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qcc3034_vfbga_data_sheet.zip （1个子文件）

qcc3034_vfbga_data_sheet.pdf 1.59MB

Device description

■

High-performance programmable Bluetooth

stereo audio

SoC with Qualcomm

aptX

™

audio

■

Fully qualified single-chip dual-mode Bluetooth v5.0

system

■

Tri-core processor architecture with low power for

extended battery life

Applications

■

Wired/wireless stereo headsets/headphones

■

Qualcomm TrueWireless

™

stereo earbuds

Features

■

Qualified

to Bluetooth

v5.0

specification

■

120 MHz Qualcomm

Kalimba

™

audio DSP

■

32 MHz Developer

Processor for applications

■

Firmware Processor for

system

■

Flexible QSPI flash

programmable platform

■

Advanced audio algorithms

■

High-performance 24‑bit

stereo audio interface

■

Digital and analog

microphone interfaces

■

Flexible PIO controller and

LED pins with PWM support

■

1 or 2-mic Qualcomm

cVc

™

headset noise

reduction and echo

cancellation technology

■

aptX, aptX HD, aptX Low

Latency, SBC, and AAC

audio codecs support

■

Serial interfaces: UART, Bit

Serializer (I²C/SPI),

USB 2.0

■

Integrated PMU: Dual

SMPS for system/digital

circuits, Integrated Li-ion

battery charger

■

90-ball 5.5 x 5.5 x 1.0 mm,

0.5 mm pitch VFBGA

System architecture

XTAL

Ext Memory

Bluetooth

Radio

Digital

Audio

Interface

I/O

and

USB

Qualcomm

Kalimba™

DSP

Apps

Developer

Processor

Apps

Firmware

Processor

UART/USB

PIO

I²C/SPI

Stereo HQ

ADC

Stereo

Class-D or

Class-AB

Headphones

Line Out

LED Driver

with PWM

SMPS

LDOs

Li-Ion

Charger

Line In / Dual

Analog Mic In

Headphones

Line Out

I²S/PCM

Battery

LED

DigMic

Confidential and Proprietary – Qualcomm Technologies International, Ltd.

NO PUBLIC DISCLOSURE PERMITTED: Please report postings of this document on public servers or websites to DocCtrlAgent@qualcomm.com.

Restricted Distribution: Not to be distributed to anyone who is not an employee of either Qualcomm T

echnologies International, Ltd. or its affiliated companies

without the express approval of Qualcomm Configuration Management.

Not to be used, copied, reproduced, or modified in whole or in part, nor its contents revealed in any manner to others without the express written permission of

Qualcomm Technologies International, Ltd.

All Qualcomm products mentioned herein are products of Qualcomm Technologies, Inc. and/or its subsidiaries. All Qualcomm products mentioned herein are

products of Qualcomm Technologies, Inc. and/or its subsidiaries.

Qualcomm and Qualcomm TrueWireless are trademarks of Qualcomm Incorporated, registered in the United States and other countries. Kalimba and Kymera are

trademarks of Qualcomm Technologies International, Ltd. aptX and cVc are trademarks of Qualcomm Technologies International, Ltd., registered in the United

States and other countries. Other product and brand names may be trademarks or registered trademarks of their respective owners.

This technical data may be subject to U.S. and international export, re-export, or transfer ("export") laws. Diversion contrary to U.S. and international law is strictly

prohibited.

Qualcomm Technologies International, Ltd. (formerly known as Cambridge Silicon Radio Limited) is a company registered in England and Wales with a registered

office at: Churchill House, Cambridge Business Park, Cowley Road, Cambridge, CB4 0WZ, United Kingdom.

