STM32F1原理图库-cadence
包含STM32F1全部TQFP装库(TQFP48,TQFP64,TQFP100)
Abstract: This amendment to IEEE Std 802.3-2018 adds physical layer specifications and management parameters for 2.5 Gb/s, 5 Gb/s, and 10 Gb/s operation on a single balanced pair of conductors suitable for automotive applications. Scope: Specify additions to and appropriate modifications of IEEE Std 802.3 to add greater than 1 Gb/s Physical Layer (PHY) specifications and management parameters for media and operating conditions for applications in the automotive environment. Date of Publication:
UCC24610同步整流控制电路图-DXP格式,包括原理图和PCB文件、工程文件。电路测试可用,单个小板可用于flyback整流控制,多个小板可组合使用实现半桥式整流控制,同步整流效率高发热少; 交流电源超过6V时请断开0欧姆电阻,独立5V供电。
1.此程序模板为stm32F103c8t6所用; 2.编译环境Keil5.14,库函数版本3.5; 3.实现功能:在TF卡/SD卡根目录下创建文件MEng.txt,并把数组bmpheader写入该文件; 4.硬件说明:SPI2读写: ---------------------------------------------- | STM32F10x | MSD Pin | ---------------------------------------------- | PB.12 | ChipSelect 1 | | PB.15 / MOSI | DataIn 2 | | | GND 3 (0 V) | | | VDD 4 (3.3 V) | | PB.13/ SCLK | Clock 5 | | | GND 6 (0 V) | | PB.14/ MISO | DataOut 7 | -----------------------------------------------
win10或win7下安装XP,boot修复工具。亲测可用! 测试如下:1.win7下安装xp,完成后用此工具修复boot启动项 2.在win10和win7下安装xp,修复3系统的启动项。