Document No. U19018EJ1V0UD00 (1st edition)
Date Published December 2007 N CP(K)
Printed in Japan
2007
μ
PD78F1201
μ
PD78F1203
78K0R/IB3
16-bit Single-Chip Microcontrollers
Preliminary User’s Manual
The 78K0R/IB3 has an on-chip debug function.
Do not use this product for mass production because its reliability cannot be guaranteed after the on-chip debug function
has been used, due to issues with respect to the number of times the flash memory can be rewritten. NEC Electronics
does not accept complaints concerning this product after the on-chip debug function has been used.
Preliminary User’s Manual U19018EJ1V0UD
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[MEMO]
Preliminary User’s Manual U19018EJ1V0UD
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VOLTAGE APPLICATION WAVEFORM AT INPUT PIN
Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the
CMOS device stays in the area between V
IL
(MAX) and V
IH
(MIN) due to noise, etc., the device may
malfunction. Take care to prevent chattering noise from entering the device when the input level is fixed,
and also in the transition period when the input level passes through the area between V
IL
(MAX) and
V
IH
(MIN).
HANDLING OF UNUSED INPUT PINS
Unconnected CMOS device inputs can be cause of malfunction. If an input pin is unconnected, it is
possible that an internal input level may be generated due to noise, etc., causing malfunction. CMOS
devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed
high or low by using pull-up or pull-down circuitry. Each unused pin should be connected to V
DD
or GND
via a resistor if there is a possibility that it will be an output pin. All handling related to unused pins must
be judged separately for each device and according to related specifications governing the device.
PRECAUTION AGAINST ESD
A strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as
much as possible, and quickly dissipate it when it has occurred. Environmental control must be
adequate. When it is dry, a humidifier should be used. It is recommended to avoid using insulators that
easily build up static electricity. Semiconductor devices must be stored and transported in an anti-static
container, static shielding bag or conductive material. All test and measurement tools including work
benches and floors should be grounded. The operator should be grounded using a wrist strap.
Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for
PW boards with mounted semiconductor devices.
STATUS BEFORE INITIALIZATION
Power-on does not necessarily define the initial status of a MOS device. Immediately after the power
source is turned ON, devices with reset functions have not yet been initialized. Hence, power-on does
not guarantee output pin levels, I/O settings or contents of registers. A device is not initialized until the
reset signal is received. A reset operation must be executed immediately after power-on for devices
with reset functions.
POWER ON/OFF SEQUENCE
In the case of a device that uses different power supplies for the internal operation and external
interface, as a rule, switch on the external power supply after switching on the internal power supply.
When switching the power supply off, as a rule, switch off the external power supply and then the
internal power supply. Use of the reverse power on/off sequences may result in the application of an
overvoltage to the internal elements of the device, causing malfunction and degradation of internal
elements due to the passage of an abnormal current.
The correct power on/off sequence must be judged separately for each device and according to related
specifications governing the device.
INPUT OF SIGNAL DURING POWER OFF STATE
Do not input signals or an I/O pull-up power supply while the device is not powered. The current
injection that results from input of such a signal or I/O pull-up power supply may cause malfunction and
the abnormal current that passes in the device at this time may cause degradation of internal elements.
Input of signals during the power off state must be judged separately for each device and according to
related specifications governing the device.
NOTES FOR CMOS DEVICES
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Preliminary User’s Manual U19018EJ1V0UD
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Windows and Windows NT are registered trademarks or trademarks of Microsoft Corporation in the United
States and/or other countries.
PC/AT is a trademark of International Business Machines Corporation.
EEPROM is a trademark of NEC Electronics Corporation.
SuperFlash is a registered trademark of Silicon Storage Technology, Inc. in several countries including the
United States and Japan.
Caution: This product uses SuperFlash
®
technology licensed from Silicon Storage Technology, Inc.
The information contained in this document is being issued in advance of the production cycle for the
product. The parameters for the product may change before final production or NEC Electronics
Corporation, at its own discretion, may withdraw the product prior to its production.
Not all products and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
No part of this document may be copied or reproduced in any form or by any means without the prior written consent
of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document.
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rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC Electronics or others.
Descriptions of circuits, software and other related information in this document are provided for illustrative purposes
in semiconductor product operation and application examples. The incorporation of these circuits, software and
information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC
Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of
these circuits, software and information.
While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products,
customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products,
customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and
anti-failure features.
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The "Specific" quality grade applies only to NEC Electronics products developed based on a customer-designated
"quality assurance program" for a specific application. The recommended applications of an NEC Electronics
products depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC
Electronics product before using it in a particular application.
•
•
•
•
•
•
•
M5D 02. 11-1
The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC
Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications
not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to
determine NEC Electronics' willingness to support a given application.
(Note)
(1)
(2)
"NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
majority-owned subsidiaries.
"NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
Computers, office equipment, communications equipment, test and measurement equipment, audio and
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Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support
systems and medical equipment for life support, etc.
"Standard":
"Special":
"Specific":
Preliminary User’s Manual U19018EJ1V0UD
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INTRODUCTION
Readers This manual is intended for user engineers who wish to understand the functions of the
78K0R/IB3 and design and develop application systems and programs for these
devices.
The target products are as follows.
78K0R/IB3:
μ
PD78F1201, 78F1203
Purpose This manual is intended to give users an understanding of the functions described in the
Organization below.
Organization The 78K0R/IB3 manual is separated into two parts: this manual and the instructions
edition (common to the 78K0R Microcontroller Series).
78K0R/IB3
User’s Manual
(This Manual)
78K0R Microcontroller
User’s Manual
Instructions
• Pin functions
• Internal block functions
• Interrupts
• Other on-chip peripheral functions
• Electrical specifications (target)
• CPU functions
• Instruction set
• Explanation of each instruction
How to Read This Manual It is assumed that the readers of this manual have general knowledge of electrical
engineering, logic circuits, and microcontrollers.
• To gain a general understanding of functions:
→ Read this manual in the order of the CONTENTS.
• How to interpret the register format:
→ For a bit number enclosed in angle brackets, the bit name is defined as a
reserved word in the RA78K0R, and is defined as an sfr variable using the
#pragma sfr directive in the CC78K0R.
• To know details of the 78K0R Series instructions:
→ Refer to the separate document 78K0R Microcontroller Instructions User’s
Manual (U17792E).
