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TI-DS90UB914A-Q1.pdf

FPD-Link解串器
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DSP, FPGA/
µ-Processor/
ECU
Deserializer
DS90UB913A-
Q1
Serializer
FPD-Link III
Bidirectional
Control Channel
DS90UB914A-
Q1
Bidirectional
Control Bus
Bidirectional
Control Bus
Parallel
Data In
Parallel
Data Out
10 or 12
2
2
Megapixel
Imager/Sensor
10 or 12
GPO
GPIO
4
4
2
HSYNC,
VSYNC
2
HSYNC,
VSYNC
Copyright © 2016, Texas Instruments Incorporated
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本文档旨在为方便起见,提供有关 TI 产品中文版本的信息,以确认产品的概要。 有关适用的官方英文版本的最新信息,请访问 www.ti.com,其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SNLS499
DS90UB914A-Q1
ZHCSEY3D –APRIL 2016–REVISED OCTOBER 2019
DS90UB914A-Q1 25MHz 转转 100MHz 10/12 位位 FPD-Link III 解解串串器器
1
1 特特性性
1
• 符合汽车类 应用要求 AEC-Q100 标准
– 器件温度 2 级:-40℃ 至 +105℃ 环境工作温度
范围
– 器件 HBM ESD 分类等级 ±8kV
– 器件 CDM ESD 分类等级 C6
• 支持 25MHz 至 100MHz 输入像素时钟
• 可编程数据有效载荷:
– 10 位有效载荷,高达 100MHz
– 12 位有效载荷,高达 75MHz
• 连续低延迟双向控制接口通道,带有 I2C 接口,支
持 400kHz 传输速率
• 2:1 多路复用器,可在两个输入映像之间进行选择
• 能够接收长达 15m 的同轴电缆或 20m 的屏蔽双绞
线电缆
• 稳健的同轴电缆供电 (PoC) 运行
• 接收端均衡器自动适应电缆损耗的变化
• LOCK 输出报告引脚和 @SPEED BIST 诊断功
能,可验证链路完整性
• 1.8V 单电源
• 符合 ISO 10605 和 IEC 61000-4-2 ESD 标准
• 使用可编程扩展频谱 (SSCG) 和接收器交错输出缓
解 EMI/EMC
2 应应用用
• 汽车
– 环视系统 (SVS)
– 后视摄像头和前视摄像头
– 驾驶员监视摄像头 (DMS)
– 远距卫星雷达传感器
• 安全和监控
• 工业机器视觉
3 说说明明
DS90UB914A-Q1 器件提供一个具有高速正向通道和
双向控制通道的 FPD-Link III 接口,用于实现单一同轴
电缆或差分对上的数据传输。DS90UB914A-Q1 器件
的高速正向通道和双向控制通道数据路径上均包含差分
信令。该解串器针对电子控制单元 (ECU) 中成像器与
视频处理器的连接。该器件非常适用于驱动需要高达
12 位像素深度、2 个同步信号以及双向控制通道总线
的视频数据。
该解串器 特有 一个多路复用器,可在两个输入成像器
之间进行选择,每次激活一个。主视频传输将 10 位或
12 位数据转换为单条高速串行数据流,另外一个独立
的低延迟双向控制通道传输负责接收来自 I2C 端口的
控制信息,与视频消隐期无关。
凭借德州仪器 (TI) 的嵌入式时钟技术,可在单一差分
对上进行透明的全双工通信,从而运载不对称的双向控
制通道信息。这个单个串行数据流通过消除并行数据与
时钟路径间的偏差,简化了印刷电路板 (PCB) 走线和
电缆上的宽数据总线传输。这样,通过限制数据路径的
宽度,大大节省了系统成本,相应地减少了 PCB 层
数、电缆宽度以及连接器尺寸和引脚数量。此外,解串
器输入还提供自适应均衡功能来补偿较长距离介质上的
损耗。内部 DC 均衡编码/解码用于支持 AC 耦合互
连。
器器件件信信息息
(1)
器器件件型型号号 封封装装 封封装装尺尺寸寸((标标称称值值))
DS90UB914A-Q1 WQFN (48) 7.00mm × 7.00mm
(1) 如需了解所有可用封装,请参阅数据表末尾的可订购产品附
录。
简简化化原原理理图图

2
DS90UB914A-Q1
ZHCSEY3D –APRIL 2016–REVISED OCTOBER 2019
www.ti.com.cn
版权 © 2016–2019, Texas Instruments Incorporated
目目录录
1 特特性性.......................................................................... 1
2 应应用用.......................................................................... 1
3 说说明明.......................................................................... 1
4 修修订订历历史史记记录录 ........................................................... 2
5 Device Comparison Table..................................... 4
6 Pin Configuration and Functions......................... 5
7 Specifications......................................................... 9
7.1 Absolute Maximum Ratings ...................................... 9
7.2 ESD Ratings.............................................................. 9
7.3 Recommended Operating Conditions....................... 9
7.4 Thermal Information ................................................ 10
7.5 Electrical Characteristics ........................................ 10
7.6 AC Timing Specifications (SCL, SDA) - I
2
C-
Compatible............................................................... 14
7.7 Bidirectional Control Bus DC Timing Specifications
(SCL, SDA) - I
2
C-Compatible ................................. 15
7.8 Deserializer Switching Characteristics.................... 15
7.9 Typical Characteristics ............................................ 17
8 Parameter Measurement Information ................ 17
8.1 Timing Diagrams and Test Circuits......................... 17
9 Detailed Description ............................................ 21
9.1 Overview ................................................................. 21
9.2 Functional Block Diagram ....................................... 22
9.3 Feature Description................................................. 22
9.4 Device Functional Modes........................................ 27
9.5 Programming .......................................................... 33
9.6 Register Maps ......................................................... 38
10 Application and Implementation........................ 49
10.1 Application Information.......................................... 49
10.2 Typical Applications .............................................. 53
11 Power Supply Recommendations ..................... 57
12 Layout................................................................... 58
12.1 Layout Guidelines ................................................. 58
12.2 Layout Example .................................................... 59
13 器器件件和和文文档档支支持持 ..................................................... 61
13.1 文档支持 ............................................................... 61
13.2 接收文档更新通知 ................................................. 61
13.3 社区资源................................................................ 61
13.4 商标 ....................................................................... 61
13.5 静电放电警告......................................................... 61
13.6 Glossary................................................................ 61
14 机机械械、、封封装装和和可可订订购购信信息息....................................... 61
4 修修订订历历史史记记录录
Changes from Revision C (November 2018) to Revision D Page