Registered Number: 3665875 | VAT number: GB787433096

QCC3034 VFBGA

Production Information

Data Sheet

80-CG234-1 Rev. AA

June 19, 2018

General descripon

QCC3034 VFBGA is a system on-chip (SoC) with on-chip Bluetooth, audio and programmable application processor.

includes high-performance, analog, and digital audio codecs, Class-AB and Class-D headphone drivers, advanced

power management, Li-ion battery charger, light-emitting diode (LED) drivers, and flexible interfaces including inter-

integrated circuit sound (I²S), inter-integrated circuit interface (I²C), universal asynchronous receiver transmitter

(UART), and programmable input/output (PIO).

An application-dedicated Developer Processor and a system Firmware Processor run code from an external quad

serial peripheral interface (QSPI) flash. Both processors have tightly coupled memory (TCM) and an on-chip cache

for performance while executing from external flash memory. The system Firmware Processor provides functions

developed by Qualcomm Technologies International, Ltd. (QTIL). The Developer processor provides flexibility to the

product designer to customize their product.

The Audio subsystem contains a programmable Kalimba core running Qualcomm

Kymera

™

system DSP

architecture framework from read only memory (ROM). A range of audio processing capabilities are provided from

ROM which are configurable in fully flexible audio graphs.

The flexibility provided by the programmable applications processor plus the ability to configure the audio processor

enables manufacturers to easily differentiate products with new features.

QCC3034 VFBGA is driven by a flexible, software platform with powerful integrated development environment (IDE)

support. This enables rapid time-to-market.

For more information on development tools and audio development kit (ADK)s for the QCC3034 VFBGA, including

information on Bluetooth and other features supported, see createpoint.qti.qualcomm.com.

80-CG234-1 Rev. AA Confidential and Proprietary – Qualcomm Technologies International, Ltd.

Y CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION

Ordering informaon

Device

Package

Order number

Type Size Shipment method

QCC3034 VFBGA

VFBGA 90-ball

(Pb

free)

5.5 x 5.5 x 1.0 mm

0.5 mm pitch

Tape and reel QCC3034-0-CSP90

NOTE

Your attention is drawn to QTIL’s Terms of Supply, see http://www

.qualcomm.com/salesterms or please

request a copy), in particular the section covering Product Warranties & Disclaimers. Please note that

the product warranty differs for production, pre-production, and other versions.

Production status minimum order quantity is 2 kpcs.

Supply chain: QTIL's manufacturing policy is to multisource volume products. For further details,

contact your local sales account manager or representative.

QCC3034 VFBGA Development Kit ordering in

formaon

QTIL supplies QCC3034 VFBGA development equipment.

Description Model Order number

QCC3034 VFBGA Development Kit DK-QCC3034-VFBGA90-A-0 65-CF988-340

TRBI200 Transaction Bridge Interface High-

Speed

Debug Adaptor and Programmer

DK-TRBI200-CE684-1 65-CE684-1

The QCC3034 VFBGA Development Kit, includes a flexible development board that has a wide range of

interconnects,

and QCC3034 VFBGA mounted on a plug-in module.

TRBI200 is a high-speed universal serial bus (USB) to transaction bus interface that supports high-speed debug and

flash programming.

NOTE

TRBI200 use is not mandatory for flash programming or other manufacturing operations. Those actions

are performable using direct USB connection to the QCC3034 VFBGA USB device interface.

QTIL contacts

General information www.qualcomm.com

Information on this product qcsales@qti.qualcomm.com

Customer support for this product createpoint.qti.qualcomm.com

Details of compliance and standards product.compliance@qti.qualcomm.com

Help with this document document.feedback@qti.qualcomm.com

80-CG234-1 Rev. AA Confidential and Proprietary – Qualcomm Technologies International, Ltd.

