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getting real 中文版

想构建一个成功的 Web 应用么? 那么正是时候 Getting Real. Getting Real 是一种更小规模,更 快速,更高质量的软件构建方法。
2011-11-17 上传大小:3.21MB
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Getting Real中文版

想构建一个成功的Web应用么? 那么正是时候Getting Real. Getting Real 是一种更小规模,更 快速,更高质量的软件构建方法。 • Getting Real是关于省略所有表达现实(图表,曲线,矩形,箭头,统计图),而构 建现实。 • Getting real 是追求精炼。更少的代码量,更少的软件,更少的功能,更少的文档工作, 更少无所谓的东西(而且大部分你认为必要的,其实不是)。 • Getting Real 是保持精益,变得敏捷。 • Getting Real从界面开始,也就是用户使用的屏幕。它从实际的用户体验开始,并且 构建似曾相识的体验。这让你在软件误入歧途之前得到正确的用户界面。 • Getting Real 是关于迭代和降低变化成本的方法。Getting Real基本上是关于上线,调 整,持续改进,其目标的开发Web软件的最佳途径。 • Getting Real只交付客户所需的,摒弃任何客户不需要的。

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Getting Real 中文版

Getting Real is the business, design, programming, and marketing philosophies of 37signals — a developer of web-based software used by over 1 million people and businesses in 70 countries.

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Getting Real 完整 完全中文版

网上的“Getting Real中文版”pdf版,中文翻译都不完整,最后一章还是英文的。我把最后一章的标准中文翻译整合进来,现在是完全中文的了。

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Getting Real

Getting Real - 37Signals.pdf

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GettingReal英文版

不再多说 需要的下 GettingReal_EN

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getting real

getting real 英文版, 著名美国创业团队37 signals 的创业建议

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实时计算机图形学(real-time rendering 2nd 中文版).part2

实时计算机图形学(real-time rendering 2nd 中文版).part2 北京大学出版社 普建涛

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Getting Started With Processing 中文版

Processing语言学习, Arduino硬件相关,用于图形3D及各种图片处理

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一份极好PCB的EMC设计指南+Get+EMC+Right+First+Time.pdf

