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(JEDEC Package)

Data Sheet

Rev. 1.4

80-36-00592

May 2008

SanDisk Corporation

Corporate Headquarters • 601 McCarthy Boulevard • Milpitas, CA 95035

Phone (408) 801-1000 • Fax (408) 801-8657

www.sandisk.com

Rev. 1.4 SanDisk iNAND Data Sheet

SanDisk

® Corporation general policy does not recommend the use of its products in life support applications where in a failure

or malfunction of the product may directly threaten life or injury. Per SanDisk Terms and Conditions of Sale, the user of SanDisk

products in life support applications assumes all risk of such use and indemnifies SanDisk against all damages. See “Disclaimer

of Liability.”

This document is for information use only and is subject to change without prior notice. SanDisk Corporation assumes no

responsibility for any errors that may appear in this document, nor for incidental or consequential damages resulting from the

furnishing, performance or use of this material. No part of this document may be reproduced, transmitted, transcribed, stored in

a retrievable manner or translated into any language or computer language, in any form or by any means, electronic,

mechanical, magnetic, optical, chemical, manual or otherwise, without the prior written consent of an officer of SanDisk

Corporation.

All parts of the SanDisk documentation are protected by copyright law and all rights are reserved.

SanDisk and the SanDisk logo are registered trademarks of SanDisk Corporation. Product names mentioned herein are for

identification purposes only and may be trademarks and/or registered trademarks of their respective companies.

SanDisk products are covered or licensed under one or more of the following U.S. Patent Nos. 5,070,032; 5,095,344; 5,168,465;

5,172,338; 5,198,380; 5,200,959; 5,268,318; 5,268,870; 5,272,669; 5,418,752; 5,602,987. Other U.S. and foreign patents

awarded and pending.

80-36-00592. May 2008. Printed in U.S.A

Revision History

• February 2007 Revision 1.0—Preliminary draft of initial release

• March 2007Revsision 1.1—Preliminary datasheet release

• July 2007 Revision 1.2—iNAND ball array, mechanical and electrical specifications and ordering info updated. Ball and

signal names changed (FCAP changed to CREG, VDD_H changed to VDDH, VDD_F changed to VDDF) ball address

grids revised (to conform to JEDEC format)

• November 2007 Revision 1.3 - User Area DOS Image Parameters corrected for 1GB and 8GB; System performance: note

added regarding SDIN2C1-512M; Ball W5 name corrected to CMD; Figure 7 – correction in enumeration shown inside the

highlighted balls; Marking section added.

• May 2008 Revision 1.4 – updated for 16GB, User Area DOS Image Parameters updated

Rev. 1.4

SanDisk iNAND Data Sheet

TABLE OF CONTENTS

1. Introduction ...........................................................................................................................5

1.1. General Description........................................................................................................5

1.2. Features.........................................................................................................................6

1.3. Document Scope............................................................................................................6

1.4. iNAND Standard.............................................................................................................6

1.5. Functional Description....................................................................................................7

1.6. Technology Independence.............................................................................................7

1.7. Defect and Error Management.......................................................................................7

1.8. Wear Leveling ................................................................................................................7

1.9. Automatic Sleep Mode ...................................................................................................7

1.10. iNAND — SD Bus Mode.................................................................................................8

1.11. SPI Mode .......................................................................................................................9

2. Product Specifications .......................................................................................................10

2.1. Overview ......................................................................................................................10

2.2. Typical Power Requirements .......................................................................................10

2.3. Operating Conditions....................................................................................................10

2.3.1. Operating and Storage Temperature Specifications ..................................................... 10

2.3.2. Moisture Sensitivity........................................................................................................ 10

2.4. System Performance....................................................................................................11

2.5. Physical Specifications.................................................................................................12

3. iNAND Interface Description..............................................................................................14

3.1. iNAND Ball Array..........................................................................................................14

3.2. Pins and Signal Description .........................................................................................15

3.3. Bus Topologies.............................................................................................................16

3.4. Electrical Interface........................................................................................................16

3.4.1. Power Up .......................................................................................................................16

3.4.2. Bus Operating Conditions..............................................................................................16

3.4.3. Bus Timing (Default)...................................................................................................... 16

3.4.4. Bus Timing (High-Speed Mode) .................................................................................... 16

