IEC 61760 全系列 - Surface mounting technology - 包含全部5份完整英文版文件 .rar

IEC 61760 全系列 - Surface mounting technology（表面贴装技术） - 包含全部5份完整英文版文件: 1，IEC 61760-1：2020 Surface mounting technology - Part 1：Standard method for the specification of surface mounting components(SMDs) 2，IEC 61760-2：2021 Surface mounting technology - Part 2：Transportation and storage conditions of surface mounting devices{SMD) - Application guide 3，IEC 61760-3：2021 Surface mounting technology - Part 3：Standard method for the specification of components for through-hole reflow (THR) soldering 4，IEC TR 61760-3-1：2022 Surface mounting technology - Part 3-1：Standard method for the specification of components for through hole reflow soldering - Guidelines for through hole diameter design with solder paste surface printing method 5，IEC 61760-4：2018 Surface mounting technology - Part 4：Classification, packaging, labelling and handling of moisture sensitive devices