没有合适的资源?快使用搜索试试~ 我知道了~
资源推荐
资源详情
资源评论
Published Specifications QSFP-DD MSA Hardware Rev 7.1
© QSFP-DD MSA
Page 1 June 25, 2024
1
2
QSFP-DD MSA 3
4
5
QSFP-DD/QSFP-DD800/QSFP-DD1600 Hardware Specification 6
7
for 8
9
QSFP DOUBLE DENSITY 8X PLUGGABLE TRANSCEIVERS 10
11
12
Revision 7.1 13
14
15
June 25, 2024 16
17
18
Abstract: This specification defines: the electrical and optical connectors, electrical signals and power supplies, 19
mechanical and thermal requirements of the pluggable QSFP Double Density (QSFP-DD/QSFP-DD800/QSFP-20
DD1600) connector and cage system. QSFP-DD MSA family of modules and cages remain fully backward 21
compatible with the classic QSFP+ formfactor. This document provides a common specification for systems 22
manufacturers, system integrators, and suppliers of modules. 23
24
25
POINTS OF CONTACT: 26
Ali Ghiasi (Technical Editor)
Ghiasi Quantum
19947 Lindenbrook Lane
Cupertino, CA 95014
ali at ghiasiquantum dot com
Mark Nowell (Co-Chair)
Cisco
170 West Tasman Dr
San Jose, CA 95134
mnowell at cisco dot com
Scott Sommers (Co-Chair)
Molex
2222 Wellington Court
Lisle, IL 60532-1682
scott.sommers at molex dot com
27
Website: 28
www.QSFP-DD.com
29
30
Limitation on use of Information: 31
This specification is provided "AS IS" with NO WARRANTIES whatsoever and therefore the provision of this 32
specification does not include any warranty of merchantability, noninfringement, fitness for a particular 33
purpose, or any other warranty otherwise arising out of any proposal, specification or sample. The authors 34
further disclaim all liability, including liability for infringement of any proprietary rights, relating to use of 35
information in this specification. No license, express or implied, by estoppel or otherwise, to any intellectual 36
property rights is granted herein. 37
38
Permissions: 39
You are authorized to download, reproduce and distribute this document. All other rights are reserved. The 40
provision of this document should not be construed as the granting of any right to practice, make, use or 41
otherwise develop products that are based on the document. Any and all IP rights related to this document 42
and the designs disclosed within, except for the rights expressly mentioned above, are reserved by the 43
respective owners of those IP rights. 44
45
Published Specifications QSFP-DD MSA Hardware Rev 7.1
© QSFP-DD MSA
Page 2 June 25, 2024
Dedication: 1
The members of the QSFP-DD MSA would like to acknowledge the contributions of Mr. Edmund Poh. He was 2
an excellent engineer; his technical skills and collaborative attitude will be missed. 3
4
The following are Promoter member companies of the QSFP-DD MSA. 5
Broadcom
Foxconn Interconnect Technology
Lumentum
Cisco
Huawei
Nvidia
Corning
Intel
Molex
Coherent
Juniper Networks
TE Connectivity
6
The following are contributing member companies of the QSFP-DD MSA. 7
Accelink
Hakusan
Nokia
ACON
Hewlett Packard Enterprise
Panduit
Alibaba Group
Hisense Broadband
PHY-SI
Amphenol
Hitachi Metals
Ranovus
Applied Optoelectronics
H3C
Samtec
Apresia
Infinera
Semtech
Celestica
InnoLight
Senko
Ciena
JPC
Sicoya
CIG
Keysight Technologies
The Siemon Company
ColorChip
Leoni
Skorpios
Credo
Lorom Cable Connection
Source Photonics
Dell Technologies
Luxshare ICT
Spectra7 Microsystems
Delta Products
Macom
Spirent
Dust Photonics
Marvell
Sumitomo Electric
Eoptolink
MaxLinear
US Conec
Fourte
MultiLane
Xilinx
Fujitsu Optical Components
NEC Corporation
Yamaichi
Genesis Connected Solutions
8
9
Published Specifications QSFP-DD MSA Hardware Rev 7.1
© QSFP-DD MSA
Page 3 June 25, 2024
1
Change History: 2
Revision
Date
Changes
1.0
Sept 19, 2016
First public release
2.0
March 13, 2017
Second public release
3.0
Sept 19, 2017
Third public release
4.0
Sept 18, 2018
Fourth public release, Additions of thermal section, synchronous clocking in 4.9,
Mechanical updates.
5.0
July 9, 2019
Fifth public release, Added Module type 2A, changes to latch and cage drawings, added
ePPS contact, updated power supply testing, added BiDi optical port assignments.
