PICMG
®
COM.0
COM Express
®
Module Base Specification
Revision 3.0
March 31, 2017
© 2005, 2010, 2011, 2012, 2016, 2017 PCI Industrial Computer Manufacturers
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adoption of PICMG
®
specifications may require use of an invention covered by patent
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®
shall not be responsible for identifying patents for which a license may
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®
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®
specifications are prospective and advisory only. Prospective users are responsible for
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NOTICE:
The information contained in this document is subject to change without notice. The
material in this document details a PICMG
®
specification in accordance with the license
and notices set forth on this page. This document does not represent a commitment to
implement any portion of this specification in any company's products.
WHILE THE INFORMATION IN THIS PUBLICATION IS BELIEVED TO BE ACCURATE, PICMG
®
MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS
MATERIAL INCLUDING, BUT NOT LIMITED TO, ANY WARRANTY OF TITLE OR
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FOR PARTICULAR PURPOSE OR USE.
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®
be liable for errors contained herein or for indirect, incidental,
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data or use, incurred by any user or any third party. Compliance with this specification
does not absolve manufacturers of equipment from the requirements of safety and
regulatory agencies (UL, CSA, FCC, IEC, etc.).
IMPORTANT NOTICE:
This document includes references to specifications, standards or other material not
created by PICMG. Such referenced materials will typically have been created by
organizations that operate under IPR policies with terms that vary widely, and under
process controls with varying degrees of strictness and efficacy. PICMG has not made
any enquiry into the nature or effectiveness of any such policies, processes or controls,
and therefore ANY USE OF REFERENCED MATERIALS IS ENTIRELY AT THE RISK OF THE
USER. Users should therefore make such investigations regarding referenced materials,
and the organizations that have created them, as they deem appropriate.
PICMG®, CompactPCI®, AdvancedTCA®, AdvancedTCA® 300,ATCA®, ATCA® 300,
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Manufacturers Group. All other brand or product names may be trademarks or
registered trademarks of their respective holders.
Contents
Contents
1 Introduction...................................................................................................................................1
1.1 Objective.......................................................................................................................................................2
1.2 COM.0 R3.0 Changes from R2.1....................................................................................................................3
1.3 Name and Logo Usage...................................................................................................................................4
1.4 Intellectual Property.....................................................................................................................................5
1.4.1 Necessary Claims (referring to mandatory or recommended features)....................................5
1.4.2 Unnecessary Claims (referring to optional features or non-normative elements)...................5
1.4.3 Third Party Disclosures...............................................................................................................6
1.5 Copyright Notice...........................................................................................................................................7
1.5.1 Trademarks.................................................................................................................................7
1.6 Acronyms / Definitions..................................................................................................................................8
1.7 Applicable Documents and Standards.........................................................................................................11
1.8 Special Word Usage....................................................................................................................................13
1.9 Statement of Compliance............................................................................................................................14
2 Module Overview.........................................................................................................................15
2.1 Module Configuration.................................................................................................................................15
2.2 Feature Overview - Size...............................................................................................................................16
2.2.1 Mini Module.............................................................................................................................16
2.2.2 Compact Module......................................................................................................................16
2.2.3 Basic Module............................................................................................................................16
2.2.4 Extended Module.....................................................................................................................16
2.3 Feature Overview - Pin-Out Types..............................................................................................................18
2.3.1 Pin-Out Type 10........................................................................................................................18
2.3.2 Pin-Out Type 6..........................................................................................................................19
2.3.3 Pin-Out Type 7..........................................................................................................................19
3 Required and Optional Features...................................................................................................21
3.1 Module Pin-Out Type Definitions................................................................................................................21
3.2 Module Pin-Out Types 6-7 & 10 - Required and Optional Features............................................................22
3.3 Feature Fill Order........................................................................................................................................24
3.4 EAPI - Embedded Application Programming Interface................................................................................25
4 Signal Descriptions.......................................................................................................................27
4.1 Signal Naming Convention..........................................................................................................................27
4.2 Pin and Signal Buffer Types.........................................................................................................................27
4.2.1 Pin Types...................................................................................................................................27
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Contents
4.2.2 Buffer Types..............................................................................................................................27
4.2.3 Power Rails and Tolerances......................................................................................................28
4.3 Signal List....................................................................................................................................................29
4.3.1 High Definition Audio...............................................................................................................30
4.3.2 Gb Ethernet..............................................................................................................................31
4.3.3 NC-SI.........................................................................................................................................32
4.3.4 10Gb Ethernet..........................................................................................................................33
4.3.5 SDP Pins....................................................................................................................................37
4.3.6 Serial ATA.................................................................................................................................39
4.3.7 General Purpose PCI Express Lanes.........................................................................................40
