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Fairchild光耦手册.pdf
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非常齐全的光耦手册,包括:Fairchild,NEC,东芝,松下,夏普,VISHAY,LIT-ON.共7个部分。
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OPTOCOUPLER SELECTION GUIDE
www.fairchildsemi.com
Saving our world, 1mW at a time
™
www.fairchildsemi.com
2
Fairchild
S
emiconductor is a leader in the design and production of optocouplers. We offer a broad range of
package platforms and incorporate various combinations of input and output configurations.
O
ur offerings include
simple function optocouplers for low bandwidth/general switching applications, high performance optocouplers
for high bandwidth/high gain applications, high voltage optocouplers for A
C
load switching applications and
other specific functions that provide unique performance characteristics.
T
he recently introduced 1.0A and 2.5A
IG
B
T
/M
OS
F
ET
gate drive optocouplers complement Fairchild’s leading discrete power M
OS
F
ET
products. Fairchild
customers now have a complete offering from the logic control portion of the circuit to the isolated gate driver to the
power M
OS
F
ET
. All of our optocouplers are lead (Pb) free and RoH
S
compliant.
I
n addition, they are certified by
major safety regulatories.
T
o meet the increasing demands of today’s designs, Fairchild offers optocouplers capable of withstanding operating
To meet the increasing demands of today’s designs, Fairchild offers optocouplers capable of withstanding operating T
temperatures up to +125°
C
.
O
ur Microcoupler
™
devices are the only plastic package optocouplers capable of
meeting this elevated temperature limit to allow for improved
C
urrent
T
ransfer Ratio (
CT
R) stability.
O
ur 4-pin full pitch
Mini-Flat package (MFP) and 4-pin
DI
P package, phototransistor output optocouplers are rated with a maximum
operation temperature of +110°
C
.
Fairchild’s new high performance optocouplers have a superior common mode transient immunity advantage, which
is 30% better than the competition.
T
his improvement has been achieved through
O
ptoplanar
®
, Fairchild’s coplanar
packaging technology, and proprietary shielding of the silicon detector chip.
T
his solution results in a >30% reduction
in capacitance vs. the over-under package construction utilized by the competition.
C
MR is a measure of the device’s
ability to reject noise.
INTRODUCTION
Common Mode Rejection Comparison: Low to High State
(CMR)
VCM (V)
dv/dt (kV/µs)
1000 1200 1400 1600 1800 2000
0
5
10
15
20
25
30
Fairchild
Competitor A
Competitor B
Competitor C
www.fairchildsemi.com
3
TABLE of CONTENTS
O
PTICALLY ISOLATING HIGH SPEED INTERFACE
.....................................................
4
H
IGH
P
ERFORMANCE
O
PTOCOUPLERS
...............................................................
5-9
L
OW VOLTAGE,
H
IGH
P
ERFORMANCE
................................................................................................................
5
H
IGH
S
PEED
L
OGIC
G
ATE
...................................................................................................................................
6
H
IGH
P
ERFORMANCE
T
RANSISTORS
...................................................................................................................
7
G
ATE
D
RI
V
ER
S
....................................................................................................................................................
8
S
PECIFIC
F
UNCTIONS
.........................................................................................................................................
9
T
RIAC
D
RI
V
ER
O
PTOCOUPLERS
.......................................................................
10-11
R
ANDOM
P
HASE..............................................................................................................................................
10
ZERO
C
ROSSING
.............................................................................................................................................
11
P
HOTO
T
RANSISTORS
......................................................................................
12-18
I
SOLATED
E
RROR
A
MPLIFIER
S
.............................................................................................................................
12
P
HOTO
T
RANSISTOR
O
UTPUT–
DC
S
ENSING
I
NPUT
........................................................................................
13-15
P
HOTO
T
RANSISTOR
O
UTPUT–
AC
S
ENSING
I
NPUT
.............................................................................................
16
P
HOTO
D
ARLINGTON
O
UTPUT
.....................................................................................................................
17-18
S
OLID
S
TATE
R
ELAY
O
PTOCOUPLERS....................................................................
19
P
ACKAGE
PACKAGE P
I
NFORMATION
...............................................................................