5.1
August 7, 2020
6
th
public release, Chapter 7-Management Interface is now part of CMIS [5]. Port
mapping, optical connectors, and module color coding moved into a new Chapter 5.
6.0
May 20, 2021
7
th
public release, chapters for QSFP-DD800 and QSFP112 Mechanical and Board
Definitions are added. Chapter for QSFP112 Electrical and management timing added.
Updated power supply test method. Module power contacts rating increased from 1 A to
1.5 A and max module power dissipation increased to at least 25 W.
Programmable/Vendor specifics and ePPS/Clock contacts defined. Normative
connector performance Appendix A added.
6.01
May 28, 2021
8
th
public release, reinstated text inadvertently deleted in PCB notes in section 6.3 and
7.3, inadvertent change to a dimension in Figure 45 corrected.
6.2
March 11, 2022
9
th
public release, defined a new improved power supply test method, squelch level
reduced to 50 mV for 112G operation, press hole separation increased to 3.1 mm in
Figure 68. TWI bus timing removed from chapter 4 as identical timing diagram already
included in CMIS [5].
6.3
July 26, 2022
10
th
public release, updated termination definition for P/VSx and ePPS/Clock signals,
Figure 51 bezel opening height adjusted for consistency, updated Figure 75 glue zone.
7.0
Sept. 29, 2023
QSFP112 specifications were forwarded to SFF SNIA and are removed from this
specifications, see [35] and [36]. Missing ModSelL signal is added to the QSFP-DD
example circuit. QSFP-DD1600 mechanical specifications defined in chapter 8. Current
rating for each of QSFP-DD1600 contacts are increased to 2 A with feasibility of at least
40 W module power dissipation. Appendix F
defines QSFP-DD1600 enhanced thermal
design with bottom heat sink.
7.1
June 25, 2024
Updated module noise output measurement, see 4.7.5. Added alternate method to test
module noise tolerance, see 4.7.7. Figure 63 module stop changed to 3.6 mm. New
improved paddle card design for QSFP-DD1600, see 8.3. New 2x1 QSFP-DD1600 cage
system, see 8.5. Added optional high power module monitoring approach, see 9.4
.
QSFP-DD1600 module 2C defined, see Appendix C.
3
Foreword 4
The development work on this specification was done by the QSFP-DD MSA, an industry group. The 5
membership of the committee since its formation on Feb 2016 has included a mix of companies which are 6
leaders across the industry. 7
8
Published Specifications QSFP-DD MSA Hardware Rev 7.1
© QSFP-DD MSA
Page 4 June 25, 2024
1
TABLE of CONTENTS 2
3
1 SCOPE .............................................................................................................................................................................. 10 4
1.1 DESCRIPTION OF CHAPTERS ................................................................................................................................................. 10 5
2 REFERENCES AND ACRONYMS .................................................................................................................................. 11 6
2.1 REFERENCE STANDARDS AND SPECIFICATIONS ................................................................................................................... 11 7
2.2 SFF SPECIFICATIONS: ........................................................................................................................................................... 12 8
2.3 ACRONYMS AND ABBREVIATIONS ........................................................................................................................................... 12 9
2.4 DOCUMENT SOURCE .............................................................................................................................................................. 12 10
3 INTRODUCTION ............................................................................................................................................................... 13 11
3.1 DOCUMENT OVERVIEW AND ORGANIZATION ......................................................................................................................... 13 12
3.2 APPLICATIONS ........................................................................................................................................................................ 14 13
3.3 MODULE MANAGEMENT AND CONTROL .................................................................................................................................. 14 14
4 QSFP-DD FORMFACTOR ELECTRICAL AND MANAGEMENT INTERFACE SPECIFICATIONS ........................... 15 15
4.1 ELECTRICAL CONNECTOR ...................................................................................................................................................... 15 16
4.2 LOW SPEED ELECTRICAL HARDWARE SIGNALS .................................................................................................................... 19 17
4.2.1 ModSelL ............................................................................................................................................................................ 19 18
4.2.2 ResetL ............................................................................................................................................................................... 19 19
4.2.3 LPMode/TxDis ................................................................................................................................................................. 19 20
4.2.4 ModPrsL............................................................................................................................................................................ 20 21
4.2.5 IntL/RxLOSL ..................................................................................................................................................................... 20 22
4.2.6 Programmable/Vendor Specific (Optional) .................................................................................................................. 20 23
4.2.7 ePPS/Clock PTP Reference Clock (Optional) ............................................................................................................ 20 24
4.3 EXAMPLES OF QSFP-DD MODULE FORMFACTOR HOST BOARD SCHEMATIC .................................................................... 22 25
4.4 LOW SPEED ELECTRICAL SPECIFICATION ............................................................................................................................. 26 26
