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ADXL345 数字加速度计 ADXL345 是一款小型、薄型、超低功率的 3 轴数字加速度计，具有高分辨率（13 位）测量能力，最高可达 ±16 g。该器件的数字输出数据以 16 位补码形式提供，通过 SPI（3 线或 4 线）或 I2C 数字接口访问。关键特性 1. 超低功率：在测量模式下功率尽量低达 23 µA，在待机模式下功率仅 0.1 µA（典型值），主要适用于电池供电设备。 2. 自动功率调整：功率消耗根据带宽自动调整，确保设备在不同带宽下保持低功率。 3. 用户可选分辨率：用户可以根据需要选择合适的分辨率，最高可达 13 位。 4. 固定 10 位分辨率：在 ±16 g 范围内维持 4 mg/LSB刻度因子。 5. 嵌入式存储管理系统：使用 FIFO 技术 минимизирует主机处理器负载。 6. 单击/双击检测：可以检测单击或双击事件，常用于游戏和指向设备。 7. 活动/非活动监控：可以监控设备的活动或非活动状态。 8. 自由落体检测：可以检测自由落体事件，常用于跌倒检测等应用。 9. 宽电源范围：电源电压范围为 2.0 V 到 3.6 V，I/O 电压范围为 1.7 V 到 VS。 10. 灵活的中断模式：可以映射到任意中断引脚，提高了系统灵活性。应用场景 1. 手机：ADXL345 可以应用于手机中的游戏、指向和跌倒检测等场景。 2. 医疗仪器：ADXL345 可以应用于医疗仪器中的跌倒检测、活动监控等场景。 3. 游戏和指向设备：ADXL345 可以应用于游戏和指向设备中的单击/双击检测、活动/非活动监控等场景。 4. 工业仪器：ADXL345 可以应用于工业仪器中的振动监控、跌倒检测等场景。 5. 个人导航设备：ADXL345 可以应用于个人导航设备中的活动/非活动监控、自由落体检测等场景。 6. 硬盘保护：ADXL345 可以应用于硬盘保护中的跌倒检测、自由落体检测等场景。技术参数 * 工作温度范围：-40°C 到 +85°C * 震动承受能力：10,000 g * 封装类型：LGA 封装，尺寸为 3 mm × 5 mm × 1 mm * Pb free/RoHS 符合性

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Data Sheet

ADXL345

3-Axis, ±2 g/±4 g/±8 g/±16 g Digital Accelerometer

Rev. G

DOCUMENT FEEDBACK

TECHNICAL SUPPORT

Information furnished by Analog Devices is believed to be accurate and reliable "as is". However, no responsibility is assumed by Analog

Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to

change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and

registered trademarks are the property of their respective owners.

FEATURES

► Ultralow power: as low as 23 µA in measurement mode and

0.1 µA in standby mode at V

= 2.5 V (typical)

► Power consumption scales automatically with bandwidth

► User-selectable resolution

► Fixed 10-bit resolution

► Full resolution, where resolution increases with g range, up to

13-bit resolution at ±16 g (maintaining 4 mg/LSB scale factor

in all g ranges)

► Embedded memory management system with FIFO technology

minimizes host processor load

► Single tap/double tap detection

► Activity/inactivity monitoring

► Free-fall detection

► Supply voltage range: 2.0 V to 3.6 V

► I/O voltage range: 1.7 V to V

► SPI (3- and 4-wire) and I

C digital interfaces

► Flexible interrupt modes mappable to either interrupt pin

► Measurement ranges selectable via serial command

► Bandwidth selectable via serial command

► Wide temperature range (−40°C to +85°C)

► 10,000 g shock survival

► Pb free/RoHS compliant

► Small and thin: 3 mm × 5 mm × 1 mm LGA package

APPLICATIONS

► Handsets

► Medical instrumentation

► Gaming and pointing devices

► Industrial instrumentation

►

Personal navigation devices

► Hard disk drive (HDD) protection

GENERAL DESCRIPTION

The ADXL345 is a small, thin, ultralow power, 3-axis accelerometer

with high resolution (13-bit) measurement at up to ±16 g. Digital

output data is formatted as 16-bit twos complement and is accessi-

ble through either a SPI (3- or 4-wire) or I

C digital interface.