Table of Contents 1. Grounding and Planes...................................................................................................... 7 1.1 Filters ............................................................................................................................ 7 1.2 Routing ......................................................................................................................... 8 1.3 Plane slots and boundaries .......................................................................................... 9 1.4 Decoupling capacitors ................................................................................................ 10 1.5 Power Distribution Network Impedance .................................................................... 11 2. High Speed Considerations ............................................................................................ 13 2.1 Identifying High Speed Signals ................................................................................... 13 2.2 Impedance .................................................................................................................. 14 2.2.1 Single Ended Characteristic Impedance ............................................................. 15 2.2.2 Differential Impedance ....................................................................................... 16 2.3 Terminations............................................................................................................... 18 2.3.1 Single Ended Terminations ................................................................................. 18 2.3.2 Differential Terminations ................................................................................... 20 2.4 Placement ................................................................................................................... 22 2.4.1 Partitioning ......................................................................................................... 22 2.4.2 Zoning ................................................................................................................. 22 2.4.3 Analog Buffers .................................................................................................... 23 2.5 Routing ....................................................................................................................... 24 2.5.1 Topology ............................................................................................................. 24 2.5.2 Bus Routing ......................................................................................................... 26 2.5.3 Corners ............................................................................................................... 28 2.5.4 Vias ..................................................................................................................... 28 2.5.5 Differential Routing ............................................................................................ 28 2.5.6 Proximity to Board Edge ..................................................................................... 30 2.6 Signal Timing ............................................................................................................... 31 2.6.1 Identifying time-critical signals ........................................................................... 31 2.6.2 Propagation time ................................................................................................ 32 2.6.3 Eye diagram analysis .......................................................................................... 32 2.7 Oscillators / Crystals ................................................................................................... 33 3. Crosstalk ......................................................................................................................... 35 3.1 Identifying Victims and Aggressors ........................................................................ 35 3.2 Layer Assignment ................................................................................................... 35 3.3 Orthogonality ......................................................................................................... 36 3.4 Parallelism .............................................................................................................. 36 3.5 Guarding ................................................................................................................. 37 3.6 Return paths ........................................................................................................... 38 3.7 Receiver Placement ................................................................................................ 39 4. EMC Considerations ....................................................................................................... 42 4.1 General Considerations .............................................................................................. 42 4.2 Components ............................................................................................................... 42 4.2.1 Component selection ......................................................................................... 43 4.2.2 High speed filters ................................................................................................ 43 4.2.3 Unused pins ........................................................................................................ 44 Page 5 of 76 Copyright © 2014 EMC FastPass 4.2.4 Heatsinks ............................................................................................................ 44 4.2.5 Shielded components ......................................................................................... 44 4.3 Power Supply .............................................................................................................. 45 4.3.1 Mains .................................................................................................................. 45 4.3.2 Voltage regulators .............................................................................................. 45 4.3.3 Switching mode power supplies ......................................................................... 46 4.4 Routing ....................................................................................................................... 47 4.4.1 Clock distribution ................................................................................................ 47 4.4.2 Guarding ............................................................................................................. 48 4.4.3 Stubs ................................................................................................................... 49 4.5 System design ............................................................................................................. 49 4.5.1 Chassis grounding ............................................................................................... 49 4.5.2 Cables ................................................................................................................. 50 4.5.3 Connectors ......................................................................................................... 51 4.6 ESD & Safety ............................................................................................................... 52 4.6.1 Connectors ......................................................................................................... 52 4.6.2 Sensitive pins .......................................................................................................... 54 4.6.3 High Voltage ........................................................................................................... 54 5. Design for Test ............................................................................................................... 55 5.1 Test Points .................................................................................................................. 55 5.2 Tooling Pins ................................................................................................................ 55 5.3 Push fingers ................................................................................................................ 56 5.4 Sealing ........................................................................................................................ 56 5.5 AOI .............................................................................................................................. 56 6. Design for Manufacture ................................................................................................. 57 6.1 Stackup ....................................................................................................................... 57 6.1.1 Symmetry ........................................................................................................... 57 6.1.2 Drill pairs ............................................................................................................. 57 6.1.3 Copper balance ................................................................................................... 58 6.2 Design Rules Check ..................................................................................................... 59 6.2.1 Clearance ............................................................................................................ 59 6.2.2 Width .................................................................................................................. 60 6.2.3 Annular Ring ....................................................................................................... 60 6.2.4 Slivers .................................................................................................................. 60 6.2.5 Acid Traps ........................................................................................................... 61 6.2.6 Silkscreen Over Pads ........................................................................................... 62 6.3 Mechanical ................................................................................................................. 62 6.3.1 Mechanical Drawings ......................................................................................... 62 6.3.2 Drill Drawings ..................................................................................................... 63 6.3.3 Slots .................................................................................................................... 63 6.3.4 Mounting holes .................................................................................................. 64 6.3.5 Panelization ........................................................................................................ 64 6.3.6 PCB manufacturing specifications ...................................................................... 65 6.4 Assembly Considerations ........................................................................................... 66 6.4.1 Assembly Flow .................................................................................................... 66 6.4.2 Stencils ................................................................................................................ 66 6.4.3 Panelized Assembly ............................................................................................ 67 6.4.4 Decals ................................................................................................................. 67 6.4.5 Fiducials .............................................................................................................. 68 Page 6 of 76 Copyright © 2014 EMC FastPass 6.4.6 Thermal Relief .................................................................................................... 69 6.4.7 Assembly drawings and BOM ............................................................................. 69 6.4.8 PCB Assembly Specifications .............................................................................. 70 6.5 Manufacturing files .................................................................................................... 71 6.5.1 Gerber ................................................................................................................. 71 6.5.2 NC Drill ................................................................................................................ 71 6.5.3 Pick & Place ........................................................................................................ 71 6.5.4 Test Point Report ................................................................................................ 71 7. Thermal considerations ................................................................................................. 72 7.1 Power Dissipation ....................................................................................................... 72 7.2 Heatsinks .................................................................................................................... 72 7.3 Cooling Areas .............................................................................................................. 73 7.4 Current Carrying Capacity .......................................................................................... 73 8. Helpful Utilities .............................................................................................................. 75 8.1 IPC7351 Land Pattern Calculator ................................................................................ 75 8.2 PCB Fabrication Wall Chart ......................................................................................... 75 8.3 PCB Calculators ........................................................................................................... 75 8.4 Filter Selection Simulator ........................................................................................... 76 8.5 Circuit Simulation Tools ...........................................................

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storm学习入门《Getting started with Storm》中英文版

这是书籍Getting started with Storm的中英文两个版本,大家可以参考对照学习哦

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Getting Started With MachineLearning (all in one)_V0.91

Getting Started With MachineLearning (all in one)_V0.91

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Real World Haskell 中文版

本文档是 Real World Haskell 一书的简体中文翻译版本

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Getting Real 学习笔记

很不错 适合创业的人 关于软件开发的一些东西

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getting real by 37signals

getting real by 37signals

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Getting Real by 37signals

Getting Real by 37signals

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getting real 读书笔记整理

getting real 读书笔记的整理

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Getting Started with Bluetooth Low Energy.pdf

Getting Started with Bluetooth Low Energy.pdf 低功耗蓝牙的开发

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Getting.Started.with.Storm.中文版,带书签

Getting.Started.with.Storm.中文版

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Getting Real - 37signals

关于企业管理的好书,篇幅简短,文字精悍,内容详实,值得阅读。

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real time rendering 第三版高清彩色

real time rendering 第三版高清彩色

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getting real 中文版

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