FDC2214电容传感器芯片数据手册资源-CSDN文库

需积分: 5 43 浏览量 2024-11-15 09:56:33 上传评论收藏 1.87MB PDF 举报

资源推荐

资源详情

资源评论

IN0A

IN0B

IN3A

IN3B

FDC2114 / FDC2214

VDD

GND

SCL

SDA

Int. Osc.

ADDR

INTB

GND

MCU

VDD

3.3 V

GPIO

0.1 F 1 F

Core

peripheral

3.3 V

Cap

Sensor 0

CLKIN

40 MHz

Cap

Sensor 3

Resonant

circuit driver

Resonant

circuit driver

Product

Folder

Sample &

Buy

Technical

Documents

Tools &

Software

Support &

Community

FDC2212

FDC2214

FDC2112

FDC2114

SNOSCZ5A –JUNE 2015–REVISED JUNE 2015

FDC2x1x EMI-Resistant 28-Bit,12-Bit Capacitance-to-Digital Converter for Proximity and

Level Sensing Applications

1 Features 3 Description

Capacitive sensing is a low-power, low-cost, high-

• EMI-Resistant Architecture

resolution contactless sensing technique that can be

• Maximum Output Rates (one active channel):

applied to a variety of applications ranging from

– 13.3 ksps (FDC2112, FDC2114)

proximity detection and gesture recognition to remote

liquid level sensing. The sensor in a capacitive

– 4.08 ksps (FDC2212, FDC2214)

sensing system is any metal or conductor, allowing

• Maximum Input Capacitance: 250 nF (at 10 kHz

for low cost and highly flexible system design.

with 1 mH inductor)

The main challenge limiting sensitivity in capacitive

• Sensor Excitation Frequency: 10 kHz to 10 MHz

sensing applications is noise susceptibility of the

• Number of channels: 2, 4

sensors. With the FDC2x1x innovative EMI resistant

• Resolution: up to 28 bits

architecture, performance can be maintained even in

presence of high-noise environments.

• System Noise Floor: 0.3 fF at 100 sps

• Supply Voltage: 2.7 V to 3.6 V

The FDC2x1x is a multi-channel family of noise- and

EMI-resistant, high-resolution, high-speed

• Power Consumption: Active: 2.1 mA

capacitance-to-digital converters for implementing

• Low-Power Sleep Mode: 35 uA

capacitive sensing solutions. The devices employ an

• Shutdown: 200 nA

innovative narrow-band based architecture to offer

high rejection of noise and interferers while providing

• Interface: I

high resolution at high speed. The devices support a

• Temperature range: -40°C to +125°C

wide excitation frequency range, offering flexibility in

system design. A wide frequency range is especially

2 Applications

useful for reliable sensing of conductive liquids such

as detergent, soap, and ink.

• Proximity Sensor

• Gesture Recognition

Device Information

(1)

• Level Sensor for Liquids, including Conductive

PART NUMBER PACKAGE BODY SIZE (NOM)

ones such as Detergent, Soap, and Ink

FDC2112, FDC2212 WSON (DNT 12) 4.00 mm x 4.00 mm

• Collision Avoidance

FDC2114, FDC2214 WQFN (RGH 16) 4.00 mm x 4.00 mm

• Rain, Fog, Ice, Snow Sensor

(1) For all available packages, see the orderable addendum at

• Automotive Door and Kick Sensors

the end of the datasheet.