• Added tDLH and tDHL to Output Load and Transition Times diagram................................................................................ 18
• Added 953A in the list of compatible serializers................................................................................................................... 21
• Changed text in MODE Pin Configuration figure from "Serializer" to "Deserializer" ............................................................ 29
• Clarified bit descriptions for registers 0x1D-0x1E bits 4 and 0............................................................................................. 44
• Added timing diagram and data table for PDB to I2C ready delay ...................................................................................... 51
Changes from Revision B (October 2016) to Revision C Page
• Clarified when PCLK becomes active with respect to LOCK ................................................................................................ 6
• Added Power Over Coax supply noise to the recommended operating conditions table ..................................................... 9
• Corrected to t
DLH
and t
DHL
for data low-to-high and high-to-low transition time ................................................................... 15
• Moved the timing diagrams to the Parameter Measurement Information section................................................................ 17
• Added reference to compatibility with DS90UB953-Q1/935-Q1 serializers ........................................................................ 21
• Updated pullup and pulldown resistor to R
1
and R
2
in MODE pin configuration diagram ................................................... 29
• Updated register "TYPE" column per legend ...................................................................................................................... 38
• Added type and default value to the reserved register bits that were missing this information .......................................... 38
Changes from Revision A (June 2016) to Revision B Page
• Added Back Channel Line Rate specification; also added footnote for clarification between MHz and Mbps distinction. .. 11
• Revised back channel VOD specification from 175mV to 182 mV. .................................................................................... 11
• Removed 'ns' unit from specifications referencing period in units of T. ............................................................................... 15
• Revise Deserializer Delay specification due to the swapped information. .......................................................................... 16
• Revised jitter tolerance curve to be for typical system IJT configuration with DS90UB913A linked to DS90UB914A. ...... 17

3
DS90UB914A-Q1
www.ti.com.cn
ZHCSEY3D –APRIL 2016–REVISED OCTOBER 2019
版权 © 2016–2019, Texas Instruments Incorporated
• Added device functional mode table for external oscillator operation with example XCLKIN = 48MHz. ............................ 27
• Fixed typo and changed "deserializer" to "serializer"........................................................................................................... 39
• Added register 0x05 for Forward Channel Low Frequency Gain. ....................................................................................... 40
• Added registers 0x27, 0x47 for Forward Channel Tuning/Impedance Control. ................................................................... 47
• Revised rise time and delay conditions to include 10% to 90% parameters instead of VIH and VIL. ................................. 50
• Changed max rise time for V
DDIO
and V
DD_N
to be 5ms instead of 1.5ms during power-up. ............................................... 50
• Revised power-up timing paragraph for clarity and correctness. ......................................................................................... 50
• Changed VIL and VIH specs to 10% and 90% respectively for rising/falling edges. ........................................................... 50
Changes from Original (April 2016) to Revision A Page
• 已将文档拆分为两个独立文档(部件 DS90UB913A-Q1 SNLS443 和 DS90UB914A-Q1 SNLS499)。............................... 1
• 已合并修订历史记录来显示本文档属于 DS90UB913A-Q1 SNLS443 数据表时的变更 .......................................................... 1
• 已添加 汽车 特性 .................................................................................................................................................................... 1
• Updated pin description for ROUT to include active/inactive outputs corresponding to MODE setting................................. 5
• Added pin description to GPIO pins to leave open if unused. ............................................................................................... 6
• Updated frequency requirements for 10-bit and 12-bit HF modes. 10-bit mode – 50 MHz to 100 MHz; 12-bit HF
mode – 37.5 MHz to 75 MHz; 12-bit LF mode (no change) – 25 MHz to 50 MHz. .............................................................. 6
• Added pin description to RIN pins to leave open if unused. ................................................................................................. 8
