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GL3224 USB3.1 Gen1 CardReader Controller.pdf
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2020-11-04
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不知道大家有没有注意到现在SD卡都到SD7.1的版本了。从最早我知道的SD,SDHC,SDXC,SD3.0,SD4.0等,每一代技术更新都是容量和速度的提升。创惟能支持或匹配的读卡器方案,有多盘符和单盘符系列,10年前很流行多盘符多种类卡的应用,不管什么类型的卡插上去电脑都能读写,实现数据同步,交换。而现在,也只有单盘符的应用,因为可使用的卡类型少了,很多卡都被淘汰,如XD,M2,MS等。如果SD7.1价格降下来,估计现在的SD4.0也没它什么事了。SD7.1是PCIe的协议,速度和容量都可以做到极致。这要普及应用下来,也可能需要几年时间。只闻其,不见其物,需要深入聊解,私聊我。
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GL3224
USB 3.1 Gen 1 Dual/Single LUN
Memory Card Reader Controller
Datasheet
Revision 1.10
Jan. 04, 2019
Genesys Logic, Inc.
GL3224 Datasheet
© 2019 Genesys Logic, Inc. - All rights reserved. Page 2
GLI Confidential
Copyright
Copyright © 2019 Genesys Logic, Inc. All rights reserved. No part of the materials shall be reproduced in any
form or by any means without prior written consent of Genesys Logic, Inc.
Ownership and Title
Genesys Logic, Inc. owns and retains of its right, title and interest in and to all materials provided herein.
Genesys Logic, Inc. reserves all rights, including, but not limited to, all patent rights, trademarks, copyrights and
any other propriety rights. No license is granted hereunder.
Disclaimer
All Materials are provided “as is”. Genesys Logic, Inc. makes no warranties, express, implied or otherwise,
regarding their accuracy, merchantability, fitness for any particular purpose, and non-infringement of intellectual
property. In no event shall Genesys Logic, Inc. be liable for any damages, including, without limitation, any
direct, indirect, consequential, or incidental damages. The materials may contain errors or omissions. Genesys
Logic, Inc. may make changes to the materials or to the products described herein at anytime without notice.
Genesys Logic, Inc.
12F., No. 205, Sec. 3, Beixin Rd., Xindian Dist. 231,
New Taipei City, Taiwan
Tel : (886-2) 8913-1888
Fax : (886-2) 6629-6168
http ://www.genesyslogic.com
Shenzhen Office
Hong Kong TWG Electronics Co., Ltd.
Contact: Stephen
Email: Stephen@twg-hk.com
V/M: +13692176249 Q 327857878
GL3224 Datasheet
© 2019 Genesys Logic, Inc. - All rights reserved. Page 3
GLI Confidential
Revision History
Revision
Date
Description
1.00
01/14/2014
First formal release
1.01
01/15/2014
1. Remove CF, xD description in Chapter.2 p.7
2. Modify pin description in p.14
1.02
06/18/2014
Update SPI FLASH MEMORY SUPPORT LIST in Ch6, p22.
1.03
06/24/2014
Revise PACKAGE DIMENSION in Ch7, p23,24
1.04
05/07/2015
Modify Ch2 Features
1.05
08/05/2015
Update Table 5.4 Reset Timing, p.20
1.06
10/21/2015
Update CH7 Package Dimension, p.23,24
1.07
05/03/2016
Update CH2 Features
1.08
07/21/2017
Update CH6 SPI Flash Memory Support List
1.09
07/20/2018
1. Rename USB 3.0 to USB 3.1 Gen 1
2. Update CH1 General Description
3. Update CH2 Features
4. Update Table 3.1 - QFN48 Pin Description
5. Remove Table 5.6 - e•MMC Clock Frequency
1.10
01/04/2019
Update CH2 Features
GL3224 Datasheet
© 2019 Genesys Logic, Inc. - All rights reserved. Page 4
GLI Confidential
Table of Contents
CHAPTER 1 GENERAL DESCRIPTION .......................................................................... 6
CHAPTER 2 FEATURES...................................................................................................... 7
CHAPTER 3 PIN ASSIGNMENT ........................................................................................ 9
3.1 QFN 48 Pinout ........................................................................................................... 9
3.2 QFN 32 Pinout ......................................................................................................... 10
3.3 Pin Description ........................................................................................................ 11
CHAPTER 4 BLOCK DIAGRAM ..................................................................................... 16
4.1 Super Speed and HS/FS PHY ................................................................................ 17
4.2 USB Controller ........................................................................................................ 17
4.3 EPFIFO .................................................................................................................... 17
4.4 MCU ......................................................................................................................... 17
4.5 MHE (Media Hardware Engine) ........................................................................... 17
4.6 Regulator ................................................................................................................. 17
CHAPTER 5 ELECTRICAL CHARACTERISTICS ...................................................... 18
5.1 Temperature Conditions ......................................................................................... 18
5.2 Operating Conditions ............................................................................................. 18
5.3 DC Characteristics .................................................................................................. 18
5.4 AC Characteristics of Reset Timing ...................................................................... 19
5.4.1 Reset Timing ..................................................................................................... 19
5.4.2 SD/MMC Card Clock Frequency ................................................................... 20
5.4.3 MS Card Clock Frequency ............................................................................. 21
CHAPTER 6 SPI FLASH MEMORY SUPPORT LIST ................................................... 22
CHAPTER 7 PACKAGE DIMENSION ............................................................................ 23
CHAPTER 8 ORDERING INFORMATION .................................................................... 25
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