• Material Size Detection

Simplified Schematic

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

FDC2212

FDC2214

FDC2112

FDC2114

SNOSCZ5A –JUNE 2015–REVISED JUNE 2015

www.ti.com

Table of Contents

9.4 Device Functional Modes........................................ 21

1 Features.................................................................. 1

9.5 Programming........................................................... 21

2 Applications ........................................................... 1

9.6 Register Maps......................................................... 22

3 Description ............................................................. 1

10 Application and Implementation........................ 39

4 Revision History..................................................... 2

10.1 Application Information.......................................... 39

5 Description, continued.......................................... 3

10.2 Typical Application ............................................... 40

6 Device Comparison Table..................................... 3

10.3 Do's and Don'ts..................................................... 46

7 Pin Configuration and Functions......................... 4

11 Power Supply Recommendations ..................... 46

8 Specifications......................................................... 5

12 Layout................................................................... 46

8.1 Absolute Maximum Ratings ...................................... 5

12.1 Layout Guidelines ................................................. 46

8.2 ESD Ratings ............................................................ 5

12.2 Layout Example .................................................... 46

8.3 Recommended Operating Conditions....................... 5

13 Device and Documentation Support ................. 51

8.4 Thermal Information ................................................. 5

13.1 Device Support...................................................... 51

8.5 Electrical Characteristics........................................... 6

13.2 Related Links ........................................................ 51

8.6 Timing Requirements................................................ 7

13.3 Community Resources.......................................... 51

8.7 Switching Characteristics - I2C ................................. 8

13.4 Trademarks........................................................... 51

8.8 Typical Characteristics.............................................. 9

13.5 Electrostatic Discharge Caution............................ 51

9 Detailed Description............................................ 11

13.6 Glossary................................................................ 51

9.1 Overview ................................................................. 11

14 Mechanical, Packaging, and Orderable

9.2 Functional Block Diagrams ..................................... 11

Information ........................................................... 51

9.3 Feature Description................................................. 12

4 Revision History

Changes from Original (June 2015) to Revision A Page

• Added full datasheet. ............................................................................................................................................................. 1

Product Folder Links: FDC2212 FDC2214 FDC2112 FDC2114

FDC2212

FDC2214

FDC2112

FDC2114

www.ti.com

SNOSCZ5A –JUNE 2015–REVISED JUNE 2015

Pin Functions (continued)

TYPE

(1)

DESCRIPTION

NAME NO.

IN3A 15 A Capacitive sensor input 3 (FDC2114 / FDC2214 only)

IN3B 16 A Capacitive sensor input 3 (FDC2114 / FDC2214 only)

DAP

(2)

DAP N/A Connect to Ground

(2) There is an internal electrical connection between the exposed Die Attach Pad (DAP) and the GND pin of the device. Although the DAP

can be left floating, for best performance the DAP should be connected to the same potential as the device's GND pin. Do not use the

DAP as the primary ground for the device. The device GND pin must always be connected to ground.

8 Specifications

8.1 Absolute Maximum Ratings

MIN MAX UNIT

VDD Supply voltage range 5 V

Vi Voltage on any pin –0.3 VDD + 0.3 V

IA Input current on any INx pin –8 8 mA

ID Input current on any digital pin –5 5 mA

Junction temperature –55 150 °C

stg

Storage temperature –65 150 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

8.2 ESD Ratings

VALUE UNIT

FDC2112 / FDC2212 in 12-pin WSON package

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001

(1)

±2000

(ESD)

Electrostatic discharge V

Charged-device model (CDM), per JEDEC specification JESD22- ±750

C101

(2)

FDC2114 / FDC2214 in 16-pin WQFN package

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001

(1)

±2000

(ESD)

Electrostatic discharge V

Charged-device model (CDM), per JEDEC specification JESD22- ±750

C101

(2)

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

8.3 Recommended Operating Conditions

Unless otherwise specified, all limits ensured for T

= 25°C, VDD = 3.3 V

MIN NOM MAX UNIT

VDD Supply voltage 2.7 3.6 V

Operating temperature –40 125 °C

8.4 Thermal Information

FDC2112 / FDC2214 /

FDC2212 FDC2214

THERMAL METRIC

(1)

UNIT

DNT (WSON) RGH (WQFN)

12 PINS 16 PINS

θJA

Junction-to-ambient thermal resistance 50 38 °C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

Product Folder Links: FDC2212 FDC2214 FDC2112 FDC2114

剩余60页未读，继续阅读

评论收藏

内容反馈

晨之清风

粉丝: 3691
资源: 61

FDC2214电容传感器芯片数据手册

FDC2214原理图

电容传感器FDC2214底层驱动及官方文档

FDC2214数据手册中文版

21ic下载_FDC2214数据手册.zip_FDC2214中文数据手册_fdc2214_数据检测器

FDC2214 STM32程序

FDC2212, FDC2214, FDC2112, FDC2114中文手册

FDC2214全中文手册（2018电子竞赛）

ESP8266_RTOS v3用I2C读FDC2214(附C程序代码).docx

FDC2214源码及数据手册.zip

用ESP8266_RTOS_SDK v3控制电容传感器FDC2214(附C程序).docx

FDC2214中文手册

FDC2214技术手册(中英).rar

18年电赛FDC2214STM32驱动程序

FDC2214资料

FDC2214中文手册.docx

fdc2214测试程序STM32

FDC2214手势识别原理图+PCB+中文手册

电赛必备 fdc2214所有资料

FDC2214模块评估板资料_fdc2214_

FDC2214-STM32串口显示

FDC2214资料集及STM32测试代码

15单片机开发FDC2214，测试程序，好使

fdc2214手册

FDC2214.rar

fdc2214介绍

fdc2214中文手册

2018年TI杯大学生电子设计竞赛题D-手势识别 FDC2214驱动源码

FDC相关资料

2019电赛F题纸张计数程序.rar

最新资源