Chapter 1: Introduction to LoRa and LoRaWAN
Chapter 2: Obtaining and Preparing Hardware
Chapter 3: Setting Up the Software Development Environment
Chapter 4: Building a Peer-to-Peer Channel
Chapter 5: Building a LoRa Gateway
Chapter 6: Connecting with IoT Servers Using a RESTful API
Chapter 7: Connecting with IoT Servers Using MQTT
Chapter 8: GPS Tracking
Appendix A: LoRaWAN Channel Plans
Publisher: Prentice Hall PTR
Pub Date: September 15, 2003
ISBN: 0-13-066946-6
Pages: 608
Section 2.7. The Spectrum of an Ideal Square Wave
Section 2.8. From the Frequency Domain to the Time Domain
Section 2.9. Effect of Bandwidth on Rise Time
Section 2.10. Bandwidth and Rise Time
Section 2.11. What Does "Significant" Mean?
Section 2.12. Bandwidth of Real Signals
Section 2.13. Bandwidth and Clock Frequency
Section 2.14. Bandwidth of a Measurement
Section 2.15. Bandwidth of a Model
Section 2.16. Bandwidth of an Interconnect
Section 2.17. Bottom Line
Chapter 3. Impedance and Electrical Models
Section 3.1. Describing Signal-Integrity Solutions in Terms of Impedance
Section 3.2. What Is Impedance?
Section 3.3. Real vs. Ideal Circuit Elements
Section 3.4. Impedance of an Ideal Resistor in the Time Domain
Section 3.5. Impedance of an Ideal Capacitor in the Time Domain
Section 3.6. Impedance of an Ideal Inductor in the Time Domain
Section 3.7. Impedance in the Frequency Domain
Section 3.8. Equivalent Electrical Circuit Models
Section 3.9. Circuit Theory and SPICE
Section 3.10. Introduction to Modeling
Section 3.11. The Bottom Line
Chapter 4. The Physical Basis of Resistance
Section 4.1. Translating Physical Design into Electrical Performance
Section 4.2. The Only Good Approximation for the Resistance of Interconnects
Section 4.3. Bulk Resistivity
Section 4.4. Resistance per Length
Section 4.5. Sheet Resistance
Section 4.6. The Bottom Line
Chapter 5. The Physical Basis of Capacitance
Section 5.1. Current Flow in Capacitors
Section 5.2. The Capacitance of a Sphere
Section 5.3. Parallel Plate Approximation
Section 5.4. Dielectric Constant
Section 5.5. Power and Ground Planes and Decoupling Capacitance
Section 5.6. Capacitance per Length
Section 5.7. 2D Field Solvers
Section 5.8. Effective Dielectric Constant
Section 5.9. The Bottom Line
Chapter 6. The Physical Basis of Inductance
Section 6.1. What Is Inductance?
Section 6.2. Inductance Principle #1: There Are Circular Magnetic-Field Line Loops Around All Currents
Section 6.3. Inductance Principle #2: Inductance Is the Number of Webers of Field Line Loops Around a Conductor per Amp of Current Through It
Section 6.4. Self-Inductance and Mutual Inductance
Section 6.5. Inductance Principle #3: When the Number of Field Line Loops Around a Conductor Changes, There Will Be a Voltage Induced Across the Ends of the Conductor
Section 6.6. Partial Inductance
Section 6.7. Effective, Total, or Net Inductance and Ground Bounce
Section 6.8. Loop Self- and Mutual Inductance
Section 6.9. The Power-Distribution System (PDS) and Loop Inductance
Section 6.10. Loop Inductance per Square of Planes
Section 6.11. Loop Inductance of Planes and Via Contacts
Section 6.12. Loop Inductance of Planes with a Field of Clearance Holes
Section 6.13. Loop Mutual Inductance
Section 6.14. Equivalent Inductance
Section 6.15. Summary of Inductance
Section 6.16. Current Distributions and Skin Depth
Section 6.17. High-Permeability Materials
Section 6.18. Eddy Currents
Section 6.19. The Bottom Line
Chapter 7. The Physical Basis of Transmission Lines
Section 7.1. Forget the Word Ground
Section 7.2. The Signal
Section 7.3. Uniform Transmission Lines
Section 7.4. The Speed of Electrons in Copper
Section 7.5. The Speed of a Signal in a Transmission Line
Section 7.6. Spatial Extent of the Leading Edge
Section 7.7. "Be the Signal"
Section 7.8. The Instantaneous Impedance of a Transmission Line
Section 7.9. Characteristic Impedance and Controlled Impedance
Section 7.10. Famous Characteristic Impedances
Section 7.11. The Impedance of a Transmission Line
Section 7.12. Driving a Transmission Line
Section 7.13. Return Paths
Section 7.14. When Return Paths Switch Reference Planes
Section 7.15. A First-Order Model of a Transmission Line
Section 7.16. Calculating Characteristic Impedance with Approximations
Section 7.17. Calculating the Characteristic Impedance with a 2D Field Solver
Section 7.18. An n-Section Lumped Circuit Model
Section 7.19. Frequency Variation of the Characteristic Impedance
Section 7.20. The Bottom Line
Chapter 8. Transmission Lines and Reflections
Section 8.1. Reflections at Impedance Changes
Section 8.2. Why Are There Reflections?
