IEC 61375-3-1-2012 MVB规范.pdf

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IEC 61375-3-1-2012 MVB规范.pdf
IEC Ec61375-3-1 Edition1.0201206 INTERNATIONAL STANDARD NORME INTERNATIONALE Electronic railway equipment-Train communication network (TCN) Part 3-1: Multifunction Vehicle Bus(MVB) Materiel electronique ferroviaire Reseau embarque de train (tcne Partie 3-1: Bus de vehicule Multifonctions MVB) INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE PRICE CODE CODE PRⅨX XE Cs45.060 SBN9782-88912-070-3 Warning Make sure that you obtained this publication from an authorized distributor Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agree B Registered tr ademark of the International Electrotechnical Commission Marque depose de la Commission Electrotechnic 2 61375-3-1|EC:2012 CONTENTS FOREWORD NTRODUCTION 10 pe 2 2 Normative references 12 3 Terms and definitions, abbreviations and conventions 13 3.1 Terms and definitions 3.2 Abbreviations .30 3.3 Conventions 3.3.1 Base of numeric values 31 3.3.2 Naming conventions 32 3.3.3 T ime naming conventions 32 3.3.4 Procedural interface conventions 32 3.3.5 Specification of transmitted data 35 3.3.6 State diagram conventions 37 4 Physical layer 38 4.1 Topology .38 4.1.1 Segments...… ...a.a. 38 4.1.2 Couplers .38 4.1.3 Double-line segments 39 4.2 Device classes 39 4.2. 1 Capabilities .39 42.2 Class o devices 40 4.2.3 Class 1 devices 40 4.2.4 Class 2 devices .40 4.2.5 Class 3 devices 40 4.2. 6 Class 4 devices 40 4.2.7 Class 5 devices 40 4.2.8 Device Attachment 41 4.3 Specifications common to all media 41 4.3.1 Signalling speed .41 4.3.2 Propagation delays 4.3.3 Transceiver interface 41 4.3. 4 Redundant medium (option) .42 4. 4 Electrical Short Distance medium(choice) 43 4.4.1 ESD topology 43 4.4.2 ESD configuration rules 44 4.4.3 ESD section specifications 45 4.4.4 ESD shielding 45 4.4.5 ESD medium-dependent interface 46 4.4.6 ESD Line Unit specifications 48 4.4.7 ESD signal wave form 48 4.4.8 ESD transmitter 49 44.9 ESD receiver 50 4.5 Electrical Middle Distance medium(choice) 4.5. 1 EMD topology 51 4.5.2 EMD configuration rules 61375-3-1@|EC2012 4.5.3 EMD terminator 52 45.4 Cable section .52 4.5.5 EMD shielding 53 4.5.6 EMD medium-dependent interface ∴.54 4.5.7 EMD Line Unit specifications 57 4.5.8 EMD signal waveform ∴58 4.5. 9 EMD transmitter specifications 58 4.5. 10 EMD receiver specifications 62 4.6 Optical Glass Fibre medium (choice).... 63 4.6. 1 oGF topology.. 64 4.6.2 OGF optical cable and fi 64 4.6.3 OGF medium-dependent interface 64 4.6.4 OGF test signal (guideline) ..65 4.6.5 OGF transmitter specifications 66 4.6.6 OGF receiver specifications 66 4.6.7 OGF active star coupler 67 4.6.8 oGF double- ine layout( option)…… 68 5 Medium-dependent signalling 68 5.1 Frame encoding and decoding 68 5.1.1 Conventions 68 5.1.2 Bit encoding ..a:::..aaa:a 69 5.1.3 Non-data symbols 69 5. 1. 4 Start Bit 69 5.1.5 Start Delimiter 69 5.1. 6 End delimit 70 5.1.7 Valid frame(definition) 5.1.8 Detection of line idle B.a.8 71 5.1.9 Detection of collision 71 5.1.10 Receiver behaviour in case of error 71 5.1.11 Jabber halt 5.2 Line redundancy(option) 72 5.2.1 Principle 72 5.2.2 Redundant transmission 72 5.2.3 Redundant reception 72 5.2. 4 Switchover 72 5.2.5 Redundancy status report 73 5.3 Repeater 73 5.3.1 Repeater between single-line segments 74 5.3.2 Repeater for redundant medium(option) 74 6 Frames and telegrams 75 6.1 Frame format 75 6.1.1 Master Frame format 75 6.1.2 Slave frame format 75 6.1.3 Check Sequence.. 76 6.2 Telegram timing .77 6.2.1 Conventions 77 6.2.2 Reply delay(definition) 77 6.2.3 Frame spacing at the source 79 6.2.4 Frame spacing at the destination ..79 4 61375-3-1|EC:2012 6.2.5 Frame spacing at the master 80 6.3 Detection of correct frames, collision and silence by the maste 8 6.3.1 Correct frame(definition 6.3.2 Detection of collision by the master ...... 