TEE System Architecture – Public Release v1.0 3/24
Copyright 2011 GlobalPlatform Inc. All Rights Reserved.
The technology provided or described herein is subject to updates, revisions, and extensions by GlobalPlatform. Use of this
information is governed by the GlobalPlatform license agreement and any use inconsistent with that agreement is strictly
prohibited.
Contents
1 Introduction ............................................................................................................................ 5
1.1 Audience ............................................................................................................................................... 5
1.2 IPR Disclaimer....................................................................................................................................... 5
1.3 Normative References .......................................................................................................................... 6
1.4 Terminology and Definitions .................................................................................................................. 7
1.5 Abbreviations and Notations ............................................................................................................... 10
1.6 Revision History .................................................................................................................................. 11
2 TEE Device Architecture Overview ..................................................................................... 12
2.1 Typical Chipset Architecture ............................................................................................................... 12
2.2 Hardware Architecture ........................................................................................................................ 13
2.2.1 TEE Resources ............................................................................................................................ 14
2.2.2 REE and TEE Resources Sharing ............................................................................................... 15
3 TEE Software Interfaces....................................................................................................... 17
3.1 The TEE Software Architecture........................................................................................................... 17
3.1.1 REE Interfaces to the TEE ........................................................................................................... 18
3.1.2 Trusted OS Components ............................................................................................................. 18
3.1.3 Trusted Applications ..................................................................................................................... 18
3.1.4 Shared Memory ............................................................................................................................ 19
3.2 The TEE Client API Architecture ......................................................................................................... 20
3.3 The TEE Internal API Architecture ...................................................................................................... 21
4 TEE API Availability .............................................................................................................. 22
4.1 Device States ...................................................................................................................................... 22
4.2 Boot Time Environment ....................................................................................................................... 22
4.2.1 Typical Boot Sequence ................................................................................................................ 23
4.3 Run-Time Environment ....................................................................................................................... 24
4.3.1 TEE Functionality Availability ....................................................................................................... 24