Section 8.3. Reflections from Resistive Loads
Section 8.4. Source Impedance
Section 8.5. Bounce Diagrams
Section 8.6. Simulating Reflected Waveforms
Section 8.7. Measuring Reflections with a TDR
Section 8.8. Transmission Lines and Unintentional Discontinuities
Section 8.9. When to Terminate
Section 8.10. The Most Common Termination Strategy for Point-to-Point Topology
Section 8.11. Reflections from Short Series Transmission Lines
Section 8.12. Reflections from Short-Stub Transmission Lines
Section 8.13. Reflections from Capacitive End Terminations
Section 8.14. Reflections from Capacitive Loads in the Middle of a Trace
Section 8.15. Capacitive Delay Adders
Section 8.16. Effects of Corners and Vias
Section 8.17. Loaded Lines
Section 8.18. Reflections from Inductive Discontinuities
Section 8.19. Compensation
Section 8.20. The Bottom Line
Chapter 9. Lossy Lines, Rise-Time Degradation, and Material Properties
Section 9.1. Why Worry About Lossy Lines
Section 9.2. Losses in Transmission Lines
Section 9.3. Sources of Loss: Conductor Resistance and Skin Depth
Section 9.4. Sources of Loss: The Dielectric
Section 9.5. Dissipation Factor
Section 9.6. The Real Meaning of Dissipation Factor
Section 9.7. Modeling Lossy Transmission Lines
Section 9.8. Characteristic Impedance of a Lossy Transmission Line
Section 9.9. Signal Velocity in a Lossy Transmission Line
Section 9.10. Attenuation and the dB
Section 9.11. Attenuation in Lossy Lines
Section 9.12. Measured Properties of a Lossy Line in the Frequency Domain
Section 9.13. The Bandwidth of an Interconnect
Section 9.14. Time-Domain Behavior of Lossy Lines
Section 9.15. Improving the Eye Diagram of a Transmission Line
Section 9.16. Pre-emphasis and Equalization
Section 9.17. The Bottom Line
Chapter 10. Cross Talk in Transmission Lines
Section 10.1. Superposition
Section 10.2. Origin of Coupling: Capacitance and Inductance
Section 10.3. Cross Talk in Transmission Lines: NEXT and FEXT
Section 10.4. Describing Cross Talk
Section 10.5. The SPICE Capacitance Matrix
Section 10.6. The Maxwell Capacitance Matrix and 2D Field Solvers
Section 10.7. The Inductance Matrix
Section 10.8. Cross Talk in Uniform Transmission Lines and Saturation Length
Section 10.9. Capacitively Coupled Currents
Section 10.10. Inductively Coupled Currents
Section 10.11. Near-End Cross Talk
Section 10.12. Far-End Cross Talk
Section 10.13. Decreasing Far-End Cross Talk
Section 10.14. Simulating Cross Talk
Section 10.15. Guard Traces
Section 10.16. Cross Talk and Dielectric Constant
Section 10.17. Cross Talk and Timing
Section 10.18. Switching Noise
Section 10.19. Summary of Reducing Cross Talk
Section 10.20. The Bottom Line
Chapter 11. Differential Pairs and Differential Impedance
Section 11.1. Differential Signaling
Section 11.2. A Differential Pair
Section 11.3. Differential Impedance with No Coupling
Section 11.4. The Impact from Coupling
Section 11.5. Calculating Differential Impedance
Section 11.6. The Return-Current Distribution in a Differential Pair
Section 11.7. Odd and Even Modes
Section 11.8. Differential Impedance and Odd-Mode Impedance
Section 11.9. Common Impedance and Even-Mode Impedance
Section 11.10. Differential and Common Signals and Odd- and Even-Mode Voltage Components
Section 11.11. Velocity of Each Mode and Far-End Cross Talk
Section 11.12. Ideal Coupled Transmission-Line Model or an Ideal Differential Pair
Section 11.13. Measuring Even- and Odd-Mode Impedance
Section 11.14. Terminating Differential and Common Signals
Section 11.15. Conversion of Differential to Common Signals
Section 11.16. EMI and Common Signals
Section 11.17. Cross Talk in Differential Pairs
Section 11.18. Crossing a Gap in the Return Path
Section 11.19. To Tightly Couple or Not to Tightly Couple
Section 11.20. Calculating Odd and Even Modes from Capacitance- and Inductance-Matrix Elements
Section 11.21. The Characteristic Impedance Matrix
Section 11.22. The Bottom Line
Appendix A. 100 General Design Guidelines to Minimize Signal-Integrity Problems
Section A.1. Minimize Signal-Quality Problems on One Net
Section A.2. Minimize Cross Talk
Section A.3. Minimize Rail Collapse
Section A.4. Minimize EMI
Appendix B. 100 Collected Rules of Thumb to Help Estimate Signal-Integrity Effects
Section B.1. Chapter 2
Section B.2. Chapter 3
Section B.3. Chapter 4
Section B.4. Chapter 5
Section B.5. Chapter 6
Section B.6. Chapter 7
Section B.7. Chapter 8
Section B.8. Chapter 9
Section B.9. Chapter 10
Section B.10. Chapter 11
Appendix C. Selected References
About the Author
A summary of useful commands and expressions for the ARM architecture using the GNU assembler is presented briefly in the concluding portion of this Appendix.
GNU Assembler Directives for ARM
The follow is an alphabetical listing of the more command GNU assembler directives.
Machine Dependent Directives
.arm Assemble using arm mode
.thumb Assemble using thumb mode
.code16 Assemble using thumb mode
.code32 Assemble using arm mode
.force_thumb Force thumb mode (even if not supported)
.thumb_func Mark entry point as thumb coded (force bx entry)
.ltorg Start a new literal pool
Assembler Special Characters / Syntax
Register Names
Arm Procedure Call Standard (APCS) Conventions
Addressing Modes
Machine Dependent Directives
Opcodes