Y CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION

Device details

Audio subsystem

■

32‑bit

Kalimba audio digital signal processor (DSP) core

with flexible clocking from 2 MHz to 120 MHz to allow

optimization and trade-off performance vs. power

consumption

■

DSP runs from ROM

■

80 KB program random access memory (RAM)

■

256 KB data RAM

■

5 Mb ROM

Application subsystem

■

Dual core application subsystem 32 MHz operation

■

32‑bit Firmware Processor:

□

Reserved for system use

□

Runs Bluetooth upper stack, profiles, house-keeping

code

■

32‑bit Developer Processor:

□

Runs developer applications

■

Both cores execute code from external flash memory using

QSPI clocked at 32 MHz

■

On-chip caches per core allow for optimized performance

and power consumption

Bluetooth subsystem

■

Qualified to Bluetooth v5.0 specification including 2 Mbps

Bluetooth low energy (Production parts)

■

Single ended antenna connection with on-chip balun and

Tx/Rx switch

■

Bluetooth, Bluetooth low energy, and mixed topologies

supported

■

Class 1 support

Li-ion battery charger

■

Integrated

battery charger supporting internal mode (up to

200 mA) and external mode (up to 1.8 A)

■

Variable float (or termination) voltage adjustable in 50 mV

steps from 3.65 V to 4.4 V

■

Thermal monitoring and management are implementable

in application software

■

Pre-charge to fast charge transition configurable at 2.5 V,

2.9 V, 3.0 V, and 3.1 V

Power management

■

Integrated power management unit (PMU) to minimize

external components

■

QCC3034 VFBGA runs directly from a Li-ion, USB, or

external supply (2.8 V to 6.5 V)

■

Auto-switching between battery and USB (or other)

charging source

■

Power islands employed to optimize power consumption

for variety of use-cases

■

Dual switch-mode power supply (SMPS):

□

Automatic mode selection to minimize power

consumption

□

1.8 V SMPS generates power for both the device and

off-chip circuits

□

Dedicated digital SMPS (output voltage changes

automatically to minimize device power consumption)

80-CG234-1 Rev. AA Confidential and Proprietary – Qualcomm Technologies International, Ltd.

Y CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION

Audio engine and digital audio interfaces

■

x bidirectional 24‑bit I²S interface

■

Programmable audio master clock (MCLK)

■

Stereo analog outputs configurable as differential Class-

AB headphone outputs or differential high efficiency Class-

D outputs:

□

Class-D signal-to-noise ratio (SNR): 98.3 dBA typ.

□

Class-D total harmonic distortion plus noise (THD

+N): -87.5 dB typ.

□

Class-AB SNR: 101 dBA typ.

□

Class-AB THD+N: -90.5 dB typ.

■

Dual analog inputs configurable as single ended line inputs

or, unbalanced or balanced analog microphone inputs:

□

SNR single-ended: 101 dBA typ.

□

THD+N single-ended: -85 dB typ.

■

1 microphone bias (single bias shared by the two

channels):

□

Crosstalk attenuation between two inputs using

recommended application circuit: 65 dB

■

Digital microphone inputs with capability to interface up to

6 digital microphones

■

Both analog-to-digital converter (ADC)s and digital-to-

analog converter (DAC)s support sample rates of 8, 16,

32, 44.1, 48, 96 kHz. DACs also support 192 kHz.

Peripherals and physical interfaces

■

UART interface

■

2 x Bit Serializers (programmable serial peripheral

interface (SPI) and I²C hardware accelerator)

■

1 x USB interface:

□

A full speed USB (USB-FS) Device (12 Mbps)

– USB interface includes ESD protection to

IEC-61000-4-2 (device level)

■

QSPI NOR flash interface

□

QSPI encryption to protect developer code and data

□

Encryption programmable with a 128‑bit security key of

original equipment manufacturer (OEM) choice stored in

on-chip one-time programmable (OTP) memory

■

Up to 20 PIO and 5 open drain/digital input LED pads with

pulse width modulation (PWM)

Package and compliance

■

90-ball 5.5 x 5.5 x 1.0 mm, 0.5 mm pitch VFBGA

■

Green (restriction of hazardous substances (RoHS)

compliant and no antimony or halogenated flame

retardants)

QCC3034 VFBGA Data Sheet Device details

80-CG234-1 Rev. AA Confidential and Proprietary – Qualcomm Technologies International, Ltd.

Y CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION

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