JEDEC
STANDARD
Semiconductor Wafer and Die
Backside External Visual Inspection
JESD22-B118A
Revision of JESD22-B118, March 2011, Reaffirmed, June 2016
NOVEMBER 2021
JEDEC SOLID STATE TECHNOLOGY ASSOCIATION
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JEDEC Standard No. 22-B118A
Page 1
Test Method B118A
(Revision of B118)
TEST METHOD B118A
SEMICONDUCTOR WAFER AND DIE BACKSIDE EXTERNAL VISUAL INSPECTION
(From JEDEC Board Ballot JCB-21-62, formulated under the cognizance of the JC-14.1 Subcommittee
on Reliability Test methods for Packaged Devices.)
1 Scope
Semiconductor wafer and die backside external visual inspection is an examination of the external non-
active surface area (hereafter called backside) of processed semiconductor wafers or die. This inspection
method is for product semiconductor wafers and dice prior to assembly. This test method defines the
requirements to execute a standardized external visual inspection and is a non-invasive and non-
destructive examination that can be used for qualification, quality monitoring, and lot acceptance.
Alternate methods of inspection or techniques that provide assurance to Clause 6 elements are acceptable
(e.g., functional testing, automated inspection equipment, in-line manufacturing operations, etc.).
This test method is applicable to:
• Backside inspection of semiconductor wafers and die. Wafers and die sampled for external visual
inspection must be representative of final product.
This test method does not apply to or require any inspection, measurement, or analysis other than the
procedure described in clause 5.0. Recommended tools and equipment for this test method are presented
in clause 4.0; use of substitute tools or equipment to perform this test method is acceptable provided
correlated results are obtained.
2 Terms and definitions
arc: A visual anomaly that is a curved scratch.
blemish: A visual anomaly that is an area of inconsistent finish.
burn mark: A visual anomaly with a burned appearance.
chip out: Damage resulting from a volume of material being removed by mechanical impact.
crack (in a wafer or die): A fracture within the bulk material of a wafer or die.
critical area
: An area of the wafer or die for which the inspection criteria is more stringent.
NOTE The critical area should be stipulated by the appropriate drawing or specification.
dice:
Plural of "die".
diced wafer: A wafer that has been separated into individual dice.
