5
CC2640
www.ti.com.cn
ZHCSDE1B –FEBRUARY 2015–REVISED JULY 2016
内容
版权 © 2015–2016, Texas Instruments Incorporated
内内容容
1 器器件件概概述述 .................................................... 1
1.1 特性 ................................................... 1
1.2 应用 ................................................... 2
1.3 说明 ................................................... 2
1.4 功能框图 .............................................. 4
2 修修订订历历史史记记录录............................................... 6
3 Device Comparison ..................................... 7
3.1 Related Products ..................................... 7
4 Terminal Configuration and Functions.............. 8
4.1 Pin Diagram – RGZ Package ........................ 8
4.2 Signal Descriptions – RGZ Package ................. 9
4.3 Pin Diagram – RHB Package ....................... 11
4.4 Signal Descriptions – RHB Package................ 12
4.5 Pin Diagram – RSM Package....................... 13
4.6 Signal Descriptions – RSM Package ............... 14
5 Specifications........................................... 15
5.1 Absolute Maximum Ratings ......................... 15
5.2 ESD Ratings ........................................ 15
5.3 Recommended Operating Conditions............... 15
5.4 Power Consumption Summary...................... 16
5.5 General Characteristics ............................. 16
5.6 1-Mbps GFSK (Bluetooth low energy) – RX ........ 17
5.7 1-Mbps GFSK (Bluetooth low energy) – TX ........ 17
5.8 2-Mbps GFSK (Bluetooth 5) – RX .................. 18
5.9 2-Mbps GFSK (Bluetooth 5) – TX................... 19
5.10 5-Mbps (Proprietary) – RX .......................... 19
5.11 5-Mbps (Proprietary) – TX .......................... 20
5.12 24-MHz Crystal Oscillator (XOSC_HF) ............. 20
5.13 32.768-kHz Crystal Oscillator (XOSC_LF).......... 20
5.14 48-MHz RC Oscillator (RCOSC_HF) ............... 21
5.15 32-kHz RC Oscillator (RCOSC_LF)................. 21
5.16 ADC Characteristics................................. 21
5.17 Temperature Sensor ................................ 22
5.18 Battery Monitor ...................................... 22
5.19 Continuous Time Comparator....................... 22
5.20 Low-Power Clocked Comparator ................... 23
5.21 Programmable Current Source ..................... 23
5.22 Synchronous Serial Interface (SSI) ................ 23
5.23 DC Characteristics .................................. 25
5.24 Thermal Resistance Characteristics ................ 26
5.25 Timing Requirements ............................... 27
5.26 Switching Characteristics ........................... 27
5.27 Typical Characteristics .............................. 28
6 Detailed Description ................................... 32
6.1 Overview ............................................ 32
6.2 Functional Block Diagram........................... 32
6.3 Main CPU ........................................... 33
6.4 RF Core ............................................. 33
6.5 Sensor Controller ................................... 34
6.6 Memory.............................................. 35
6.7 Debug ............................................... 35
6.8 Power Management................................. 36
6.9 Clock Systems ...................................... 37
6.10 General Peripherals and Modules .................. 37
6.11 Voltage Supply Domains............................ 38
6.12 System Architecture................................. 38
7 Application, Implementation, and Layout ......... 39
7.1 Application Information.............................. 39
7.2 5 × 5 External Differential (5XD) Application Circuit
...................................................... 41
7.3 4 × 4 External Single-ended (4XS) Application
Circuit ............................................... 43
8 器器件件和和文文档档支支持持 .......................................... 45
8.1 器件命名规则 ........................................ 45
8.2 工具与软件 .......................................... 46
8.3 文档支持............................................. 47
8.4 德州仪器 (TI) 低功耗射频网站....................... 47
8.5 低功耗射频电子新闻简报 ............................ 47
8.6 社区资源............................................. 47
8.7 其他信息............................................. 48
8.8 商标.................................................. 48
8.9 静电放电警告 ........................................ 48
8.10 出口管制提示 ........................................ 48
8.11 Glossary ............................................. 48
9 机机械械、、封封装装和和可可订订购购信信息息................................ 48
9.1 封装信息............................................. 48