20-24
A
PPLICATION NOTES
.........................................................................................
25
CROSS REFERENCE
INFORMATION
.....................................................................
25
GLOSSARY OF TERMS
....................................................................................
26-27
S
ALES
C
ONTACT
I
NFO
RMATION
........................................................................
28
www.fairchildsemi.com
4
OPTICALLY ISOLATING HIGH SPEED INTERFACE
Fairchild’s high performance optocouplers have a superior common mode transient immunity advantage (>30% over
competition). With their high speed data rates, these optocouplers are ideal to meet the needs of high speed data
communications. Portable and compact electronic devices require optocouplers that reduce power consumption and
save space.
T
he 3.3V supply voltage specification reduces power consumption by 33%, while the 5-pin MFP and
dual channel 8-pin
SO
P packaging optimize mounting density.
PLC or
Industrial
PC
Controller
Output
Input
Isolating Digital Input/Output Module
Isolating FieldBus Interface
(Profibus, DeviceNet, CAN, RS485/RS232)
Controller
Transceiver
Control
Enable
Circuit
Driver
Receiver
Power
Router/
Switch
Controller
with I
2
C
Interface
802.3af
PSE Chip
1/2 P82B96
I
2
C
Data
I
2
C
Data
Power Over Ethernet (PoE)
Isolated Bi-Dir I
2
C Interface
Data
Physical
Layer
Micro
Controller
with Serial
Peripheral
Interface
USB Serial
Interface
Engine
+
Transceiver
Micro
Controller
with
Serial
Peripheral
Interface
High Speed
ADC
SS
SCLK
MISO
MOSI
DOUT
DIN
SCLK
C/S
MISO
MOSI
SCK
I/O
Isolating Data Acquisition System
Isolating Universal Serial Bus
Controller Circuits
Motor Drive Control (Optically Isolation Intelligent Power Module (IPM)
M
IPM
PFC
+
Primary
Side
Controller
Digial Power Control
Rectifier
+
Secondary
Side
Controller
AC
Line
Input
Output
Sync
FB
EMI Filter
+
Transformers
Isolating Digital Input/Output Module
Isolating FieldBus Interface
(Profibus, DeviceNet, CAN, RS485/RS232)
PLC or
Industrial
PC
Controller
Output
Input
Isolating Digital Input/Output Module
Isolating FieldBus Interface
(Profibus, DeviceNet, CAN, RS485/RS232)
Controller
Transceiver
Control
Enable
Circuit
Driver
Receiver
Power Over Ethernet
Isolating Bi-Dir I
2
Isolating Bi-Dir I
2
Isolating Bi-Dir I
C Interface
Power
Router/
Switch
Controller
with I
2
C
Interface
802.3af
PSE Chip
1/2 P82B96
I
2
C
Data
I
2
C
Data
Power Over Ethernet (PoE)
Isolated Bi-Dir I
2
C Interface
Data
Physical
Layer
Isolating Data Acquisition System
Isolating Universal Serial Bus
Micro
Controller
with Serial
Peripheral
Interface
USB Serial
Interface
Engine
+
Transceiver
Micro
Controller
with
Serial
Peripheral
Interface
High Speed
ADC
SS
SCLK
MISO
MOSI
DOUT
DIN
SCLK
C/S
MISO
MOSI
SCK
I/O
Isolating Data Acquisition System
Isolating Universal Serial Bus
Digital Power Control
Motor Drive Control (Optically Isolating
Intelligent Power Module (IPM))
www.fairchildsemi.com
5
Low Voltage (3.3V/5V), High Performance
Product
Number
Pin
Connections
Package
Data
Rate
(Mbps)
I
FT
Max.
(mA)
CTR @
I
F
=16mA
(%)
V
OL
Max.
(V)
I
CCL
Max.
(mA)
t
PHL
Max.
(ns)
t
PLH
Max.
(ns)
PWD
Max.
(ns)
CMR
Typ.
(kV/µs)
V
ISO
AC
RMS
(V)
T
OPR
(°C)
Min. Max.