4.3.8 PEG PCI Express Lanes..............................................................................................................41
4.3.9 USB...........................................................................................................................................42
4.3.10 LVDS Flat Panel.......................................................................................................................43
4.3.11 LPC and eSPI Interface............................................................................................................44
4.3.12 SPI Interface...........................................................................................................................46
4.3.13 BIOS Boot Selection................................................................................................................48
4.3.14 Analog VGA.............................................................................................................................52
4.3.15 Digital Display Interfaces (DDI) - Module Type 6 and 10.......................................................53
4.3.16 DDI Signals: DisplayPort.........................................................................................................58
4.3.17 DDI Signals: HDMI / DVI.........................................................................................................58
4.3.18 General Purpose Serial Interface...........................................................................................59
4.3.19 I2C Bus....................................................................................................................................60
4.3.20 Miscellaneous.........................................................................................................................61
4.3.21 Power and System Management...........................................................................................62
4.3.22 Rapid Shutdown.....................................................................................................................64
4.3.23 Thermal Protection................................................................................................................65
4.3.24 SM Bus....................................................................................................................................66
4.3.25 General Purpose Input Output...............................................................................................67
4.3.26 SDIO........................................................................................................................................68
4.3.27 Module Type Definition..........................................................................................................69
4.3.28 Power and Ground.................................................................................................................70
4.3.29 eDP - Embedded DisplayPort.................................................................................................71
4.3.30 CAN Bus..................................................................................................................................73
4.4 Signals Requiring Carrier Board Termination..............................................................................................74
4.4.1 Ethernet....................................................................................................................................74
4.4.2 Analog VGA...............................................................................................................................74
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®
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Base Specification - March 31, 2017
Contents
4.4.3 LVDS..........................................................................................................................................74
4.4.4 USB...........................................................................................................................................74
4.4.5 Digital Display Interfaces (DDI).................................................................................................75
4.4.6 VCC_RTC...................................................................................................................................76
4.4.7 EMI and ESD Mitigation............................................................................................................76
4.5 Signals Requiring Module Termination.......................................................................................................77
4.5.1 AC coupled on the Module.......................................................................................................77
4.5.2 Misc..........................................................................................................................................77
4.6 Pin-out Tables.............................................................................................................................................79
4.6.1 Type 10.....................................................................................................................................79
4.6.2 Type 6.......................................................................................................................................82
4.6.3 Type 7.......................................................................................................................................85
5 Module and Carrier Board Implementation Specifications............................................................89
5.1 PCI Express Link Configuration Definitions..................................................................................................89
5.2 PCI Express Link Configuration Guidelines..................................................................................................89
5.2.1 Type 7 Limitations....................................................................................................................93
5.3 COM Express EEPROMs...............................................................................................................................95
5.3.1 EEPROM Device Information....................................................................................................95
5.3.2 COM Express Module EEPROM................................................................................................95
5.3.3 COM Express Carrier Board EEPROM.......................................................................................95
5.4 Loss Budgets for High Speed Differential Interfaces...................................................................................96
5.4.1 PCI Express Insertion Loss Budget with Slot Card....................................................................98
5.4.2 PCI Express Insertion Loss Budget with Carrier Board PCIe Device.......................................100
5.4.3 SATA Insertion Loss Budget....................................................................................................103
5.4.4 USB 2.0 Insertion Loss Budget................................................................................................106
5.4.5 SuperSpeed USB Insertion Loss Budget.................................................................................107
5.4.6 10/100/1000 Ethernet Insertion Loss Budget........................................................................108
5.4.7 10Gb Ethernet Insertion Loss Performance...........................................................................109
5.4.8 DDI Trace Length Recommendation......................................................................................110
5.4.9 Carrier Board LPC Devices......................................................................................................112
5.5 SPI Devices................................................................................................................................................113
5.6 eSPI Devices..............................................................................................................................................114
5.7 Watchdog Timer........................................................................................................................................115
5.7.1 Output Modes and Characteristics........................................................................................115
5.7.2 Watchdog Enable and Strobe.................................................................................................115
5.8 Protecting COM.0 Pins Reclaimed from the VCC_12V Pool......................................................................116
PICMG
®
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®
Base Specification - March 31, 2017 v
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