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FPGA_Zynq UltraScale+ MPSoC 数据手册:概述_(Xilinx).pdf
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FPGA_Zynq UltraScale+ MPSoC 数据手册:概述_(Xilinx).pdf
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DS891 (v1.8) October 2, 2019 www.xilinx.com
Product Specification 1
© Copyright 2015–2019 Xilinx, Inc. Xilinx, the Xilinx logo, Alveo, Artix, Kintex, Spartan, Versal, Virtex, Vivado, Zynq, and other designated brands included herein are
trademarks of Xilinx in the United States and other countries. AMBA, AMBA Designer, Arm, Arm1176JZ-S, CoreSight, Cortex, PrimeCell, Mali, and MPCore are trademarks
of Arm in the EU and other countries. PCI, PCIe, and PCI Express are trademarks of PCI-SIG and are used under license. All other trademarks are the property of their
respective owners.
General Description
The Zynq® UltraScale+™ MPSoC family is based on the Xilinx® UltraScale™ MPSoC architecture. This
family of products integrates a feature-rich 64-bit quad-core or dual-core Arm® Cortex™-A53 and
dual-core Arm Cortex-R5 based processing system (PS) and Xilinx programmable logic (PL) UltraScale
architecture in a single device. Also included are on-chip memory, multiport external memory interfaces,
and a rich set of peripheral connectivity interfaces.
Processing System (PS)
Arm Cortex-A53 Based Application
Processing Unit (APU)
• Quad-core or dual-core
• CPU frequency: Up to 1.5GHz
• Extendable cache coherency
• Armv8-A Architecture
o 64-bit or 32-bit operating modes
o TrustZone security
o A64 instruction set in 64-bit mode,
A32/T32 instruction set in 32-bit mode
• NEON Advanced SIMD media-processing engine
• Single/double precision Floating Point Unit (FPU)
• CoreSight™ and Embedded Trace Macrocell (ETM)
• Accelerator Coherency Port (ACP)
• AXI Coherency Extension (ACE)
• Power island gating for each processor core
• Timer and Interrupts
o Arm Generic timers support
o Two system level triple-timer counters
o One watchdog timer
o One global system timer
• Caches
o 32KB Level 1, 2-way set-associative
instruction cache with parity (independent for
each CPU)
o 32KB Level 1, 4-way set-associative data
cache with ECC (independent for each CPU)
o 1MB 16-way set-associative Level 2 cache
with ECC (shared between the CPUs)
Dual-core Arm Cortex-R5 Based
Real-Time Processing Unit (RPU)
• CPU frequency: Up to 600MHz
• Armv7-R Architecture
o A32/T32 instruction set
• Single/double precision Floating Point Unit (FPU)
• CoreSight™ and Embedded Trace Macrocell
(ETM)
• Lock-step or independent operation
• Timer and Interrupts:
o One watchdog timer
o Two triple-timer counters
• Caches and Tightly Coupled Memories (TCMs)
o 32KB Level 1, 4-way set-associative
instruction and data cache with ECC
(independent for each CPU)
o 128KB TCM with ECC (independent for each
CPU) that can be combined to become 256KB
in lockstep mode
On-Chip Memory
• 256KB on-chip RAM (OCM) in PS with ECC
• Up to 36Mb on-chip RAM (UltraRAM) with ECC in
PL
• Up to 35Mb on-chip RAM (block RAM) with ECC
in PL
• Up to 11Mb on-chip RAM (distributed RAM) in PL
Zynq UltraScale+ MPSoC Data Sheet:
Overview
DS891 (v1.8) October 2, 2019
Product Specification

Zynq UltraScale+ MPSoC Data Sheet: Overview
DS891 (v1.8) October 2, 2019 www.xilinx.com
Product Specification 2
Arm Mali-400 Based GPU
• Supports OpenGL ES 1.1 and 2.0
• Supports OpenVG 1.1
• GPU frequency: Up to 667MHz
• Single Geometry Processor, Two Pixel Processors
• Pixel Fill Rate: 2 Mpixels/sec/MHz
• Triangle Rate: 0.11 Mtriangles/sec/MHz
• 64KB L2 Cache
• Power island gating
External Memory Interfaces
• Multi-protocol dynamic memory controller
• 32-bit or 64-bit interfaces to DDR4, DDR3,
DDR3L, or LPDDR3 memories, and 32-bit
