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本文档旨在为方便起见,提供有关 TI 产品中文版本的信息,以确认产品的概要。 有关适用的官方英文版本的最新信息,请访问 www.ti.com,其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SLLSEX9
SN65MLVD206B
ZHCSFW6A –DECEMBER 2016–REVISED FEBRUARY 2020
具具有有 IEC ESD 保保护护功功能能的的 SN65MLVD206B 多多点点 LVDS 线线路路驱驱动动器器和和接接
收收器器((收收发发器器))
1
1 特特性性
1
• 与 M-LVDS 标准 TIA/EIA-899 兼容,可进行多点数
据交换
• 低电压差分 30Ω 至 55Ω 线路驱动器和接收器,信
号传输速率
(1)
高达
200Mbps,时钟频率高达 100MHz
– 2 类接收器的偏移阈值可检测开路和空闲总线状
态
• 总线 I/O 保护
– ±8kV HBM
– ±8kV IEC 61000-4-2 接触放电
• 驱动器输出电压转换时间可控,可改善信号质量
• –1V 至 3.4V 共模电压范围,可实现在 2V 接地噪
声下进行数据传输
• 总线引脚在禁用或 V
CC
≤ 1.5V 时具有高阻抗
• 提供 100Mbps 器件 (SN65MLVD204B)
• SN65MLVD206 的改进备选器件
(1)
线路的信号传输速率是指每秒钟的电压转换次数,单位为 bps
(每秒比特数)
2 应应用用
• TIA/EIA-485 的低功耗、高速和短距备选器件
• 背板或电缆式多点数据和时钟传输
• 蜂窝基站
• 局端交换机
• 网络交换机和路由器
3 说说明明
SN65MLVD206B 器件是一款多点低电压差分信号 (M-
LVDS) 线路驱动器和接收器,经优化,能够以最高
200Mbps 的信号传输速率运行。该器件具有稳健耐用
的 3.3V 驱动器和接收器,并且采用标准 SOIC 封装,
适用于严苛的工业 应用。总线引脚可耐受 ESD 事件,
具有针对人体模型和 IEC 接触放电规范的高级保护。
该器件包含一个差分驱动器和一个差分接收器(收发
器),由 3.3V 电源供电。该收发器经过优化,能够以
最高 200Mbps 的信号传输速率运行。
SN65MLVD206B 较同类器件具有增强特性。这些 增
强特性 包括驱动器输出端转换率可控,有助于尽量减
少无端桩线的反射,从而提高信号完整性。沿用了相同
尺寸,可轻松替换,有助于提升系统性能。这些器件的
额定工作温度范围为 -40°C 至 85°C。
SN65MLVD206B M-LVDS 接收器是 TI 广泛的 M-
LVDS 产品系列器件。
器器件件信信息息
(1)
器器件件型型号号 封封装装 封封装装尺尺寸寸((标标称称值值))
SN65MLVD206B SOIC (8) 4.90mm × 3.91mm
(1) 如需了解所有可用封装,请参阅数据表末尾的可订购产品附
录。
空白
简简化化原原理理图图、、 SN65MLVD206B

2
SN65MLVD206B
ZHCSFW6A –DECEMBER 2016 –REVISED FEBRUARY 2020
www.ti.com.cn
Copyright © 2016–2020, Texas Instruments Incorporated
目目录录
1 特特性性.......................................................................... 1
2 应应用用.......................................................................... 1
3 说说明明.......................................................................... 1
4 修修订订历历史史记记录录 ........................................................... 2
5 Pin Configuration and Functions......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Electrical Characteristics – Driver ............................. 5
6.7 Electrical Characteristics – Receiver ........................ 6
6.8 Electrical Characteristics – BUS Input and Output ... 6
6.9 Switching Characteristics – Driver ............................ 7
6.10 Switching Characteristics – Receiver...................... 7
6.11 Typical Characteristics............................................ 8
7 Parameter Measurement Information .................. 8
8 Detailed Description............................................ 16
8.1 Overview ................................................................. 16
8.2 Functional Block Diagrams ..................................... 16
8.3 Feature Description................................................. 16
8.4 Device Functional Modes........................................ 17
9 Application and Implementation ........................ 19
9.1 Application Information............................................ 19
9.2 Typical Application ................................................. 19
10 Power Supply Recommendations ..................... 24
11 Layout................................................................... 24
11.1 Layout Guidelines ................................................. 24
11.2 Layout Example .................................................... 28
12 器器件件和和文文档档支支持持 ..................................................... 30
12.1 文档支持 ............................................................... 30
12.2 接收文档更新通知 ................................................. 30
