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MSP432P401R, MSP432P401M
SLAS826F –MARCH 2015–REVISED MARCH 2017
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Product Folder Links: MSP432P401R MSP432P401M
Table of Contents Copyright © 2015–2017, Texas Instruments Incorporated
Table of Contents
1 Device Overview ......................................... 1
1.1 Features .............................................. 1
1.2 Applications........................................... 2
1.3 Description............................................ 2
1.4 Functional Block Diagram ............................ 3
2 Revision History ......................................... 5
3 Device Comparison ..................................... 6
3.1 Related Products ..................................... 7
4 Terminal Configuration and Functions.............. 8
4.1 Pin Diagrams ......................................... 8
4.2 Pin Attributes ........................................ 11
4.3 Signal Descriptions.................................. 17
4.4 Pin Multiplexing ..................................... 27
4.5 Buffer Types......................................... 27
4.6 Connection for Unused Pins ........................ 27
5 Specifications........................................... 28
5.1 Absolute Maximum Ratings ........................ 28
5.2 ESD Ratings ........................................ 28
5.3 Recommended Operating Conditions............... 28
5.4 Recommended External Components ............. 29
5.5 Operating Mode V
CC
Ranges ....................... 29
5.6 Operating Mode CPU Frequency Ranges ......... 30
5.7 Operating Mode Peripheral Frequency Ranges .... 30
5.8 Operating Mode Execution Frequency vs Flash
Wait-State Requirements ........................... 31
5.9 Current Consumption During Device Reset......... 31
5.10 Current Consumption in LDO-Based Active
Modes – Dhrystone 2.1 Program ................... 31
5.11 Current Consumption in DC-DC-Based Active
Modes – Dhrystone 2.1 Program ................... 32
5.12 Current Consumption in Low-Frequency Active
Modes – Dhrystone 2.1 Program ................... 32
5.13 Typical Characteristics of Active Mode Currents for
CoreMark Program.................................. 33
5.14 Typical Characteristics of Active Mode Currents for
Prime Number Program............................. 34
5.15 Typical Characteristics of Active Mode Currents for
Fibonacci Program .................................. 35
5.16 Typical Characteristics of Active Mode Currents for
While(1) Program ................................... 36
5.17 Typical Characteristics of Low-Frequency Active
Mode Currents for CoreMark Program.............. 37
5.18 Current Consumption in LDO-Based LPM0 Modes. 38
5.19 Current Consumption in DC-DC-Based LPM0
Modes ............................................... 38
5.20 Current Consumption in Low-Frequency LPM0
Modes ............................................... 38
5.21 Current Consumption in LPM3, LPM4 Modes ...... 39
5.22 Current Consumption in LPM3.5, LPM4.5 Modes .. 39
5.23 Current Consumption of Digital Peripherals ........ 40
5.24 Thermal Resistance Characteristics ................ 40
5.25 Timing and Switching Characteristics ............... 41
6 Detailed Description ................................... 90
6.1 Overview ............................................ 90
6.2 Processor and Execution Features ................. 90
6.3 Memory Map ........................................ 91
6.4 Memories on the MSP432P401x .................. 111
6.5 DMA................................................ 114
6.6 Memory Map Access Details ...................... 115
6.7 Interrupts........................................... 117
6.8 System Control..................................... 119
6.9 Peripherals......................................... 124
6.10 Code Development and Debug .................... 134
6.11 Performance Benchmarks ......................... 136
6.12 Input/Output Diagrams ............................. 138
6.13 Device Descriptors (TLV) .......................... 176
6.14 Identification........................................ 178
7 Applications, Implementation, and Layout ...... 180
7.1 Device Connection and Layout Fundamentals .... 180
7.2 Peripheral and Interface-Specific Design
Information ......................................... 181
8 Device and Documentation Support.............. 183
8.1 Getting Started and Next Steps ................... 183
8.2 Device and Development Tool Nomenclature ..... 183
8.3 Tools and Software ................................ 184
8.4 Documentation Support............................ 186
8.5 Related Links ...................................... 187
8.6 Community Resources............................. 188
8.7 Trademarks ........................................ 188
8.8 Electrostatic Discharge Caution ................... 188
8.9 Export Control Notice .............................. 188
8.10 Glossary............................................ 188
9 Mechanical, Packaging, and Orderable
Information............................................. 188