The ADXL345 is well suited for mobile device applications. It meas-

ures the static acceleration of gravity in tilt-sensing applications, as

well as dynamic acceleration resulting from motion or shock. Its

high resolution (3.9 mg/LSB) enables measurement of inclination

changes less than 1.0°.

Several special sensing functions are provided. Activity and inactiv-

ity sensing detect the presence or lack of motion by comparing

the acceleration on any axis with user-set thresholds. Tap sensing

detects single and double taps in any direction. Free-fall sensing

detects if the device is falling. These functions can be mapped

individually to either of two interrupt output pins. An integrated

memory management system with a 32-level first in, first out (FIFO)

buffer can be used to store data to minimize host processor activity

and lower overall system power consumption.

Low power modes enable intelligent motion-based power manage-

ment with threshold sensing and active acceleration measurement

at extremely low power dissipation.

The ADXL345 is supplied in a small, thin, 3 mm × 5 mm × 1 mm,

14-lead, plastic package.

FUNCTIONAL BLOCK DIAGRAM

Figure 1.

Data Sheet ADXL345

TABLE OF CONTENTS

analog.com Rev. G | 2 of 36

Features................................................................ 1

Applications........................................................... 1

General Description...............................................1

Functional Block Diagram......................................1

Specifications........................................................ 3

Absolute Maximum Ratings...................................5

Thermal Resistance........................................... 5

Recommended Soldering Profile........................5

ESD Caution.......................................................5

Pin Configuration and Function Descriptions........ 6

Typical Performance Characteristics..................... 7

Theory of Operation.............................................12

Power Sequencing........................................... 12

Power Savings................................................. 13

Serial Communications........................................14

SPI....................................................................14

C.................................................................... 17

Interrupts............................................................. 19

DATA_READY..................................................20

SINGLE_TAP................................................... 20

DOUBLE_TAP..................................................20

Activity..............................................................20

Inactivity........................................................... 20

FREE_FALL..................................................... 20

Watermark........................................................20

Overrun............................................................ 20

FIFO.................................................................... 21

Bypass Mode....................................................21

FIFO Mode....................................................... 21

Stream Mode....................................................21

Trigger Mode.................................................... 21

Retrieving Data from FIFO............................... 21

Self-Test...............................................................22

Applications Information...................................... 29

Power Supply Decoupling................................ 29

Mechanical Considerations for Mounting......... 29

Tap Detection................................................... 29

Threshold......................................................... 30

Link Mode.........................................................30

Sleep Mode vs. Low Power Mode....................30

Offset Calibration..............................................30

Using Self-Test................................................. 31

Asynchronous Data Readings..........................32

Data Formatting of Upper Data Rates..............32

Noise Performance...........................................33

Operation at Voltages Other Than 2.5 V.......... 34

Offset Performance at Lowest Data Rates.......34

Axes of Acceleration Sensitivity....................... 35

Layout and Design Recommendations............ 35

Outline Dimensions............................................. 36

Ordering Guide.................................................36

Evaluation Boards............................................ 36

REVISION HISTORY

5/2022—Rev. F to Rev. G

Deleted Package Information Section..............................................................................................................5

Added Recommended Soldering Profile Section.............................................................................................5

Moved Figure 2 and Table 4............................................................................................................................ 5

Moved Table 13..............................................................................................................................................19

Change to Using Self-Test Section................................................................................................................ 31

Added Asynchronous Data Readings Section...............................................................................................32

Data Sheet ADXL345

SPECIFICATIONS

analog.com Rev. G | 4 of 36

Table 1.

