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Newnes is an imprint of Elsevier
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Copyright
©
2009, Elsevier Inc. All rights reserved.
Cadence, OrCAD, and Allegro are registered trademarks of
Cadence Design Systems, Inc.
No part of this publication may be reproduced, stored in a retrieval system,
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Library of Congress Cataloging-in-Publication Data
Mitzner, Kraig.
Complete PCB design using OrCAD Capture and PCB editor / Kraig Mitzner.
p. cm.
Includes bibliographical references and index.
ISBN 978-0-7506-8971-7 (pbk.)-7506-8971-7 (pbk.)7506-8971-7 (pbk.)-8971-7 (pbk.)8971-7 (pbk.)-7 (pbk.)7 (pbk.)
1. Printed circuits—Design and construction. 2. OrCAD SDT. I. Title.
TK7868.P7.M562 2009
621.3815'31—dc22
2009003604
British Library Cataloguing-in-Publication Data
A catalogue record for this book is available from the British Library.
For information on all Newnes publications,
visit our Web site at www.elsevierdirect.com
09 10 11 12 13 7 6 5 4 3 2 1
Printed in China
xi
Introduction
OrCAD PCB Editor is a relatively new printed circuit board (PCB) design appli-
cation that has replaced OrCAD Layout. The purpose of this book is to provide
new users of the software with a basic introduction to OrCAD PCB Editor and
the design of PCBs.
OrCAD PCB Editor is based on Allegro PCB Editor, so this book will be useful
to new Allegro PCB Editor users as well. Allegro PCB Editor is a powerful, full-
featured design tool. While OrCAD PCB Editor has inherited many of those
features, it does not possess all of the tools and features. Consequently most
of the basic tools and features are described here, but only a few of the more-
advanced tools are covered, as outlined later.
Chapter 1 introduces the reader to the basics of PCB design. The chapter begins
by introducing the concepts of computer-aided engineering, computer-aided
design, and computer-aided manufacturing. The chapter then explains how
these tools are used to design and manufacture multilayer PCBs. Many 3-D pic-
tures are used to show the construction of PCBs. Topics such as PCB cores and
layer stack-up, apertures, D codes, photolithography, layer registration, plated
through holes, and Gerber files are explained.
Chapter 2 leads new users of the software through a very simple design exam-
ple. The purpose of the example is to paint a “big picture” of the design flow
process. The example begins with a blank schematic page and ends with the
Gerber files. The circuit is ridiculously simple, so that it is not a distraction to
understanding the process itself. Along the way some of PCB Editor’s routing
tools are briefly introduced along with some of the other tools, which sets the
stage for Chapter 3.
Chapter 3 provides an overview of the OrCAD project files and structure and
explains PCB Editor’s tool set in detail. The chapter revisits and explains some
of the actions performed and tools used during the example in Chapter 2.
Gerber files are also explained in detail.
Chapter 4 introduces some of the industry standards organizations related to
the design and fabrication of PCBs (e.g., IPC and JEDEC). PCB performance
classes and producibility levels are also described, along with the basic ideas
behind standard fabrication allowances. These concepts are described here to
help the reader realize some of the fabrication issues up front to help minimize
board failures and identify some of the guides and standards resources that are
available for PCB design.
Introduction
xii
Chapter 5 addresses the mechanical aspect of PCB design—design for manu-
facturability. The chapter explains where parts should be placed on the board,
how far apart, and in what orientation from a manufacturing perspective.
OrCAD PCB Editor’s design rule checker is then considered relative to the man-
ufacturing concepts and IPC’s courtyard concepts. To aid in understanding the
design issues, manufacturing processes such as reflow and wave soldering, pick-
and-place assembly, and thermal management are discussed. The information
is then used as a guide in designing plated through holes, surface-mount lands,
and PCB Editor footprints in general. Tables summarize the information and
serve as a design guide during footprint design and PCB layout.
Chapter 6 addresses the electrical aspect of PCB design. Several good refer-
ences are available on signal integrity, electromagnetic interference, and elec-
tromagnetic compatibility. Chapter 6 provides an overview of those topics and
applies them directly to PCB design. Topics such as loop inductance, ground
bounce, ground planes, characteristic impedance, reflections, and ringing are
discussed. The idea of “the unseen schematic” (the PCB layout) and its role in
circuit operation on the PCB is introduced. Look-up tables and equations are
provided to determine required trace widths for current handling and imped-
ance as well as required trace spacing for high-voltage designs and high-fre-
quency designs. Various layer stack-up topographies for analog, digital, and
mixed-signal applications are also described. The design examples in Chapter 9
demonstrate how to apply the layer stack-ups described in this chapter. A dem-
onstration on how to use PSpice to simulate transmission lines to aid in circuit
design and PCB layout is also provided.