4.4.1 TWI Logic Levels and Bus Loading .............................................................................................................................. 26 27
4.5 MANAGEMENT INTERFACE ..................................................................................................................................................... 27 28
4.5.1 Management Interface Timing Specification ............................................................................................................... 28 29
4.5.2 TWI Bus Pull Up Resistor ............................................................................................................................................... 28 30
4.5.3 Timing for soft control and status functions ................................................................................................................. 31 31
4.6 HIGH SPEED ELECTRICAL SPECIFICATION ............................................................................................................................ 34 32
4.6.1 Rx(n)(p/n) .......................................................................................................................................................................... 34 33
4.6.2 Tx(n)(p/n) .......................................................................................................................................................................... 34 34
4.7 POWER REQUIREMENTS ........................................................................................................................................................ 35 35
4.7.1 Power Classes and Maximum Power Consumption .................................................................................................. 35 36
4.7.2 Host Board Power Supply Filtering ............................................................................................................................... 36 37
4.7.3 Module Power Supply Specification ............................................................................................................................. 36 38
4.7.4 Host Board Power Supply Noise Output ...................................................................................................................... 38 39
4.7.5 Module Power Supply Noise Output ............................................................................................................................. 39 40
4.7.6 Module Power Supply Noise Tolerance Methods ...................................................................................................... 40 41
4.7.6.1 Module Power Supply Noise Tolerance with OpAmp ........................................................................................................... 40 42
4.7.6.2 Module Power Supply Noise Tolerance with Commercial Injector Probe .......................................................................... 42 43
4.8 ESD ........................................................................................................................................................................................ 44 44
4.9 CLOCKING CONSIDERATIONS ................................................................................................................................................. 44 45
4.9.1 Data Path Description ..................................................................................................................................................... 44 46
4.9.2 TX Clocking Considerations .......................................................................................................................................... 44 47
4.9.3 Rx Clocking Considerations ........................................................................................................................................... 44 48
5 OPTICAL PORT MAPPING AND OPTICAL INTERFACES .......................................................................................... 45 49
5.1 ELECTRICAL DATA INPUT/OUTPUT TO OPTICAL PORT MAPPING ............................................................................................. 45 50
5.2 OPTICAL INTERFACES ............................................................................................................................................................ 45 51
Published Specifications QSFP-DD MSA Hardware Rev 7.1
© QSFP-DD MSA
Page 5 June 25, 2024
5.2.1 MPO Optical Cable connections ................................................................................................................................... 48 1
5.2.2 Duplex LC Optical Cable connection ............................................................................................................................ 51 2
5.2.3 Dual CS Optical Cable connection ............................................................................................................................... 51 3
5.2.4 Quad SN Optical Cable connections ............................................................................................................................ 52 4
5.2.5 Quad MDC Optical Cable connection .......................................................................................................................... 52 5
5.2.6 Dual SN Optical Cable connections ............................................................................................................................. 53 6
5.2.7 Dual MDC Optical Cable connection ............................................................................................................................ 53 7
5.2.8 Dual Duplex LC Optical Cable connection .................................................................................................................. 54 8
5.2.9 Dual MPO-12 Optical Cable connection ...................................................................................................................... 55 9
5.3 MODULE COLOR CODING AND LABELING .............................................................................................................................. 56 10
6 QSFP-DD MECHANICAL AND BOARD DEFINITION ................................................................................................... 57 11
6.1 INTRODUCTION TO QSFP-DD/QSFP-DD800/QSFP-DD1600 MODULES ......................................................................... 57 12