面 6.3.3 Detection of silence by the master.…… 7 Link Layer Control 7.1 Addressing 7.1.1 Device address 8888888 7.1.2 Logical_ Address 7.1.3 Group Address 2 7.2 Master frames contents 2 7.2.1 Master frame format .82 7.2.2 F code encoding.. .82 7.3 Slave frame contents ,83 7.3. 1 Slave frame format .83 73.2 Size error 84 7. 4 Telegram types 84 7.4.1 Process Data telegram .84 7.4.2 Message Data 85 7.4.3 Supervisory Data telegrams 86 8 Medium allocation .87 8.1 Organisation .87 8.1.1 Turn 87 8.1.2 Basic Period .87 8.1.3 Addin 88 8.2 Periodic Polling.. 88 8.2.1 Periodic list 88 8.2.2 Individual Period 88 8.2.3 Periodic phase construction 89 8.3 Event Polling 90 8.3.1 Group Address 90 8.3.2 Event round 91 8.3.3 Recommended event search algorithm 93 8.3.4 Supervisory Data frames for Event_ Arbitration 94 8.4 Devices scan 96 8.4.1 Device status ..96 8.4.2 Device Status protocol 98 8.4.3 Devices Scan protocol 9 Mastership transfer 99 9. 1 Mastership transfer operation 99 9.1.1 Bus administrator configuration .99 2 Mastership transfer specificat 100 9.2.1 States 100 9.2.2 Time-outs for mastership transfer 103 9.3 Supervisory data frames for mastership transfer .103 9.3. 1 Device status telegram 103 9.3.2 Mastership transfer telegram 104 10 Link Layer Interface 104 10.1 Link Layer layering 104 61375-3-1@|EC2012 5 10.2 Link Process data interface 105 10.3 Link Message Data interface 105 10.3.1 General 105 10.3.2 Priority.……… .106 10.3.3 Packet size .106 10.3.4 Protocol Type 106 10.3.5 Message Transport protocol 106 10.4 Link Supervision Interface .,106 10. 4.1 General 106 10.4.2 Link Supervision Interface procedures......... 106 10.4.3 Mvb Status .107 10.4.4 MVB Control 107 10.4.5 MVB Devices 108 10.4.6 mvb Administrator 108 10.4.7 MVB Report 110 11 Real-Time Protocols 111 12 Gateway Function 111 13 Network Management 13.1 Contents of this clause 111 13.2 MVB Managed objects .11 13.2.1 MVB link objects 111 13.3 MVB Services and management messages 112 13.3.1 MVB link services 112 Bibliography 126 Figure 1- Reference device and structure of the document Figure 2- State transition example 37 Figure 3-MVB configuration 39 Figure 4-Transceiver interface 42 Figure 5-EXample of ESD segment 43 Figure 6-Example of terminator. 44 Figure 7-ESD backplane section(double-line) 46 Figure 8-ESD connector arrangement ..47 Figure 9- ESD terminator connector arrangement .48 Figure 10-Example of start of frame(ESD).. 49 Figure 11-End of an ESD frame(both cases) 50 Figure 12- EMD medium 51 Figure 13- Shielding(single-line segment).. 53 Figure 14- Single-line device attachment 54 Figure 15- Double-line device attachment to EMD 55 Figure 16-EMD connectors arrangement .56 Figure 17-EMD terminator strapping.... 57 Figure 18-Example of start of an emd frame ..58 Figure 19- Example of pulse waveform at EMD transmitter 60 Figure 20- Example of end of emd frame... 61 Figure 21- emd receiver test signal 62 6 61375-3-1|EC:2012 Figure 22-Optical link .64 Figure 23-Optical connector(dimensions in millimeters) 65 Figure 24-Example of start of oGF frame 66 Figure25- Edge jitter.…,……… 67 Figure 26-Example of active star coupler 67 Figure 27- Example of a duplicated star coupler 68 Figure 28-0" 1"data encoding 69 Figure 29- Non Data symbols encoding 69 Figure 30- Master Start delimiter 70 Figure 31- Slave Start Delimit 70 Figure 32- Example of End Delimiter for EMD medium Figure 33- Example of a valid frame(OGF medium) Figure 34- Signal skew...... .72 Figure 35- Example of repeater for single-line attachment Figure 36- Example of repeater connecting a double-line to a single line segment 75 Figure 37- Master Frame Format 75 Figure 38-Slave Frames Figure 39 -Telegram timing .77 Figure 40-Example of Reply delay 78 Figure 41- Frame spacing at the source side Figure 42-Frame spacing at the destination(s) 79 Figure 43- Frame spacing at the master side 80 Figure 44-Master Frame contents .82 Figure 45-Word ordering in a Slave Frame .84 Figure 46- Process data telegram 84 Figure 47-Message Data telegram 85 Figure48- Supervisory Data telegram…… Figure 49- Basic Periods 87 Figure 50-Example of construction of the Macro_ Cycle .90 Figure 51-General Event Request frame format 94 Figure 52- Group_ Event_ Request frame(M=6,C=ABCDEF) 94 Figure 53- Single_Event_ Request frame 95 Figure 54-Event Identifier Response frame 95 Figure 55- Device Status Request ..96 Figure 56-Device Status Response..... 