Parameter Test Conditions Min Typ

Max Unit

Output Change in Y-Axis −2.10 −0.20 g

Output Change in Z-Axis 0.30 3.40 g

POWER SUPPLY

Operating Voltage Range (V

) 2.0 2.5 3.6 V

Interface Voltage Range (V

DD I/O

) 1.7 1.8 V

Supply Current ODR ≥ 100 Hz 140 µA

ODR < 10 Hz 30 µA

Standby Mode Leakage Current 0.1 µA

Turn-On and Wake-Up Time

ODR = 3200 Hz 1.4 ms

TEMPERATURE

Operating Temperature Range −40 +85 °C

WEIGHT

Device Weight 30 mg

The typical specifications shown are for at least 68% of the population of parts and are based on the worst case of mean ±1 σ, except for 0 g output and sensitivity, which

represents the target value. For 0 g offset and sensitivity, the deviation from the ideal describes the worst case of mean ±1 σ.

Cross-axis sensitivity is defined as coupling between any two axes.

Bandwidth is the −3 dB frequency and is half the output data rate, bandwidth = ODR/2.

The output format for the 3200 Hz and 1600 Hz ODRs is different than the output format for the remaining ODRs. This difference is described in the Data Formatting of

Upper Data Rates section.

Output data rates below 6.25 Hz exhibit additional offset shift with increased temperature, depending on selected output data rate. Refer to the Offset Performance at

Lowest Data Rates section for details.

Self-test change is defined as the output (g) when the SELF_TEST bit = 1 (in the DATA_FORMAT register, Address 0x31) minus the output (g) when the SELF_TEST bit

= 0. Due to device filtering, the output reaches its final value after 4 × τ when enabling or disabling self-test, where τ = 1/(data rate). The part must be in normal power

operation (LOW_POWER bit = 0 in the BW_RATE register, Address 0x2C) for self-test to operate correctly.

Turn-on and wake-up times are determined by the user-defined bandwidth. At a 100 Hz data rate, the turn-on and wake-up times are each approximately 11.1 ms. For other

data rates, the turn-on and wake-up times are each approximately τ + 1.1 in milliseconds, where τ = 1/(data rate).

Data Sheet ADXL345

ABSOLUTE MAXIMUM RATINGS

analog.com Rev. G | 5 of 36

Table 2.

Parameter Rating

Acceleration

Any Axis, Unpowered 10,000 g

Any Axis, Powered 10,000 g

−0.3 V to +3.9 V

DD I/O

−0.3 V to +3.9 V

Digital Pins −0.3 V to V

DD I/O

+ 0.3 V or 3.9 V,

whichever is less

All Other Pins −0.3 V to +3.9 V

Output Short-Circuit Duration (Any Pin

to Ground)

Indefinite

Temperature Range

Powered −40°C to +105°C

Storage −40°C to +105°C

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Table 3. Package Characteristics

Package Type θ

Device Weight

14-Terminal LGA 150°C/W 85°C/W 30 mg

RECOMMENDED SOLDERING PROFILE

Figure 2 and Table 4 provide details about the recommended

soldering profile.

Figure 2. Recommended Soldering Profile

Table 4. Recommended Soldering Profile

1, 2

Profile Feature

Condition

Sn63/Pb37 Pb-Free

Average Ramp Rate from Liquid Temperature

) to Peak Temperature (T

)

3°C/sec max-

imum

3°C/sec maxi-

mum

Preheat

Minimum Temperature (T

SMIN

) 100°C 150°C

Maximum Temperature (T

SMAX

) 150°C 200°C

Time from T

SMIN

to T

SMAX

) 60 sec to 120

sec

60 sec to 180

sec

SMAX

to T

Ramp-Up Rate 3°C/sec max-

imum

3°C/sec maxi-

mum

Liquid Temperature (T

) 183°C 217°C

Time Maintained Above T

) 60 sec to 150

sec

60 sec to 150

sec

Peak Temperature (T

) 240 + 0/−5°C 260 + 0/−5°C

Time of Actual T

− 5°C (t

) 10 sec to 30

sec

20 sec to 40

sec

Ramp-Down Rate 6°C/sec max-

imum

6°C/sec maxi-

mum

Time 25°C to Peak Temperature 6 minutes

maximum

8 minutes

maximum

Based on JEDEC Standard J-STD-020D.1.

For best results, the soldering profile should be in accordance with the recom-

mendations of the manufacturer of the solder paste used.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.

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