12.3 支持资源................................................................ 30
12.4 商标 ....................................................................... 30
12.5 静电放电警告......................................................... 30
12.6 Glossary................................................................ 30
13 机机械械、、封封装装和和可可订订购购信信息息....................................... 30
4 修修订订历历史史记记录录
Changes from Original (December 2016) to Revision A Page
• 删除了文本、表格和图中关于器件 SN65MLVD201B、SN65MLVD203B 和 SN65MLVD207B 的所有引用 .......................... 1
• 删除了“简化原理图”中的引脚编号。 ....................................................................................................................................... 1
• Deleted the D 14-Pin Package from the Pin Configuration and Functions ............................................................................ 3
• Removed from Thermal Information 14-pin D, 201B, 203B, and 207B.................................................................................. 4
• Removed I
OZ
, I
O(OFF)
, C
Y
, C
Z
, C
YZ
, and C
Y/Z
in Driver Electrical Characteristics..................................................................... 5
• Removed Type-1 V
IT+
, V
IT-
, and V
HYS
...................................................................................................................................... 6
• Removed C
A
, C
B
, C
AB
, and C
A/B
from Receiver Electrical Characteristics ............................................................................. 6
• In the Bus Input and Output electrical characteristics, changed C
A
and C
B
from 5pF to 12pF.............................................. 6
• In the Bus Input and Output electrical characteristics, changed C
AB
from 4pF to 7pF. ......................................................... 6
• Changed the TYP value for t,,r,, and t,,f,, From: 2 ns To: 1.5 ns in the //Switching Characteristics – Driver// table ............. 7
• Removed all "Y" and "Z" labels from the Parameter Measurement Information images ....................................................... 8
• Removed Type-1 Receiver Input Threshold Test Voltages table........................................................................................... 8
• Deleted "0.2 V Type 1" from Period Jitter in 图 13 .............................................................................................................. 15
• Removed Type-1 receivers exhibit 25 mV ... from Detailed Description Overview. ............................................................ 16
• Removed pin numbers from Functional Block Diagram....................................................................................................... 16
• Removed Table on Type-1 receiver .................................................................................................................................... 17
• Changed A/Y or B/Z to A or B in the Driver Output image .................................................................................................. 18
• Changed text From: "signal of 540 V" To: "signal of 540 mV" in the Driver Output Voltage ............................................... 20

1R 8 VCC
2RE 7 B
3DE 6 A
4D 5 GND
Not to scale
3
SN65MLVD206B
www.ti.com.cn
ZHCSFW6A –DECEMBER 2016–REVISED FEBRUARY 2020
Copyright © 2016–2020, Texas Instruments Incorporated
5 Pin Configuration and Functions
D Package
8-Pin SOIC
Top View
Pin Functions
PIN
TYPE DESCRIPTION
NAME NO.
