GigaDevice Semiconductor Inc.
GD32F103xx
ARM
®
Cortex
™
-M3 32-bit MCU
Datasheet
GD32F103xx
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Table of Contents
Table of Contents........................................................................................................................ 1
List of Figures ............................................................................................................................. 3
List of Tables ............................................................................................................................... 4
1 General description ......................................................................................................... 5
2 Device overview ............................................................................................................... 6
2.1 Device information .............................................................................................................................. 6
2.2 Block diagram ...................................................................................................................................... 9
2.3 Pinouts and pin assignment ............................................................................................................ 12
2.4 Memory map ...................................................................................................................................... 16
2.5 Clock tree ........................................................................................................................................... 17
2.6 Pin definitions .................................................................................................................................... 18
3 Functional description .................................................................................................. 26
3.1 ARM
®
Cortex™-M3 core .................................................................................................................. 26
3.2 On-chip memory ................................................................................................................................ 26
3.3 Clock, reset and supply management ........................................................................................... 27
3.4 Boot modes ........................................................................................................................................ 27
3.5 Power saving modes ........................................................................................................................ 28
3.6 Analog to digital converter (ADC) ................................................................................................... 28
3.7 Digital to analog converter (DAC) ................................................................................................... 29
3.8 DMA .................................................................................................................................................... 29
3.9 General-purpose inputs/outputs (GPIOs) ...................................................................................... 29
3.10 Timers and PWM generation ........................................................................................................... 30
3.11 Real time clock (RTC) ...................................................................................................................... 31
3.12 Inter-integrated circuit (I2C) ............................................................................................................. 31
3.13 Serial peripheral interface (SPI) ...................................................................................................... 32
3.14 Universal synchronous asynchronous receiver transmitter (USART) ....................................... 32
3.15 Inter-IC sound (I2S) .......................................................................................................................... 32
3.16 Secure digital input and output card interface (SDIO) ................................................................. 33
3.17 Universal serial bus full-speed (USBD) ......................................................................................... 33
3.18 Controller area network (CAN) ........................................................................................................ 33
3.19 External memory controller (EXMC) .............................................................................................. 33
3.20 Debug mode ...................................................................................................................................... 34
3.21 Package and operation temperature .............................................................................................. 34
4 Electrical characteristics .............................................................................................. 35
4.1 Absolute maximum ratings .............................................................................................................. 35
4.2 Recommended DC characteristics ................................................................................................. 35
4.3 Power consumption .......................................................................................................................... 36
4.4 EMC characteristics .......................................................................................................................... 37
4.5 Power supply supervisor characteristics ....................................................................................... 37
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4.6 Electrical sensitivity........................................................................................................................... 38
4.7 External clock characteristics .......................................................................................................... 38
4.8 Internal clock characteristics ........................................................................................................... 39
4.9 PLL characteristics ........................................................................................................................... 40
4.10 Memory characteristics .................................................................................................................... 40
4.11 GPIO characteristics ......................................................................................................................... 40
4.12 ADC characteristics .......................................................................................................................... 41
4.13 DAC characteristics .......................................................................................................................... 41
4.14 I2C characteristics ............................................................................................................................ 41
4.15 SPI characteristics ............................................................................................................................ 42
5 Package information ..................................................................................................... 43
5.1 QFN package outline dimensions .................................................................................................. 43
5.2 LQFP package outline dimensions ................................................................................................ 44
6 Ordering Information ..................................................................................................... 46
7 Revision History ............................................................................................................. 48
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List of Figures
Figure 1. GD32F103x4/6/8/B block diagram ........................................................................................................ 9
Figure 2. GD32F103xC/D/E block diagram ........................................................................................................ 10
Figure 3. GD32F103xF/G/I/K block diagram ...................................................................................................... 11
Figure 4. GD32F103Zx LQFP144 pinouts .......................................................................................................... 12
Figure 5. GD32F103Vx LQFP100 pinouts .......................................................................................................... 13
Figure 6. GD32F103Rx LQFP64 pinouts ............................................................................................................ 14
Figure 7. GD32F103Cx LQFP48 pinouts ............................................................................................................ 15
Figure 8. GD32F103Tx QFN36 pinouts ............................................................................................................... 15
Figure 9. GD32F103xx memory map................................................................................................................... 16
Figure 10. GD32F103xx clock tree ...................................................................................................................... 17
Figure 11. QFN package outline ........................................................................................................................... 43
Figure 12. LQFP package outline ........................................................................................................................ 44
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List of Tables
Table 1. GD32F103xx devices features and peripheral list ............................................................................. 6
Table 2. GD32F103xx pin definitions .................................................................................................................. 18
Table 3. Absolute maximum ratings ................................................................................................................... 35
Table 4. DC operating conditions ........................................................................................................................ 35
Table 5. Power consumption characteristics ................................................................................................... 36
Table 6. EMS characteristics ................................................................................................................................ 37
Table 7. EMI characteristics .................................................................................................................................. 37
Table 8 Power supply supervisor characteristics ........................................................................................... 37
Table 9. ESD characteristics ................................................................................................................................. 38
Table 10. Static latch-up characteristics ........................................................................................................... 38
Table 11. High Speed crystal oscillator (HXTAL) generated from a crystal/ceramic characteristics 38
Table 12. Low Speed crystal oscillator (LXTAL) generated from a crystal/ceramic characteristics . 39
Table 13. Internal 8 MHz RC oscillator (IRC8M) characteristics .................................................................. 39
Table 14. Internal 40KHz RC oscillator (IRC40K) characteristics ................................................................ 39
Table 15. PLL characteristics ............................................................................................................................... 40
Table 16. Flash memory characteristics ............................................................................................................ 40
Table 17. I/O port characteristics ......................................................................................................................... 40
Table 18. ADC characteristics .............................................................................................................................. 41
Table 19. DAC characteristics .............................................................................................................................. 41
Table 20. I2C characteristics................................................................................................................................. 41
Table 21. SPI characteristics ................................................................................................................................ 42
Table 22. QFN package dimensions ................................................................................................................... 43
Table 23. LQFP package dimensions ................................................................................................................. 45
Table 24. Part ordering code for GD32F103xx devices .................................................................................. 46
Table 25. Revision history ..................................................................................................................................... 48