interface to LPDDR4 memory
• ECC support in 64-bit and 32-bit modes
• Up to 32GB of address space using single or dual
rank of 8-, 16-, or 32-bit-wide memories
• Static memory interfaces
o eMMC4.51 Managed NAND flash support
o ONFI3.1 NAND flash with 24-bit ECC
o 1-bit SPI, 2-bit SPI, 4-bit SPI (Quad-SPI), or
two Quad-SPI (8-bit) serial NOR flash
8-Channel DMA Controller
• Two DMA controllers of 8-channels each
• Memory-to-memory, memory-to-peripheral,
peripheral-to-memory, and scatter-gather
transaction support
Serial Transceivers
• Four dedicated PS-GTR receivers and
transmitters supports up to 6.0Gb/s data rates
o Supports SGMII tri-speed Ethernet, PCI
Express® Gen2, Serial-ATA (SATA), USB3.0,
and DisplayPort
Dedicated I/O Peripherals and
Interfaces
• PCI Express — Compliant with PCIe® 2.1 base
specification
o Root complex and End Point configurations
o x1, x2, and x4 at Gen1 or Gen2 rates
• SATA Host
o 1.5, 3.0, and 6.0Gb/s data rates as defined by
SATA Specification, revision 3.1
o Supports up to two channels
• DisplayPort Controller
o Up to 5.4Gb/s rate
o Up to two TX lanes (no RX support)
• Four 10/100/1000 tri-speed Ethernet MAC
peripherals with IEEE Std 802.3 and IEEE Std 1588
revision 2.0 support
o Scatter-gather DMA capability
o Recognition of IEEE Std 1588 rev.2 PTP frames
o GMII, RGMII, and SGMII interfaces
o Jumbo frames
• Two USB 3.0/2.0 Device, Host, or OTG peripherals,
each supporting up to 12 endpoints
o USB 3.0/2.0 compliant device IP core
o Super-speed, high- speed, full-speed, and
low-speed modes
o Intel XHCI- compliant USB host
• Two full CAN 2.0B-compliant CAN bus interfaces
o CAN 2.0-A and CAN 2.0-B and ISO 118981-1
standard compliant
• Two SD/SDIO 2.0/eMMC4.51 compliant
controllers
• Two full-duplex SPI ports with three peripheral
chip selects
• Two high-speed UARTs (up to 1Mb/s)
• Two master and slave I2C interfaces
• Up to 78 flexible multiplexed I/O (MIO) (up to
three banks of 26 I/Os) for peripheral pin
assignment
• Up to 96 EMIOs (up to three banks of 32 I/Os)
connected to the PL
Interconnect
• High-bandwidth connectivity within PS
and between PS and PL
• Arm AMBA® AXI4-based
• QoS support for latency and bandwidth control
• Cache Coherent Interconnect (CCI)
System Memory Management
• System Memory Management Unit (SMMU)
• Xilinx Memory Protection Unit (XMPU)
Platform Management Unit
• Power gates PS peripherals, power islands, and
power domains
• Clock gates PS peripheral user firmware option
Configuration and Security Unit
• Boots PS and configures PL
• Supports secure and non-secure boot modes
System Monitor in PS
• On-chip voltage and temperature sensing

Zynq UltraScale+ MPSoC Data Sheet: Overview
DS891 (v1.8) October 2, 2019 www.xilinx.com
Product Specification 3
Programmable Logic (PL)
Configurable Logic Blocks (CLB)
• Look-up tables (LUT)
• Flip-flops
• Cascadable adders
36Kb Block RAM
• True dual-port
• Up to 72 bits wide
• Configurable as dual 18Kb
UltraRAM
• 288Kb dual-port
• 72 bits wide
• Error checking and correction
DSP Blocks
• 27 x 18 signed multiply
• 48-bit adder/accumulator
• 27-bit pre-adder
Programmable I/O Blocks
• Supports LVCMOS, LVDS, and SSTL
• 1.0V to 3.3V I/O
• Programmable I/O delay and SerDes
JTAG Boundary-Scan
• IEEE Std 1149.1 Compatible Test Interface
PCI Express
• Supports Root complex and End Point
configurations
• Supports up to Gen3 speeds
• Up to five integrated blocks in select devices
100G Ethernet MAC/PCS
• IEEE Std 802.3 compliant
• CAUI-10 (10x 10.3125Gb/s) or
CAUI-4 (4x 25.78125Gb/s)
• RSFEC (IEEE Std 802.3bj) in CAUI-4 configuration
• Up to four integrated blocks in select devices
Interlaken
• Interlaken spec 1.2 compliant
• 64/67 encoding
• 12 x 12.5Gb/s or 6 x 25Gb/s
• Up to four integrated blocks in select devices
