IEC 60068-2-69
Edition 3.1 2019-06
CONSOLIDATED
VERSION
VERSION
CONSOLIDÉE
Environmental testing –
Part 2-69: Tests – Test Te/Tc: Solderability testing of electronic components
and printed boards by the wetting balance (force measurement) method
Essais d'environnement –
Partie 2-69: Essais – Essai Te/Tc: Essai de brasabilité des composants
électroniques et cartes imprimées par la méthode de la balance de mouillage
(mesure de la force)
IEC 60068-2-69:2017-03+AMD1:2019-06 CSV(en-fr)
®
colour
inside
IEC 60068-2-69
Edition 3.1 2019-06
CONSOLIDATED
VERSION
VERSION
CONSOLIDÉE
Environmental testing –
Part 2-69: Tests – Test Te/Tc: Solderability testing of electronic components
and printed boards by the wetting balance (force measurement) method
Essais d'environnement –
Partie 2-69: Essais – Essai Te/Tc: Essai de brasabilité des composants
électroniques et cartes imprimées par la méthode de la balance de mouillage
(mesure de la force)
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 19.040; 31.190
ISBN 978-2-8322-7092-9
® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
®
Warning! Make sure that you obtained this publication from an authorized distributor.
Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.
colour
inside
IEC 60068-2-69
Edition 3.1 2019-06
REDLINE VERSION
VERSION REDLINE
Environmental testing –
Part 2-69: Tests – Test Te/Tc: Solderability testing of electronic components
and printed boards by the wetting balance (force measurement) method
Essais d'environnement –
Partie 2-69: Essais – Essai Te/Tc: Essai de brasabilité des composants
électroniques et cartes imprimées par la méthode de la balance de mouillage
(mesure de la force)
IEC 60068-2-69:2017-03+AMD1:2019-06 CSV(en-fr)
®
colour
inside
– 2 – IEC 60068-2-69:2017+AMD1:2019 CSV
© IEC 2019
CONTENTS
FOREWORD ........................................................................................................................... 5
1 Scope .............................................................................................................................. 7
2 Normative references ...................................................................................................... 7
3 Terms and definitions ...................................................................................................... 7
4 General description of the method ................................................................................... 8
4.1 General ................................................................................................................... 8
4.2 Components ........................................................................................................... 8
4.3 Printed boards ........................................................................................................ 8
4.4 Measurement .......................................................................................................... 8
5 Description of the test apparatus ..................................................................................... 8
6 Preparation of specimens .............................................................................................. 10
6.1 Cleaning ............................................................................................................... 10
6.2 Preconditioning ..................................................................................................... 10
7 Materials ....................................................................................................................... 11
7.1 Solder ................................................................................................................... 11
7.1.1 General ......................................................................................................... 11
7.1.2 Solder alloy containing lead ........................................................................... 11
7.1.3 Lead-free solder alloy .................................................................................... 11
7.1.4 Solder contamination control ......................................................................... 11
7.1.5 Solder mass for solder globule wetting balance method ................................. 12
7.2 Flux ...................................................................................................................... 13
7.2.1 Rosin based flux ............................................................................................ 13
7.2.2 Flux maintenance .......................................................................................... 13
7.2.3 Test flux selection criteria .............................................................................. 13
8 Procedure ...................................................................................................................... 13
8.1 Test temperature .................................................................................................. 13
8.1.1 Solder alloy containing lead ........................................................................... 13
8.1.2 Lead-free solder alloy .................................................................................... 13
8.2 Test procedure ...................................................................................................... 13
8.2.1 Applicable test procedure .............................................................................. 13
8.2.2 Solder bath wetting balance procedure .......................................................... 14
8.2.3
Solder globule wetting balance procedure...................................................... 17
8.2.4 Procedure for testing printed board specimens .............................................. 21
9 Presentation of results ................................................................................................... 24
9.1 Form of force versus time trace ............................................................................. 24
9.2 Test requirements ................................................................................................. 25
10 Information to be given in the relevant specification ....................................................... 25
Annex A (normative) Equipment specification ...................................................................... 26
A.1 Characteristics of the apparatus ............................................................................ 26
A.2 Solder bath ........................................................................................................... 26
A.3 Globule support blocks ......................................................................................... 27
Annex B (informative) Use of the wetting balance for SMD solderability testing.................... 28
B.1 Definition of the measure of solderability .............................................................. 28
B.2 Gauge R&R – Test protocol for wetting balance gauge repeatability and
reproducibility using copper foil coupons ............................................................... 28
IEC 60068-2-69:2017+AMD1:2019 CSV – 3 –
© IEC 2019
B.2.1
Test coupon ................................................................................................... 28
B.2.2 Test parameters ............................................................................................ 29
B.2.3 Known good coupon ...................................................................................... 29
B.3 Solder globule pellet mass and pin size ................................................................ 30
B.4 Specimen orientation and immersion depth ........................................................... 30
B.4.1 General ......................................................................................................... 30
B.4.2 Resistors and capacitors ............................................................................... 31
B.4.3 Small-leaded components .............................................................................. 31
B.4.4 Multi-leaded devices ...................................................................................... 31
B.5 Test flux ................................................................................................................ 32
B.6 Test temperature .................................................................................................. 33
B.6.1 Solder alloy containing lead ........................................................................... 33
B.6.2 Solder alloy without lead ................................................................................ 33
B.7 Characteristics of the test apparatus ..................................................................... 33
B.7.1 Recording device ........................................................................................... 33
B.7.2 Balance system ............................................................................................. 34
B.7.3 Lifting mechanism and controls ...................................................................... 34
B.7.4 Parameters to be measured from the force-time trace .................................... 39
B.7.5 Reference wetting force ................................................................................. 40
B.7.6 Equipment location ........................................................................................ 41
B.7.7 Globule pins .................................................................................................. 41
B.7.8 Globule modules ............................................................................................ 41
B.8 Test flux – IPC-J-STD-002/J-STD-003 activated solderability test flux
rationale committee letter ...................................................................................... 41
B.8.1 General ......................................................................................................... 41
B.8.2 Proactive solderability testing approach to the implementation of non-tin
finishes .......................................................................................................... 41
B.8.3 Reduced solderability test variability .............................................................. 42
B.8.4 Standardization of solderability test flux composition on a global scale .......... 42
Annex C (normative) Test methods for SMD components sizes 0603M (0201) or
smaller .................................................................................................................................. 43
C.1 General ................................................................................................................. 43
C.2 General description of the test method .................................................................. 43
C.3 Preconditioning ..................................................................................................... 43
C.3.1 Preparation of the specimens ........................................................................ 43
C.3.2 Ageing ........................................................................................................... 43
C.4 Materials ............................................................................................................... 43
C.4.1 Solder ............................................................................................................ 43
C.4.2 Flux ............................................................................................................... 44
C.5 Method 1............................................................................................................... 44
C.5.1 Description of the test apparatus ................................................................... 44
C.5.2 Procedures .................................................................................................... 44
C.5.3 Presentation of results ................................................................................... 47
C.5.4 Information to be given in the relevant specification ....................................... 48
C.6 Method 2............................................................................................................... 49
C.6.1 Test apparatus .............................................................................................. 49
C.6.2 Observation equipment .................................................................................. 49
C.6.3 Test method 2 ............................................................................................... 49
C.6.4 Presentation of results ................................................................................... 50