96 Figure 57- Device Status of Class 1 device ..97 Figure 58- Device Status of Class 2/3/4/5 device .97 Figure 59-Device Status of a device with Bus Administrator capability 97 Figure 60- Device Status of a device with Gateway capability 98 Figure 61-Mastership Transfer states .102 Figure 62- Device Status_ Request(sent by current master) 103 Figure63- Device_ Status Response( sent by proposed master).……,… 103 Figure 64 -MastershipTransfer_ Request(sent by current master) 104 61375-3-1@|EC2012 7 Figure 65-Mastership Transfer Response(sent by proposed next master) 104 Figure 66-Link Layer Layering .105 Table 1 -Template for the specification of an interface procedure........ 34 Table 2-Example of message structure 35 Table 3-Example of textual message form (corresponding to Table 2) .36 Table 4-State transitions table 37 Table 5-MVB devices capabilities .40 Table 6- Pin assignment for the ESD connector 47 Table 7-Pin assignment for the EMD connector .56 Table 8-Master Frame types and F code 83 Table 9-LS RESULT encoding 107 Table 10-MVB Status object ,107 Table 11-MVB Control object 108 Table 12 -MVB Devices object 108 Table 13-Mvb Administrator object 109 Table 14-LS V REPORT encoding 111 Table 15-Example of mvb administrator list ..123 61375-3-1|EC:2012 INTERNATIONAL ELECTROTECHNICAL COMMISSION ELECTRONIC RAILWAY EQUIPMENT TRAIN COMMUNICATION NETWORK TCN) Part 3-1: Multifunction Vehicle Bus(MVB) FOREWORD 1) The International Electrotechnical Commission(IEC) is a worldwide organization for standardization comprising all national electrote chnical committees(IEC National Committees). The object of IEc is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS and Guides(hereafter referred to as"lEC Publication(s). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (Iso) in accordance with conditions determined by agreement between the two organizations 2) The formal decisions or agreements of iEc on te chnical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested Ec national committees 3)IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasona ble efforts are made to ensure that the technical content of iec Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4)In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter 5)EC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to lEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies 6) All users should ensure that they have the latest edition of this publication 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or ther damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications 8 Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject af patent rights. IEC shall not be held res ponsible for identifying any or all such patent rights International Standard IEc 61375-3-1 has been prepared by iec technical committee 9 Electrical equipment and systems for railways This first edition cancels and replaces the clauses of lEC 61375-1, second edition, published in 2007, relevant to the specification of mvb and constitutes a technical revision It was prepared taking into account ieC 61375-1 third edition The text of this standard is based on the following documents FDIS Report on voting 9/1644/FD|S 9/1668/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table

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