AP6
275S
Datasheet
保存期限:最新版本 C-RD-047C
PRODUCT NAME:AP6275S
REVISION:0.1
DATE:July 04
th
, 2018
正基科技股份有限公司
SPECIFICATION
Customer APPROVED
Company
Representative
Signature
PREPARED
REVIEW
APPROVED DCC ISSUE
PM QA
Address:
No.1 Ren Ai Rd, Hsinchu Industrial Park, Hukou, Hsinchu, Taiwan, 3052
Website:
http://www.ampak.com.tw
AP6275S
Data Sheet
AP6
275S
Datasheet
i
AMPAK Technology Inc
.
No.1 Ren Ai Rd, Hsinchu Industrial Park, Hukou, Hsinchu, Taiwan, 3052
http://www.ampak.com.tw
Revision
Revision Date Description
Revised By
0.1 2017/07/04 - Preliminary Richard
AP6
275S
Datasheet
ii
AMPAK Technology Inc
.
No.1 Ren Ai Rd, Hsinchu Industrial Park, Hukou, Hsinchu, Taiwan, 3052
http://www.ampak.com.tw
Contents
1. Introduction ........................................................................................................... 2
1.1 Overview .......................................................................................................... 2
1.2 Product Features................................................................................................ 3
2. General Specification ............................................................................................... 4
2.1 General Specification ....................................................................................... 4
2.2 DC Characteristics ........................................................................................... 4
2.2.1 Absolute Maximum Ratings ...................................................................... 4
2.2.2 Recommended Operating Rating .............................................................. 4
3. Wi-Fi RF Specification(TBD) ...................................................................................... 5
3.1 2.4GHz RF Specification ................................................................................... 5
4.2 5GHz RF Specification ...................................................................................... 7
4. Bluetooth Specification(TBD) .................................................................................. 13
4.1 Bluetooth Specification .................................................................................. 13
5. Pin Definition ........................................................................................................ 14
5.1 Pin Outline ................................................................................................... 14
5.2 Pin Assignment ............................................................................................. 14
6. Dimensions........................................................................................................... 16
6.1 Module Dimensions ...................................................................................... 16
6.2 Recommended footprint ................................................................................ 17
7. External clock reference ......................................................................................... 18
7.1 SDIO Pin Description ................................................................................. 18
8. Host Interface Timing Diagram ............................................................................... 19
8.1 Power-up Sequence Timing Diagram ............................................................... 19
8.2 SDIO Default Mode Timing Diagram .......................................................... 21
8.3 SDIO Bus Timing Specifications in SDR Modes ......................................... 22
8.4 SDIO Bus Timing Specifications in DDR50 Mode ...................................... 24
9. Recommended Reflow Profile ................................................................................. 26
10. Package Information .............................................................................................. 27
10.1 Label .......................................................................................................... 27
10.2 Dimension .................................................................................................. 28
10.3 MSL Level / Storage Condition ...................................................................... 30
AP6
275S
Datasheet
2
AMPAK Technology Inc
.
No.1 Ren Ai Rd, Hsinchu Industrial Park, Hukou, Hsinchu, Taiwan, 3052
http://www.ampak.com.tw
1. Introduction
1.1 Overview
The AMPAK Technology® AP6275S is a fully Wi-Fi and Bluetooth functionalities module with seamless
roaming capabilities and advance security, also it could interact with different vendors’
802.11a/b/g/n/ac/ax 2x2 Access Points with MIMO standard and can accomplish up to speed of 1200Mbps
with dual stream. Furthermore AP6275S included SDIO interface for Wi-Fi, UART/ PCM interface for
Bluetooth.
In addition, this compact module is a total solution for a combination of Wi-Fi + BT technologies. The
module is specifically developed for tablet, OTT box and portable devices.
AP6275S SIP Module
评论11