celsiusgds.tcl reads gds database and generate model that Celsius3D can read.
celsius3d.tcl import the model and generate other neccessary setup for stress simulation.
model: chip connected to a silicon interposer by bump
condition: temperature drop from 217C to 25C
boundary condition: free thermal expansion of the model
remarks: for demostration purpose, model used default coarse mesh. to generate finer mesh for more accurate simulation, user may change mesh seeding parameters in celsius3d.tcl or add other mesh control method in the model.
run the full flow:
run.sh
Sigrity-Simulation Options Quick Help.rar （76个子文件） 
Sigrity-Simulation Options Quick Help 
celsiusCFDSolverTa.pdf 110KB 源文件 Sample4_Chip_Only tcl 
Sample4_Perform_chip-only_static_analysis.tcl 2KB Sample4_Perform_chip-only_transient_analysis.tcl 2KB power_map 
die_material_file.txt 516B die_3d_powermap_static.map 8KB die_3d_powermap_transient_lowFreq.map 8KB die_3d_powermap_transient_highFreq.map 8KB transient_single_die myDemo.spd 15KB static_single_die myDemo.spd 15KB Sample5_3DIC tcl Sample5_Perform_Celsius_PKGPCB_thermal_analysis.tcl 6KB input test.spd 814KB ram1_power.map 13KB 3dic_config.xml 2KB tc2_power.map 17KB interposer_power.map 27KB ram2_bumps.map 2KB ram2_power.map 13KB Simulation test_simulation.spd 817KB tcl tcl_stress demo.map 407B README.txt 574B stress_simulation.3dth 1.68MB demo.gds 102.99MB material_lib.cmx 13KB run.sh 498B celsiusgds.tcl 2KB demo.tech 10KB celsius3d.tcl 5KB tcl_create_dummy_pkg 2d_power.txt 173B README.txt 267B setup_case.tcl 12KB Sample2 tcl Sample2_FEM_static_simulation.tcl 4KB Sample2_FEMstatic_ETcosimulation_using_CFDmodel.tcl 1KB Sample2_Perform_CFD_extraction.tcl 810B Simulation IR_PCB_simulation_withHTC.spd 3.66MB IR_PCB_cfd.3dth 285KB IR_PCB_simulation_Simplified.xml 109KB IR_PCB_simulation.spd 3.66MB IR_PCB_cfd.cfd 67KB Speed_file IR_F2F7.tmp 4.35MB IR_B090.tmp 4.35MB IR_PCB.spd 4.35MB IR_974C.tmp 4.35MB IR_789E.tmp 4.35MB Sample1 Transient_Simulation 2diesidebyside_transient.3dth 1.18MB tcl Sample1_solid_objects_static_simulation.tcl 5KB Sample1_CFD_model_simulation_and_extraction.tcl 2KB Sample1_Solid_objects_transient_simulation.tcl 2KB Static_Simulation 2diesidebyside_static.3dth 1.18MB Speed_file 2diesidebyside_wbwb_3D.spd 77KB CFD_Extraction_Simulation 2diesidebyside_cfd_simulation.3dth 1.18MB 2diesidebyside_cfd.3dth 1.18MB Mechanical 4_point_bending run_simulation.tcl 338B README.txt 537B
4_point_bending_analytical.xlsx 62KB 4_point_bending.cmx 5KB 4_point_bending.tcl 6KB package_warpage package_warpage.cmx 7KB run_simulation.tcl 338B README.txt 518B pop_wirebond.spd 520KB package_warpage.tcl 3KB thermal_cycling thermal_cycling.tcl 6KB run_simulation.tcl 338B README.txt 560B thermal_cycling.cmx 4KB Sample3 tcl Sample3_solid_objects_3d_static_simulation.tcl 3KB Simulation lead_frame_static.3dth 4.42MB Speed_file lead_frame_3D.spd 284KB Sample6_pkg_characterization tcl Sample6_Single_die_package_thermal_characterization.tcl 3KB Sample6_Multiple_die_package_thermal_characterization.tcl 3KB Simulations 2diesidebyside_wbwb_simulation.spd 78KB flipchip_simulation.spd 578KB Speed_files 2diesidebyside_wbwb.spd 77KB Material_Models_Default.txt 32KB flipchip.spd 578KB config Celsius_solver_schema.xsd 15KB资源评论