FOD
8001
8-
P
in
SOIC
25 –
25 –
–
–
0.1 9 40 40 6 40 3750
0.1 9 40 40 6 40 3750
0.1 9 40 40 6 40 3750
0.1 9 40 40 6 40 3750
0.1 9 40 40 6 40 3750
0.1 9 40 40 6 40 3750
0.1 9 40 40 6 40 3750
-40 to
+105
FOD
060
L
8-
P
in
SOIC
10 5 –
10 5 –
10 5 –
–
0.6 10 75 90 25 50 3750
0.6 10 75 90 25 50 3750
0.6 10 75 90 25 50 3750
0.6 10 75 90 25 50 3750
0.6 10 75 90 25 50 3750
0.6 10 75 90 25 50 3750
0.6 10 75 90 25 50 3750
-40 to
+85
FOD
260
L
8-
P
in
DIP
10 5 –
10 5 –
10 5 –
–
0.6 10 75 90 25 50 5000
0.6 10 75 90 25 50 5000
0.6 10 75 90 25 50 5000
0.6 10 75 90 25 50 5000
0.6 10 75 90 25 50 5000
0.6 10 75 90 25 50 5000
0.6 10 75 90 25 50 5000
-40 to
+85
HCPL
062
N
8-
P
in
SOIC
10 5 –
10 5 –
10 5 –
–
0.6 15 75 90 25 50 2500
0.6 15 75 90 25 50 2500
0.6 15 75 90 25 50 2500
0.6 15 75 90 25 50 2500
0.6 15 75 90 25 50 2500
0.6 15 75 90 25 50 2500
0.6 15 75 90 25 50 2500
-40 to
+85
FOD
050
L
8-
P
in
SOIC
1
–
15 50 0.3 0.2 1000 1000
15 50 0.3 0.2 1000 1000
15 50 0.3 0.2 1000 1000
15 50 0.3 0.2 1000 1000
15 50 0.3 0.2 1000 1000
15 50 0.3 0.2 1000 1000
–
35 2500
35 2500
-40 to
+85
FOD
250
L
8-
P
in
DIP
1–
1–
15 50 0.3 0.2 1000 1000 –
15 50 0.3 0.2 1000 1000 –
15 50 0.3 0.2 1000 1000 –
15 50 0.3 0.2 1000 1000 –
15 50 0.3 0.2 1000 1000 –
15 50 0.3 0.2 1000 1000 –
15 50 0.3 0.2 1000 1000 –
35 5000
35 5000
-40 to
+85
FOD
053
L
8-
P
in
SOIC
1–
1–
15 50 0.3 0.4 1000 1000
15 50 0.3 0.4 1000 1000
15 50 0.3 0.4 1000 1000
15 50 0.3 0.4 1000 1000
15 50 0.3 0.4 1000 1000
15 50 0.3 0.4 1000 1000
–
35 2500
35 2500
-40 to
+85
FOD
073
L
8-
P
in
SOIC
0.1 –
0.1 –
400* 7000 0.3 3 30 90 –
400* 7000 0.3 3 30 90 –
400* 7000 0.3 3 30 90 –
400* 7000 0.3 3 30 90 –
400* 7000 0.3 3 30 90 –
400* 7000 0.3 3 30 90 –
400* 7000 0.3 3 30 90 –
10 2500
10 2500
-40 to
+85
1
2
3
4 5
6
7
8
+
_
V
F1
V
CC
V
01
V
02
GND
FOD073L
V
F2
_
+
HIGH PERFORMANCE OPTOCOUPLERS
* CTR @ I
F
= 1.6mA (%)
1
2
3
4
5
6
7
8
N/C
_
V
CC
V
E
V
O
GND
+
N/C
V
F
1
2
3
4 5
6
7
8
+
_
V
F1
V
CC
V
01
V
02
GND
V
F2
_
+
1
2
3
4 5
6
7
8
+
_
V
F
V
CC
V
B
V
O
GNDN/C
N/C
FOD050L, FOD250L
1
2
3
4
5
6
7
8
V
DD2
NC
GND2
GND1
V
DD1
V
I
*
V
O
1
2
3
4 5
6
7
8
+
_
V
F1
V
CC
V
01
V
02
GND
V
F2
_
+
FOD053L
NEW
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