Video Encoder/Decoder (VCU)
• Available in EV devices
• Accessible from either PS or PL
• Simultaneous encode and decode
• H.264 and H.265 support
System Monitor in PL
• On-chip voltage and temperature sensing
• 10-bit 200KSPS ADC with up to 17 external inputs

Zynq UltraScale+ MPSoC Data Sheet: Overview
DS891 (v1.8) October 2, 2019 www.xilinx.com
Product Specification 4
Feature Summary
Table 1: Zynq UltraScale+ MPSoC: CG Device Feature Summary
ZU2CG ZU3CG ZU4CG ZU5CG ZU6CG ZU7CG ZU9CG
Application Processing Unit
Dual-core Arm Cortex-A53 MPCore with CoreSight; NEON & Single/Double Precision Floating Point;
32KB/32KB L1 Cache, 1MB L2 Cache
Real-Time Processing Unit
Dual-core Arm Cortex-R5 with CoreSight; Single/Double Precision Floating Point; 32KB/32KB L1
Cache, and TCM
Embedded and External
Memory
256KB On-Chip Memory w/ECC; External DDR4; DDR3; DDR3L; LPDDR4; LPDDR3;
External Quad-SPI; NAND; eMMC
General Connectivity
214 PS I/O; UART; CAN; USB 2.0; I2C; SPI; 32b GPIO; Real Time Clock; WatchDog Timers; Triple
Timer Counters
High-Speed Connectivity 4 PS-GTR; PCIe Gen1/2; Serial ATA 3.1; DisplayPort 1.2a; USB 3.0; SGMII
System Logic Cells 103,320 154,350 192,150 256,200 469,446 504,000 599,550
CLB Flip-Flops 94,464 141,120 175,680 234,240 429,208 460,800 548,160
CLB LUTs 47,232 70,560 87,840 117,120 214,604 230,400 274,080
Distributed RAM (Mb) 1.2 1.8 2.6 3.5 6.9 6.2 8.8
Block RAM Blocks 150 216 128 144 714 312 912
Block RAM (Mb) 5.3 7.6 4.5 5.1 25.1 11.0 32.1
UltraRAM Blocks 0 0 48 64 0 96 0
UltraRAM (Mb) 0 0 13.5 18.0 0 27.0 0
DSP Slices 240 360 728 1,248 1,973 1,728 2,520
CMTs 3344484
Max. HP I/O
(1)
156 156 156 156 208 416 208
Max. HD I/O
(2)
96 96 96 96 120 48 120
System Monitor 2222222
GTH Transceiver 16.3Gb/s
(3)
0 0 16 16 24 24 24
GTY Transceivers 32.75Gb/s0000000
Transceiver Fractional PLLs0088121212
PCIe Gen3 x16 0022020
150G Interlaken 0000000
100G Ethernet w/ RS-FEC0000000
Notes:
1. HP = High-performance I/O with support for I/O voltage from 1.0V to 1.8V.
2. HD = High-density I/O with support for I/O voltage from 1.2V to 3.3V.
3. GTH transceivers in the SFVC784 package support data rates up to 12.5Gb/s. See Table 2.

Zynq UltraScale+ MPSoC Data Sheet: Overview
DS891 (v1.8) October 2, 2019 www.xilinx.com
Product Specification 5
Table 2: Zynq UltraScale+ MPSoC: CG Device-Package Combinations and Maximum I/Os
Package
(1)(2)(3)(4)(5)
Package
Dimensions
(mm)
ZU2CG ZU3CG ZU4CG ZU5CG ZU6CG ZU7CG ZU9CG
HD, HP
GTH, GTY
HD, HP
GTH, GTY
HD, HP
GTH, GTY
HD, HP
GTH, GTY
HD, HP
GTH, GTY
HD, HP
GTH, GTY
HD, HP
GTH, GTY
SBVA484
(6)
19x19
24, 58
0, 0
24, 58
0, 0
SFVA625
21x21
24, 156
0, 0
24, 156
0, 0
SFVC784
(7)
23x23
96, 156
0, 0
96, 156
0, 0
96, 156
4, 0
96, 156
4, 0
FBVB900
31x31
48, 156
16, 0
48, 156
16, 0
48, 156
16, 0
FFVC900
31x31
48, 156
16, 0
48, 156
16, 0
FFVB1156
35x35
120, 208
24, 0
120, 208
24, 0
FFVC1156
35x35
48, 312
20, 0
FFVF1517
40x40
48, 416
24, 0
Notes:
1. Go to Ordering Information for package designation details.
2. FB/FF packages have 1.0mm ball pitch. SB/SF packages have 0.8mm ball pitch.
3. All device package combinations bond out 4 PS-GTR transceivers.
4. All device package combinations bond out 214 PS I/O except ZU2CG and ZU3CG in the SBVA484 and SFVA625 packages,
which bond out 170 PS I/Os. Packages that bond out 170 PS I/O support DDR 32-bit only.
5. Packages with the same last letter and number sequence, e.g., A484, are footprint compatible with all other UltraScale
devices with the same sequence. The footprint compatible devices within this family are outlined.
6. All 58 HP I/O pins are powered by the same V
CCO
supply.
7. GTH transceivers in the SFVC784 package support data rates up to 12.5Gb/s.
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