6.2 DATUMS, DIMENSIONS AND COMPONENT ALIGNMENT.......................................................................................................... 59 13
6.3 MODULE FORM FACTORS FOR QSFP-DD/QSFP-DD800/QSFP-DD1600 ....................................................................... 61 14
6.4 MODULE FLATNESS AND ROUGHNESS .................................................................................................................................. 70 15
6.5 QSFP-DD MODULE PADDLE CARD DIMENSIONS NOTES ....................................................................................................... 71 16
6.6 MODULE EXTRACTION AND RETENTION FORCES .................................................................................................................. 73 17
6.7 QSFP-DD 2X1 STACKED ELECTRICAL CONNECTOR MECHANICAL ..................................................................................... 73 18
6.7.1 QSFP-DD 2x1 Connector and Cage host PCB layout ............................................................................................... 78 19
6.8 QSFP-DD SURFACE MOUNT ELECTRICAL CONNECTOR MECHANICAL ............................................................................... 81 20
6.8.1 QSFP-DD Surface mount connector and cage host PCB layout ............................................................................. 87 21
7 QSFP-DD800 MECHANICAL AND BOARD DEFINITION ............................................................................................. 89 22
7.1 INTRODUCTION ....................................................................................................................................................................... 89 23
7.2 QSFP-DD800 MODULE MECHANICAL DIMENSIONS .............................................................................................................. 89 24
7.3 QSFP-DD800 IMPROVED MODULE PADDLE CARD DIMENSIONS ........................................................................................... 94 25
7.4 QSFP-DD800 1X1 SMT CONNECTOR/CAGE ....................................................................................................................... 97 26
7.4.1 Surface mount connector and cage host PCB layout ................................................................................................ 97 27
7.5 2X1 SURFACE MOUNT TECHNOLOGY (SMT) CONNECTOR/CAGE ....................................................................................... 98 28
7.5.1 2x1 SMT Connector/Cage System ............................................................................................................................... 98 29
7.5.2 2x1 SMT Connector and Cage host PCB layout ...................................................................................................... 103 30
8 QSFP-DD1600 MECHANICAL AND BOARD DEFINITION......................................................................................... 107 31
8.1 INTRODUCTION ..................................................................................................................................................................... 107 32
8.2 QSFP-DD1600 MODULE MECHANICAL DIMENSIONS .......................................................................................................... 107 33
8.3 QSFP-DD1600 IMPROVED MODULE PADDLE CARD DIMENSIONS ...................................................................................... 109 34
8.4 QSFP-DD1600 1X1 SMT CONNECTOR/CAGE SYSTEM ..................................................................................................... 112 35
8.4.1 Surface mount connector and cage host PCB layout .............................................................................................. 112 36
8.4.2 QSFP-DD1600 Host Pad Assignment ....................................................................................................................... 113 37
8.4.3 QSFP-DD1600 Surface Mount Electrical Connector Mechanical .......................................................................... 114 38
8.4.4 QSFP-DD1600 Cage Flap ........................................................................................................................................... 115 39
8.5 2X1 SURFACE MOUNT TECHNOLOGY (SMT) CONNECTOR/CAGE ..................................................................................... 116 40
8.5.1 2x1 SMT Connector/Cage System ............................................................................................................................. 116 41
8.5.2 2x1 SMT Connector and Cage host PCB layout ...................................................................................................... 123 42
9 MODULE ENVIRONMENTAL AND THERMAL REQUIREMENTS ............................................................................. 126 43
9.1 THERMAL REQUIREMENTS ................................................................................................................................................... 126 44
9.2 THERMAL REQUIREMENTS – TIGHTER CONTROLLED ENVIRONMENTS ................................................................................ 126 45
9.3 EXTERNAL CASE AND HANDLE TOUCH TEMPERATURE ...................................................................................................... 126 46
9.4 SUPPLEMENTAL THERMAL CHARACTERISTICS FOR HIGH POWER MODULES (OPTIONAL) .................................................. 127 47
9.4.1 Example procedure to implement high power module monitoring ......................................................................... 127 48
APPENDIX A NORMATIVE MODULE AND CONNECTOR PERFORMANCE REQUIREMENTS ............................... 129 49
A.1 QSFP-DD/QSFP-DD800/QSFP-DD1600 PERFORMANCE TABLES ............................................................................... 129 50
剩余156页未读,继续阅读
资源评论
bingyuxxlove
- 粉丝: 6
- 资源: 6
上传资源 快速赚钱
- 我的内容管理 展开
- 我的资源 快来上传第一个资源
- 我的收益 登录查看自己的收益
- 我的积分 登录查看自己的积分
- 我的C币 登录后查看C币余额
- 我的收藏
- 我的下载
- 下载帮助
最新资源
- 淘宝客项目,支持App,微信小程序,QQ小程序.zip
- 第16课作业周旭.iml
- 海风小店,商城,微信小开源程序商城服务器端.zip
- 技术资料分享uCOS-II原理3很好的技术资料.zip
- 【java毕业设计】食品安全管理系统源码(springboot+vue+mysql+说明文档+LW).zip
- 海风小店,商城,微信小开源程序商城管理后台,后台管理,VUE.zip
- 【java毕业设计】流浪动物救助平台源码(springboot+vue+mysql+说明文档+LW).zip
- 技术资料分享uCOS-II原理2很好的技术资料.zip
- 流动图书馆微信小程序引入.zip
- 【java毕业设计】某大学外卖系统源码(springboot+前端+mysql+说明文档+LW).zip
资源上传下载、课程学习等过程中有任何疑问或建议,欢迎提出宝贵意见哦~我们会及时处理!
点击此处反馈
安全验证
文档复制为VIP权益,开通VIP直接复制
信息提交成功