datasheet
PRELIMINARY SPECIFICATION
1/3.06" color CMOS 13.2 megapixel (4224 x 3136) image sensor
with OmniBSI-3™ technology
OV13850
color CMOS 13.2 megapixel (4224 x 3136) image sensor with OmniBSI-3™ technology
OV13850
00Copyright ©2013 OmniVision Technologies, Inc. All rights reserved.
This document is provided “as is” with no warranties whatsoever, including any warranty of merchantability,
non-infringement, fitness for any particular purpose, or any warranty otherwise arising out of any proposal, specification,
or sample.
OmniVision Technologies, Inc. and all its affiliates disclaim all liability, including liability for infringement of any proprietary
rights, relating to the use of information in this document. No license, expressed or implied, by estoppel or otherwise, to
any intellectual property rights is granted herein.
The information contained in this document is considered proprietary to OmniVision Technologies, Inc. and all its
affiliates. This information may be distributed to individuals or organizations authorized by OmniVision Technologies, Inc.
to receive said information. Individuals and/or organizations are not allowed to re-distribute said information.
Trademark Information
OmniVision and the OmniVision logo are registered trademarks of OmniVision Technologies, Inc. OmniBSI-3 is a
trademark of OmniVision Technologies, Inc.
All other trademarks used herein are the property of their respective owners.
To learn more about OmniVision Technologies, visit www.ovt.com.
OmniVision Technologies is publicly traded on NASDAQ under the symbol OVTI.
color CMOS 13.2 megapixel (4224 x 3136) image sensor with OmniBSI-3™ technology
datasheet (COB)
PRELIMINARY SPECIFICATION
version 1.1
september 2013
09.18.2013 PRELIMINARY SPECIFICATION proprietary to OmniVision Technologies
i
ordering information
OV13850-G04A (color, chip probing, 200 µm
backgrinding, reconstructed wafer with good die)
00applications
cellular phones
PC multimedia
tablets
00features
1.12 µm x 1.12 µm pixel with OmniBSI-3™
technology
optical size of 1/3.06"
31.2° CRA for <6mm z-height
programmable controls for frame rate, mirror and flip,
cropping, and windowing
support for image sizes: 13.2MP (4224x3136),
10MP (16:9 - 4224x2376), 4K2K (3840x2160),
EIS 1080p (2112x1188), EIS 720p (1408x792), and
more
13.2MP at 30 fps
two-wire serial bus control (SCCB)
strobe output to control flash
8kbits of embedded one-time programmable (OTP)
memory
two on-chip phase lock loops (PLLs)
frame exposure mode for still image (with
mechanical shutter)
programmable controls: gain, exposure, frame rate,
image size, horizontal mirror, vertical flip, cropping,
and panning
image quality controls: defect pixel correction,
automatic black level calibration, lens shading
correction, and alternate row HDR
built-in temperature sensor
suitable for module size of 8.5 mm x 8.5 mm x <6mm
note pixel
performance shown are
target values. These
values are subject to
change based on real
measurements.
00key specifications (typical)
active array size: 4224x3136
power supply:
analog: 2.6 ~ 3.0V (2.8V nominal)
core: 1.14 ~ 1.26V (1.2V nominal)
I/O: 1.7 ~ 3.0V (1.8V or 2.8V nominal)
power requirements:
active: 223mW
standby: 300µW
XSHUTDOWN: 1µW
temperature range:
operating: -30°C to 85°C junction temperature
stable image: 0°C to 60°C junction temperature
output interfaces: up to 4-lane MIPI serial output
output formats: 10-bit RGB RAW
lens size: 1/3.06"
input clock frequency: 6 ~ 64 MHz
lens chief ray angle: 31.2°
sensitivity: TBD
max S/N ratio: TBD
dynamic range: TBD
pixel size: 1.12 µm x 1.12 µm
dark current: TBD
image area: 4815 µm x 3678.3 µm
die dimensions: 6210 µm x 5517 µm (COB),
6260 µm x 5567 µm (RW) (see section 8 for details)
note COB refers
to whole wafers with
known good die and
RW refers to singulated
good die on a
reconstructed wafer.
Die size differs between
COB and RW.
color CMOS 13.2 megapixel (4224 x 3136) image sensor with OmniBSI-3™ technology
OV13850
proprietary to OmniVision Technologies PRELIMINARY SPECIFICATION version 1.1
09.18.2013 PRELIMINARY SPECIFICATION proprietary to OmniVision Technologies
iii
00table of contents
1 signal descriptions 1-1
2 system level description 2-1
2.1 overview 2-1
2.2 architecture 2-1
2.3 format and frame 2-2
2.4 I/O control 2-3
2.5 MIPI interface 2-5
2.6 power management 2-6
2.6.1 power up sequence 2-6
2.6.2 power down sequence 2-9
2.7 reset 2-13
2.7.1 power ON reset generation 2-13
2.8 hardware and software standby 2-13
2.8.1 hardware standby 2-13
2.8.2 software standby 2-13
2.9 system clock control 2-15
2.9.1 PLL configuration 2-15
2.10 serial camera control bus (SCCB) interface 2-19
2.10.1 data transfer protocol 2-19
2.10.2 message format 2-20
2.10.3 read / write operation 2-20
2.10.4 SCCB timing 2-23
2.10.5 group write 2-24
2.11 hold 2-25
2.12 launch 2-25
2.12.1 launch mode 1 - quick manual launch 2-25
2.12.2 launch mode 2 - delay manual launch 2-26
2.12.3 launch mode 3 - quick auto launch 2-26
2.12.4 launch mode 4: delay auto launch 2-26
2.12.5 launch mode 5: repeat launch 2-26
3 block level description 3-1
3.1 pixel array structure 3-1
3.2 subsampling 3-2
3.3 alternate row HDR 3-2
评论0