3.5. iNAND Registers..........................................................................................................16

3.5.1. Operating Conditions Register....................................................................................... 17

3.5.2. Card Identification Register ........................................................................................... 17

3.5.3. Card Specific Data Register .......................................................................................... 18

3.5.4. Card Status Register .....................................................................................................21

Rev. 1.4

SanDisk iNAND Data Sheet

3.5.5. SD Status Register ........................................................................................................ 21

3.5.6. Relative Card Address Register .................................................................................... 21

3.5.7. SD Card Configuration Register ....................................................................................21

3.5.8. SD Card Registers in SPI Mode ....................................................................................21

3.6. Data Interchange Format and Card Sizes....................................................................21

4. iNAND Protocol Description ..............................................................................................23

4.1. General Description......................................................................................................23

4.2. SD Bus Protocol...........................................................................................................23

4.3. Functional Description..................................................................................................23

4.3.1. Identification Mode.........................................................................................................23

4.3.2. Data Transfer Mode.......................................................................................................23

4.3.3. Clock Control ................................................................................................................. 23

4.3.4. Cyclic Redundancy Codes............................................................................................. 23

4.3.5. Error Conditions.............................................................................................................24

4.3.6. Commands..................................................................................................................... 24

4.3.7. State Transition.............................................................................................................. 24

4.3.8. Timing Diagrams and Values......................................................................................... 24

4.3.9. Speed Class Specification............................................................................................. 24

4.3.10. Erase Timeout Calculation............................................................................................. 24

5. Appendix - Power Delivery and Capacitor Specifications ..............................................25

5.1. SanDisk iNAND Power Domains..................................................................................25

5.2. Capacitor Connection Guidelines.................................................................................25

5.2.1. CREG Connections .......................................................................................................25

6. Appendix - Ordering Information.......................................................................................27

6.1. iNAND (JEDEC Package) ............................................................................................27

7. Appendix - Marking.............................................................................................................28

Disclaimer of Liability...............................................................................................................29

How to Contact Us....................................................................................................................30

Rev. 1.4

Introduction

SanDisk iNAND Data Sheet

1. INTRODUCTION

1.1. General Description

SanDisk iNAND combines SanDisk’s advanced MLC NAND flash with SanDisk’s controller

and flash management technology, providing a highly reliable, high performance on-board mass

storage device.

Designed specifically for mobile multimedia applications, iNAND is the most mature on board

SD/MMC device since 2005, providing mass storage of up to 16 GB in JEDEC compatible form

factors, with low power consumption and high performance that are an ideal solution for

multimedia handsets of 2.5G and up.

MLC NAND Flash is the ideal storage medium for portable, battery-powered devices. It features

low power consumption and is non-volatile, requiring no power to maintain the stored data. It

also has a wide operating range for temperature, shock and vibration.

SanDisk iNAND is well-suited to meet the needs of small, low power, electronic devices. With

form factors measuring 11.5mm x 13mm, 12mm x 16mm and 12mm x 18mm, JEDEC

compatible and 169, 0.5mm ball pitch, iNAND is fit for a wide variety of portable devices like

multi-media mobile handsets, personal media players, GPS devices and more.

To support this wide range of applications, iNAND is offered with an SD Interface. The SD

interface is widely adopted by all leading industry chipsets, and provides a 4-bit high-speed data

bus for maximum performance. For compatibility with existing controllers, the iNAND offers, in

addition to these interfaces, an alternate communication-protocol based on the SPI standard.

These interfaces allow for easy integration into any design, regardless of which type of

microprocessor is used. All device and interface configuration data (such as maximum frequency

and card identification) are stored on the device.

The SanDisk iNAND provides up to 16 GB of memory for use in mass storage applications. In

addition to the mass-storage-specific flash memory chip, iNAND includes an intelligent

controller, which manages interface protocols, data storage and retrieval, error correction code

(ECC) algorithms, defect handling and diagnostics, power management, wear leveling, and clock

control.

Figure 1 is a block diagram of the SanDisk iNAND with SD/SPI Interface.

Figure 1 - SanDisk iNAND Block Diagram

SD Bus/SPI Bus

Interface

Flash

Memory

SanDisk

Single Chip

Controller

Control

Data In/Out

SanDisk iNAND2

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