Chapter 7 explains how to construct Capture parts using the Capture Library
Manager and Part Editor and the PSpice Model Editor. Heterogeneous and
homogeneous parts are developed in examples using four methods. Different
methods are used depending on whether a part will be used for simple sche-
matic entry, design projects intended for PCB layout, PSpice simulations, or
all of these. The chapter also demonstrates how to attach PSpice models to
Capture’s schematic parts using PSpice models downloaded from the Internet
and basic PSpice models developed from functional Capture projects. The
Capture parts can then be used for both PSpice simulations and PCB layout as
demonstrated in Chapter 9.
Detailed coverage of padstacks and footprints is covered in Chapter 8. The
chapter begins with an overview of PCB Editor’s symbols library, describes
the various types of symbols, and explains the anatomy of a footprint. Then
a detailed description of the padstack (as it relates to PCB manufacturing
described in Chapters 1 and 5) is given, as it is the foundation of both foot-
print design and PCB routing. Design examples are provided to demonstrate
how to design discrete through-hole and surface-mount devices and how to use
the footprint design wizard. The IPC Land Pattern Viewer is also introduced in
this chapter.
Chapter 9 provides four PCB design examples that use the material covered in
the previous chapters. The first example is a simple analog design using a single
Introduction
xiii
op amp. The design shows how to set up multiple plane layers for positive and
negative power supplies and ground. The design also demonstrates several key
concepts in Capture, such as how to connect global nets, how to assign foot-
prints, how to perform design rule checks, how to use the Capture part librar-
ies, how to generate a bill of materials (BOM), and how to use the BOM as an
aid in the design process in Capture and PCB Editor. The design also shows
how to perform important tasks in PCB Editor, such as how to set up a board
outline, place parts, and modify padstacks. Intertool communication (such
as annotation and back annotation) between Capture and PCB Editor is also
demonstrated. The second design is a mixed digital/analog circuit. In addition
to the tasks demonstrated in the first example, the design also demonstrates
how to set up and use split planes to isolate analog and digital power supplies
and grounds. Other tasks include using copper areas on routing layers to make
partial ground planes, setting up split power and ground planes, and defining
anticopper areas on plane and routing layers. The third example uses the same
mixed digital/analog circuit from the second example but demonstrates how
to use multiple-page schematics and off-page connectors to add PSpice sim-
ulations to a Capture project used for PCB layout, all within a single project
design. It also demonstrates how to construct multiple, separated power and
ground planes and a shield plane to completely isolate analog from digital cir-
cuitry. The use of guard rings and guard traces is also demonstrated.
The fourth example is a high-speed digital design, which demonstrates how to
design transmission lines, stitch multilayer ground planes, perform pin/gate
swapping, place moated ground areas for clock circuitry, and design a heat
spreader.
The last part of Chapter 9 includes a short discussion about the differences
between using negative and positive planes in PCB design.
Chapter 10 describes taking the PCB design from the CAD stage through fabri-
cation. A simple design example shows how to produce the artwork (Gerber)
files for a PCB design. PCB Editor is then used to review the artwork files before
they are sent to a manufacturer. PCB Editor is also used to generate a drawing
(dfx) file that can be opened and edited with many drawing applications, so
they can be 3-D modeled to review form, fit, and function. The chapter also
describes how to create a custom report that can be used for pick and place
machines during the assembly process.
At the Web site for this book, www.elsevierdirect.com/companions/
9780750689717, you should find supplementary content including the demo
version of the software and the design files used in writing this book. The
design files include the design flow example from Chapter 2, the Capture parts
from Chapter 7, the footprint and padstack symbols from Chapter 8, the board
layout files from Chapter 9, and the manufacturing files from Chapter 10. The
newest version of the demo can also be obtained from the cadence Web site.
During the development of this text, the author received technical assistance
from Cadence, so many of the procedures and concepts were written from les-
sons learned and feedback from Cadence. While every effort has been made to
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