IEC 60068-2-58
Edition 4.1 2017-07
CONSOLIDATED
VERSION
Environmental testing –
Part 2-58: Tests – Test Td: Test methods for solderability, resistance to
dissolution of metallization and to soldering heat of surface mounting devices
(SMD)
IEC 60068-2-58:2015-03+AMD1:2017-07 CSV(en)
®
colour
inside
IEC 60068-2-58
Edition 4.1 2017-07
CONSOLIDATED
VERSION
Environmental testing –
Part 2-58: Tests – Test Td: Test methods for solderability, resistance to
dissolution of metallization and to soldering heat of surface mounting devices
(SMD)
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 19.040; 31.190
ISBN 978-2-8322-4676-4
® Registered trademark of the International Electrotechnical Commission
®
Warning! Make sure that you obtained this publication from an authorized distributor.
colour
inside
IEC 60068-2-58
Edition 4.1 2017-07
REDLINE VERSION
Environmental testing –
Part 2-58: Tests – Test Td: Test methods for solderability, resistance to
dissolution of metallization and to soldering heat of surface mounting devices
(SMD)
IEC 60068-2-58:2015-03+AMD1:2017-07 CSV(en)
®
colour
inside
– 2 – IEC 60068-2-58:2015+AMD1:2017 CSV
© IEC 2017
CONTENTS
FOREWORD ........................................................................................................................... 5
1 Scope .............................................................................................................................. 7
2 Normative references ...................................................................................................... 7
3 Terms and definitions ...................................................................................................... 8
4 Grouping of soldering processes and related test severities ............................................ 9
5 Test equipment .............................................................................................................. 10
5.1 Solder bath ........................................................................................................... 10
5.2 Reflow equipment ................................................................................................. 10
6 Test Td
1
: Solderability of terminations ........................................................................... 11
6.1 Object and general description of the test ............................................................. 11
6.2 Specimen preparation ........................................................................................... 11
6.3 Accelerated ageing ............................................................................................... 11
6.4 Initial measurements ............................................................................................. 11
6.5 Method 1: Solder bath ........................................................................................... 11
Solder bath .................................................................................................... 11 6.5.1
Solder and flux .............................................................................................. 11 6.5.2
Test procedure and conditions ....................................................................... 12 6.5.3
6.6
Method 2: Reflow .................................................................................................. 14
Reflow equipment .......................................................................................... 14 6.6.1
Solder paste .................................................................................................. 14 6.6.2
Test substrates .............................................................................................. 14 6.6.3
Test procedure .............................................................................................. 14 6.6.4
Reflow temperature profile for Test Td
1
......................................................... 15 6.6.5
Test conditions .............................................................................................. 16 6.6.6
7
Test Td
2
: Resistance to soldering heat .......................................................................... 16
7.1 Object and general description of the test ............................................................. 16
7.2 Specimen preparation ........................................................................................... 16
7.3 Preconditioning ..................................................................................................... 16
7.4 Initial measurements ............................................................................................. 16
7.5 Method 1: Solder bath ........................................................................................... 17
Solder bath .................................................................................................... 17 7.5.1
Solder and flux .............................................................................................. 17 7.5.2
Test procedure and conditions ....................................................................... 17 7.5.3
7.6
Method 2: Reflow .................................................................................................. 19
Reflow equipment .......................................................................................... 19 7.6.1
Solder paste .................................................................................................. 19 7.6.2
Test substrates .............................................................................................. 19 7.6.3
Test procedure and conditions ....................................................................... 19 7.6.4
8
Test Td
3
: Dewetting and resistance to dissolution of metallization ................................. 21
8.1 Object and general description of the test ............................................................. 21
8.2 Specimen preparation ........................................................................................... 21
8.3 Initial measurements ............................................................................................. 22
8.4 Method 1: Solder bath ........................................................................................... 22
Solder bath .................................................................................................... 22 8.4.1
Solder and flux .............................................................................................. 22 8.4.2
IEC 60068-2-58:2015+AMD1:2017 CSV – 3 –
© IEC 2017
Test procedure and conditions ....................................................................... 22 8.4.3
8.5
Method 2: Reflow .................................................................................................. 22
Reflow equipment .......................................................................................... 22 8.5.1
Specimen ...................................................................................................... 22 8.5.2
Solder paste .................................................................................................. 22 8.5.3
Flux ............................................................................................................... 22 8.5.4
Reflow profile ................................................................................................ 22 8.5.5
Placement of the specimen ............................................................................ 23 8.5.6
Application of the reflow profile ...................................................................... 23 8.5.7
Evaluation ..................................................................................................... 23 8.5.8
9
Final measurements ...................................................................................................... 23
9.1 Flux removal ......................................................................................................... 23
9.2 Recovery conditions .............................................................................................. 23
9.3 Evaluation ............................................................................................................. 23
Wetting .......................................................................................................... 23 9.3.1
Dewetting ...................................................................................................... 24 9.3.2
Resistance to soldering heat .......................................................................... 25 9.3.3
Resistance to dissolution of metallization....................................................... 25 9.3.4
10
Information to be given in the relevant specification ....................................................... 25
10.1 General ................................................................................................................. 25
10.2 Solderability .......................................................................................................... 25
10.3 Resistance to soldering heat, dewetting and resistance to dissolution of
metallization ......................................................................................................... 26
Annex A (normative) Criteria for visual examination ............................................................. 27
A.1 Evaluation of wetting ............................................................................................. 27
A.1.1 General ......................................................................................................... 27
A.1.2 Evaluation of Criteria for wetting .................................................................... 27
A.1.3 Evaluation of method 2 (Td
1
) Additional criteria for wetting, method 2 ........... 28
A.2 Evaluation of dewetting, method 2 ........................................................................ 29
Annex B (informative) Guidance ........................................................................................... 31
B.1 General ................................................................................................................. 31
B.2 Limitations ............................................................................................................ 31
B.3 Choice of severity ................................................................................................. 31
B.3.1 Test Td
1
: Solderability by solder bath method ............................................... 31
B.3.2 Test Td
2
: Resistance to soldering heat – Solder bath method ........................ 32
B.3.3 Test Td
2
: Resistance to soldering heat –Reflow method ................................ 32
B.3.4 Immersion attitude ......................................................................................... 33
B.3.5 Test Td
3
: Dewetting and resistance to dissolution of metallization for
30 s at 260 °C ............................................................................................... 33
Annex C (normative) Application of the test methods to through hole reflow soldering
components (THR) ................................................................................................................ 34
C.1 Solderability .......................................................................................................... 34
C.2 Resistance to soldering heat ................................................................................. 34
C.3 Dewetting ............................................................................................................. 34
C.4 Criteria for evaluation ........................................................................................... 34
Annex X (informative) Cross reference for references to the prior revision of this
specification.......................................................................................................................... 35
Bibliography .......................................................................................................................... 37
