80-36-03437
Table of Contents
SanDisk iNAND eMMC 4.3 I/F Draft Data Sheet
© 2010 SanDisk Corporation 3 80-36-03437
TABLE OF CONTENTS
1. Introduction ...........................................................................................................................5
1.1. General Description........................................................................................................5
1.2. Plug-and-Play Integration...............................................................................................5
1.3. Features Overview......................................................................................................... 6
1.4. Functional Description....................................................................................................7
1.5. Technology Independence.............................................................................................7
1.6. Defect and Error Management.......................................................................................7
1.7. Boot................................................................................................................................8
1.8. Reliable Write.................................................................................................................8
1.9. Automatic Sleep Mode ...................................................................................................8
1.10. Sleep (CMD5).................................................................................................................8
1.11. MMC bus and Power Lines ............................................................................................8
1.11.1. Bus operating conditions ................................................................................................. 9
2. Product Specifications .......................................................................................................10
2.1. Typical Power Requirements. ......................................................................................10
2.2. Operating Conditions....................................................................................................10
2.2.1. Operating and Storage Temperature Specifications ..................................................... 10
2.2.2. Moisture Sensitivity........................................................................................................ 10
2.3. System Performance....................................................................................................11
Physical Specifications..........................................................................................................12
3. Interface Description ..........................................................................................................14
3.1. MMC I/F Ball Array.......................................................................................................14
3.2. Pins and Signal Description .........................................................................................15
3.3. iNAND Registers..........................................................................................................16
3.3.1. OCR Register................................................................................................................. 16
3.3.2. CID Register .................................................................................................................. 16
3.3.3. DSR Register................................................................................................................. 16
3.3.4. CSD Register................................................................................................................. 17
3.3.5. EXT_CSD Register........................................................................................................ 18
4. Power Delivery and Capacitor Specifications..................................................................20
4.1. SanDisk iNAND Power Domains..................................................................................20
4.2. Capacitor Connection Guidelines.................................................................................20
4.2.1. VDDi Connections .........................................................................................................20
4.2.2. VCC and VCCQ Connections........................................................................................ 20
5. Marking ................................................................................................................................22
jack5588liu2702012-08-05下载了，未使用
chmem2018-03-20很好的资料，谢谢分享
