER’S MANUAL
Revision 1.0c
The information in this User’s Manual has been carefully reviewed and is believed to be accurate. The vendor assumes
no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update
or to keep current the information in this manual, or to notify any person or organization of the updates. Please Note:
For the most up-to-date version of this manual, please see our website at www.supermicro.com.
Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product described in this manual
at any time and without notice. This product, including software and documentation, is the property of Supermicro and/
or its licensors, and is supplied only under a license. Any use or reproduction of this product is not allowed, except
as expressly permitted by the terms of said license.
IN NO EVENT WILL Super Micro Computer, Inc. BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL,
SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO USE THIS PRODUCT
OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER
MICRO COMPUTER, INC. SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED
OR USED WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING,
INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.
Any disputes arising between manufacturer and customer shall be governed by the laws of Santa Clara County in the
State of California, USA. The State of California, County of Santa Clara shall be the exclusive venue for the resolution
of any such disputes. Supermicro's total liability for all claims will not exceed the price paid for the hardware product.
FCC Statement: This equipment has been tested and found to comply with the limits for a Class A or Class B digital
device pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against
harmful interference when the equipment is operated in industrial environment for Class A device or in residential
environment for Class B device. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the manufacturer’s instruction manual, may cause harmful interference with
radio communications. Operation of this equipment in a residential area is likely to cause harmful interference, in
which case you will be required to correct the interference at your own expense.
California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warning applies only
to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate Material-special handling may apply.
See www.dtsc.ca.gov/hazardouswaste/perchlorate”.
The products sold by Supermicro are not intended for and will not be used in life support systems, medical equipment,
nuclear facilities or systems, aircraft, aircraft devices, aircraft/emergency communication devices or other critical
property damage. Accordingly, Supermicro disclaims any and all liability, and should buyer use or sell such products
for use in such ultra-hazardous applications, it does so entirely at its own risk. Furthermore, buyer agrees to fully
indemnify, defend and hold Supermicro harmless for and against any and all claims, demands, actions, litigation, and
proceedings of any kind arising out of or related to such ultra-hazardous use or sale.
Manual Revision 1.0c
Release Date: May 20, 2022
Unless you request and receive written permission from Super Micro Computer, Inc., you may not copy any part of this
to herein are trademarks or registered trademarks of their respective companies or mark holders.
Copyright © 2022 by Super Micro Computer, Inc.
All rights reserved.
Printed in the United States of America
WARNING: This product can expose you to chemicals including
lead, known to the State of California to cause cancer and birth
defects or other reproductive harm. For more information, go
to www.P65Warnings.ca.gov.
!
3
Preface
Preface
About This Manual
This manual is written for system integrators, IT technicians and knowledgeable end users.
It provides information for the installation and use of the H12DSU-iN motherboard.
About This Motherboard
Built upon the functionality and capability of the AMD EPYC® 7002/7003* processor, the
H12DSU-iN motherboard provides superior graphics capability and system performance
while consuming little power. Please note that this motherboard is intended to be installed
and serviced by professional technicians only. For processor/memory updates, please refer
to our website at http://www.supermicro.com/products/.
*AMD EPYC 7003 series processor support requires BIOS version 2.0 or newer.
Conventions Used in the Manual
Special attention should be given to the following symbols for proper installation and to prevent
Warning! Indicates high voltage may be encountered when performing a procedure.
Warning! Indicates important information given to prevent equipment/property damage
4
Contacting Supermicro
Headquarters
Address: Super Micro Computer, Inc.
980 Rock Ave.
San Jose, CA 95131 U.S.A.
Tel: +1 (408) 503-8000
Fax: +1 (408) 503-8008
Email: marketing@supermicro.com (General Information)
support@supermicro.com (Technical Support)
Website: www.supermicro.com
Europe
Address: Super Micro Computer B.V.
Het Sterrenbeeld 28, 5215 ML
's-Hertogenbosch, The Netherlands
Tel: +31 (0) 73-6400390
Fax: +31 (0) 73-6416525
Email: sales@supermicro.nl (General Information)
support@supermicro.nl (Technical Support)
rma@supermicro.nl (Customer Support)
Website: www.supermicro.nl
Asia-Pacic
Address: Super Micro Computer, Inc.
3F, No. 150, Jian 1st Rd.
Zhonghe Dist., New Taipei City 235
Taiwan (R.O.C)
Tel: +886-(2) 8226-3990
Fax: +886-(2) 8226-3992
Email: support@supermicro.com.tw
Website: www.supermicro.com.tw
H12DSU-iN User's Manual
5
Table of Contents
Chapter 1 Introduction
1.1 Quick Reference ................................................................................................................. 11
Quick Reference Table ......................................................................................................12
Motherboard Features .......................................................................................................13
1.2 Processor and Chipset Overview .......................................................................................16
1.3 Special Features ................................................................................................................16
Recovery from AC Power Loss .........................................................................................16
1.4 System Health Monitoring ..................................................................................................17
Onboard Voltage Monitors ................................................................................................17
Fan Status Monitor with Firmware Control .......................................................................17
Environmental Temperature Control .................................................................................17
System Resource Alert......................................................................................................17
1.5 ACPI Features ....................................................................................................................18
1.6 Power Supply .....................................................................................................................18
1.7 Super I/O ............................................................................................................................18
Chapter 2 Installation
2.1 Static-Sensitive Devices .....................................................................................................19
Precautions .......................................................................................................................19
Unpacking .........................................................................................................................19
2.2 Motherboard Installation .....................................................................................................20
Location of Mounting Holes ..............................................................................................20
Installing the Motherboard.................................................................................................22
2.3 Processor and Heatsink Installation ...................................................................................23
2.4 Memory Support and Installation .......................................................................................31
Memory Support ................................................................................................................31
DIMM Module Population Sequence ................................................................................33
DIMM Installation ..............................................................................................................34
DIMM Removal .................................................................................................................34
2.5 Rear I/O Ports ....................................................................................................................35
2.6 Front Control Panel ............................................................................................................38
2.7 Connectors .........................................................................................................................42
Preface
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