A 6 I/O Differential I/O
B 7 I/O Differential I/O
D 4 Input Driver input
DE 3 Input Driver enable pin; High = Enable, Low = Disable
GND 5 Power Supply ground
NC — NC No internal connection
R 1 Output Receiver output
RE 2 Input Receiver enable pin; High = Disable, Low = Enable
V
CC
8 Power Power supply, 3.3 V

4
SN65MLVD206B
ZHCSFW6A –DECEMBER 2016 –REVISED FEBRUARY 2020
www.ti.com.cn
Copyright © 2016–2020, Texas Instruments Incorporated
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
Supply voltage range, V
CC
(2)
–0.5 4 V
Input voltage range
D, DE, RE –0.5 4 V
A, B –1.8 4 V
Output voltage range
R –0.3 4 V
A, B –1.8 4 V
Continuous power dissipation See the Thermal Information table
Storage temperature, T
stg
–65 150 °C
6.2 ESD Ratings
VALUE UNIT
V
(ESD)
Electrostatic discharge
Contact discharge, per IEC 61000-4-2 A, and B ±8000 V
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins
A, and B ±8000 V
All pins except A
and B
±4000 V
Charged device model (CDM), per JEDEC specification JESD22-
C101, all pins
All pins ±1500 V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
V
CC
Supply voltage 3 3.3 3.6 V
V
IH
High-level input voltage 2 V
CC
V
V
IL
Low-level input voltage 0 0.8 V
Voltage at any bus terminal V
A or
V
B
–1.4 3.8 V
|V
ID
| Magnitude of differential input voltage V
CC
V
R
L
Differential load resistance 30 50 Ω
1/t
UI
Signaling rate 200 Mbps
T
A
Operating free-air temperature in D package –40 85 °C
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.4 Thermal Information
THERMAL METRIC
(1)
SN65MLVD206B
UNITD (SOIC)
8 PINS
R
θJA
Junction-to-ambient thermal resistance 112.2
°C/W
R
θJC(top)
Junction-to-case (top) thermal resistance 56.7
R
θJB
Junction-to-board thermal resistance 52.8
ψ
JT
Junction-to-top characterization parameter 10.3
ψ
JB
Junction-to-board characterization parameter 52.3

5
SN65MLVD206B
www.ti.com.cn
ZHCSFW6A –DECEMBER 2016–REVISED FEBRUARY 2020
Copyright © 2016–2020, Texas Instruments Incorporated
(1) All typical values are at 25°C and with a 3.3-V supply voltage.
6.5 Electrical Characteristics
over recommended operating conditions (unless otherwise noted)
(1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
I
CC
Supply current
Driver only RE and DE at V
CC
, R
L
= 50 Ω, All others open 13 22
mA
Both disabled RE at V
CC
, DE at 0 V, R
L
= No Load, All others open 1 4
Both enabled RE at 0 V, DE at V
CC
, R
L
= 50 Ω, All others open 16 24
Receiver only RE at 0 V, DE at 0 V, All others open 4 13
P
D
Device power dissipation
R
L
= 50 Ω, Input to D is a 50-MHz 50% duty cycle square
wave, DE = high, RE = low, T
A
= 85°C
100 mW
(1) The algebraic convention in which the least positive (most negative) limit is designated as minimum is used in this data sheet.
(2) All typical values are at 25°C and with a 3.3-V supply voltage.
(3) Measurement equipment accuracy is 10 mV at –40°C
6.6 Electrical Characteristics – Driver
over recommended operating conditions unless otherwise noted
PARAMETER TEST CONDITIONS MIN
(1)
TYP
(2)
MAX UNIT
|V
AB
| Differential output voltage magnitude
(3)
See 图 3
480 650 mV
Δ|V
AB
|
Change in differential output voltage magnitude
between logic states
–50 50 mV
V
OS(SS)
Steady-state common-mode output voltage
See 图 4
0.8 1.2 V
ΔV
OS(SS)
Change in steady-state common-mode output
voltage between logic states
–50 50 mV
V
OS(PP)
Peak-to-peak common-mode output voltage 150 mV
V
A(OC)
Maximum steady-state open-circuit output voltage
See 图 8
0 2.4 V
V
B(OC)
Maximum steady-state open-circuit output voltage 0 2.4 V
V
P(H)
Voltage overshoot, low-to-high level output
See 图 6
1.2 V
SS
V
V
P(L)
Voltage overshoot, high-to-low level output –0.2 V
SS
V
I
IH
High-level input current (D, DE) V
IH
= 2 V to V
CC
0 10 µA
I
IL
Low-level input current (D, DE) V
IL
= GND to 0.8 V 0 10 µA
|I
OS
| Differential short-circuit output current magnitude See 图 5 24 mA
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