目 录
1 前言.........................................................................................................................................1
1.1 研究的背景..................................................................................................................1
1.2 研究的主要内容..........................................................................................................1
1.3 应解决的关键问题......................................................................................................2
5、对测量的误差分析与排。............................................................................................2
2 MCU 主控芯片........................................................................................................................3
2.1 MCU 主控芯片的简介................................................................................................3
2.2 MCU 主控芯片的功能................................................................................................3
3 MLX90614 系列红外测温模块说明......................................................................................4
3.1 概述...............................................................................................................................4
3.2 MLX90614 管脚及功能................................................................................................4
3.3 MLX90614AAA 与单片机连接的硬件电路 ..............................................................4
4 ADT7422 红外测温数据处理模块说明 ................................................................................6
4.1 概述...............................................................................................................................6
4.2 引脚分布及内部电路...................................................................................................6
4.3 ADT422 聚焦及特点 ....................................................................................................7
5 三位共阳数码管显示电路模块说明.....................................................................................8
5.1 概述...............................................................................................................................8
5.2 引脚及内部电路...........................................................................................................8
6 小体积蓝牙模块 WH-BLE103 说明 ...................................................................................10
6.1 概述.............................................................................................................................10
6.2 引脚及功能表.............................................................................................................10
7 基于过 Multisim 软件的单元模块设计及仿真.................................................................12
7.1 各单元模块的电路设计.............................................................................................12
7.1.1 电源管理电路设计...........................................................................................12
7.1.2 电路设计...........................................................................................................13
7.1.3 温度状态指示电路设计...................................................................................14
7.1.4 非接触式体温测量电路设计...........................................................................14
7.1.5 温度数据处理电路设计...................................................................................15
7.1.6 蓝牙电路设计...................................................................................................15
7.2 仿真结果显示.............................................................................................................17
7.3 仿真数据对比分析.....................................................................................................18
8 基于 Fritzing 软件的电路构建 ............................................................................................19
8.1 3D 电路的构建............................................................................................................19
8.2 PCB 电路的的封装 .....................................................................................................21
9 结论.......................................................................................................................................22
10 参考文献.............................................................................................................................23
11 附页.....................................................................................................................................24
