NZ3801-AB 国民技术-驱动示例代码 V1.1.rar

/** @page ewarm EWARM Project Template @verbatim ******************** (C) COPYRIGHT 2011 STMicroelectronics ******************* * @file readme.txt * @author MCD Application Team * @version V3.5.0 * @date 08-April-2011 * @brief This sub directory contains all the user modifiable files needed * to create a new project linked with the STM32F10x Standard Peripheral * Library and working with IAR Embedded Workbench for ARM (EWARM) * software toolchain (version 5.50 and later). ****************************************************************************** * THE PRESENT FIRMWARE WHICH IS FOR GUIDANCE ONLY AIMS AT PROVIDING CUSTOMERS * WITH CODING INFORMATION REGARDING THEIR PRODUCTS IN ORDER FOR THEM TO SAVE TIME. * AS A RESULT, STMICROELECTRONICS SHALL NOT BE HELD LIABLE FOR ANY DIRECT, * INDIRECT OR CONSEQUENTIAL DAMAGES WITH RESPECT TO ANY CLAIMS ARISING FROM THE * CONTENT OF SUCH FIRMWARE AND/OR THE USE MADE BY CUSTOMERS OF THE CODING * INFORMATION CONTAINED HEREIN IN CONNECTION WITH THEIR PRODUCTS. ****************************************************************************** @endverbatim @par Directory contents - project .ewd/.eww/.ewp: A pre-configured project file with the provided library structure that produces an executable image with IAR Embedded Workbench. - stm32f10x_flash.icf : This file is the IAR Linker configuration file used to place program code (readonly) in internal FLASH and data (readwrite, Stack and Heap)in internal SRAM. You can customize this file to your need. - stm32f10x_flash_extsram.icf: This file is the IAR Linker configuration file used to place program code (readonly) in internal FLASH and data (readwrite, Stack and Heap)in external SRAM. You can customize this file to your need. This file is used only with STM32 High-density devices. - stm32f10x_nor.icf: This file is the IAR Linker configuration file used to place program code (readonly) in external NOR FLASH and data (readwrite, Stack and Heap)in internal SRAM. You can customize this file to your need. This file is used only with STM32 High-density devices. - stm32f10x_ram.icf: This file is the IAR Linker configuration file used to place program code (readonly) and data (readwrite, Stack and Heap)in internal SRAM. You can customize this file to your need. @par How to use it ? - Open the Project.eww workspace. - In the workspace toolbar select the project config: - STM32100B-EVAL: to configure the project for STM32 Medium-density Value line devices @note The needed define symbols for this config are already declared in the preprocessor section: USE_STDPERIPH_DRIVER, STM32F10X_MD_VL, USE_STM32100B_EVAL - STM3210C-EVAL: to configure the project for STM32 Connectivity line devices @note The needed define symbols for this config are already declared in the preprocessor section: USE_STDPERIPH_DRIVER, STM32F10X_CL, USE_STM3210C_EVAL - STM3210B-EVAL: to configure the project for STM32 Medium-density devices @note The needed define symbols for this config are already declared in the preprocessor section: USE_STDPERIPH_DRIVER, STM32F10X_MD, USE_STM3210B_EVAL - STM3210E-EVAL: to configure the project for STM32 High-density devices @note The needed define symbols for this config are already declared in the preprocessor section: USE_STDPERIPH_DRIVER, STM32F10X_HD, USE_STM3210E_EVAL - STM3210E-EVAL_XL: to configure the project for STM32 XL-density devices @note The needed define symbols for this config are already declared in the preprocessor section: USE_STDPERIPH_DRIVER, STM32F10X_XL, USE_STM3210E_EVAL - STM32100E-EVAL: to configure the project for STM32 High-density Value line devices @note The needed define symbols for this config are already declared in the preprocessor section: USE_STDPERIPH_DRIVER, STM32F10X_HD_VL, USE_STM32100E_EVAL - Rebuild all files: Project->Rebuild all - Load project image: Project->Debug - Run program: Debug->Go(F5) @note - Low-density Value line devices are STM32F100xx microcontrollers where the Flash memory density ranges between 16 and 32 Kbytes. - Low-density devices are STM32F101xx, STM32F102xx and STM32F103xx microcontrollers where the Flash memory density ranges between 16 and 32 Kbytes. - Medium-density Value line devices are STM32F100xx microcontrollers where the Flash memory density ranges between 32 and 128 Kbytes. - Medium-density devices are STM32F101xx, STM32F102xx and STM32F103xx microcontrollers where the Flash memory density ranges between 32 and 128 Kbytes. - High-density Value line devices are STM32F100xx microcontrollers where the Flash memory density ranges between 256 and 512 Kbytes. - High-density devices are STM32F101xx and STM32F103xx microcontrollers where the Flash memory density ranges between 256 and 512 Kbytes. - XL-density devices are STM32F101xx and STM32F103xx microcontrollers where the Flash memory density ranges between 512 and 1024 Kbytes. - Connectivity line devices are STM32F105xx and STM32F107xx microcontrollers. * <h3><center>&copy; COPYRIGHT 2011 STMicroelectronics</center></h3> */