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Bumping Technology
Introduction
Prepare By: Mady Wang
What is Bumping?
• To generate bumps on wafer.
• The essence to advanced packaging, specifically
flip chip packaging.
Benefits of bumping?
• High density interconnection.
• High speed data processing (short connection path, lower
connection resistance and higher driving current density)
• Small package body size.
• Real chip size achievable.
• Cost competitive.
Flip Chip in Package(FCIP) Flip Chip on Board(FCOB)
IC Chip
Substrate
IC Chip
PCB
Bump
Why Bump Needed
Small outline size
Same chip size but much little package size with bump process.
Why Bump Needed
Short signal path
Compared with wire bond, flip chip, which with bump process has shorter signal path.
Chip
Solder bump
Underfill
Heat spread
Substrate
Solder ball
Chip
Solder bump
Underfill
Heat spread
Substrate
Solder ball
signal path
Adhesive
Solder mask
Au wire
Die
Mold compound
Via
Solder ball
Substrate
Adhesive
Solder mask
Au wire
Die
Mold compound
Via
Solder ball
Substrate
signal path
Wire Bond
Flip Chip
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资源评论
- weixin_414177592022-05-23用户下载后在一定时间内未进行评价,系统默认好评。
- 树淼2022-10-31感谢资源主分享的资源解决了我当下的问题,非常有用的资源。
- m0_729770052022-08-02实在是宝藏资源、宝藏分享者!感谢大佬~
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