• Changed Air Discharge ESD Rating (IEC61000-4-2: RD = 330 Ω, CS = 150 pF) to minimum ±25000 V. .......................... 9
• Added additional thermal characteristics.............................................................................................................................. 10
• Added GPIO[3:0] typical pin capacitance ............................................................................................................................ 10
• Changed Differential Input Voltage minimum specification. ................................................................................................. 11
• Changed Single-Ended Input Voltage minimum specification.............................................................................................. 11
• Added Back Channel Differential Output Voltage minimum specification............................................................................ 11
• Added Back Channel Single-Ended Output Voltage minimum specification........................................................................ 11
• Added footnote that states the following: “UI – Unit Interval is equivalent to one serialized data bit width. The UI
scales with PCLK frequency.” Also added below calculations to footnote. 12-bit LF mode 1 UI = 1 / ( PCLK_Freq. x
28 ) 12-bit HF mode 1 UI = 1 / ( PCLK_Freq. x 2/3 x 28 ) 10-bit mode 1 UI = 1 / ( PCLK_Freq. /2 x 28 ) ........................ 11
• Updated I
DDIOR
for V
DDIO
=1.89V, C
L
=8pF, Worst-Case Pattern with f=50 MHz, 12-bit low freq mode to typical value of
16 mA; value is currently 21 mA. ........................................................................................................................................ 12
• Updated I
DDIOR
for V
DDIO
=1.89V, C
L
=8pF, Random Pattern with f=50 MHz, 12-bit low freq mode to typical value of 10
mA; value is currently 14 mA................................................................................................................................................ 12
• Updated I
DDR
for V
DD_n
=1.89V, C
L
=4pF, Random Pattern with f=100 MHz, 10-bit mode to typical value of 69 mA;
value is currently 57 mA. ..................................................................................................................................................... 12
• Updated I
DDR
for V
DD_n
=1.89V, C
L
=4pF, Random Pattern with f=75 MHz, 12-bit high freq mode to typical value of 71
mA; value is currently 60 mA................................................................................................................................................ 12
• Updated I
DDR
for V
DD_n
=1.89V, C
L
=4pF, Random Pattern with f=50 MHz, 12-bit low freq mode to typical value of 67
mA; value is currently 56 mA................................................................................................................................................ 12
• Updated V
OL
Output Low Level row with revised I
OL
currents and max V
OL
voltages, dependent upon V
DDIO
voltage........ 15
• Updated frequency ranges for MODE settings and also revised with correct maximum clock periods. Added footnote
and nominal clock period to be in terms of 'T'...................................................................................................................... 15
• Changed typo on footnote to reflect 't
DPJ
'. ............................................................................................................................ 16
• Updated Figure 2 title to state ‘“Worst-Case” Test Pattern for Power Consumption’ .......................................................... 17
• Updated Figure 3 “Deserializer Vswing Diagram” with correct notation. ............................................................................. 18
• Changed Figure 3 to clarify difference between STP and Coax .......................................................................................... 18
• Table 2, row 5 with “static” input LOCK output status changed to “L”. ............................................................................... 30
• Table 5 heading updated to state “DS90UB914A-Q1 DESERIALIZER. ............................................................................. 36
• Changed description of deserializer reg 0x00 bit[0]=0 from "set using address coming from CAD" to "set from ID[x]" ..... 38

4
DS90UB914A-Q1
ZHCSEY3D –APRIL 2016–REVISED OCTOBER 2019
www.ti.com.cn
Copyright © 2016–2019, Texas Instruments Incorporated
• Added row to register 0x01[2] for Back Channel Enable – 0: Disable 1: Enable................................................................. 38
• Changed SSCG Units for fmod (register 0x02[3:0]) to Reflect Hz instead of KHz............................................................... 39
• Changed parity error reset bit to be NOT self-clearing. ...................................................................................................... 39
• Changed EQ gain values (dB) @ maximum line rate (1.4Gbps). ........................................................................................ 40
• Changed description of deserializer reg 0x04 to have correct register setting for each equalization gain level. ................ 40
• Added registers 0x26, 0x46 for Bidirectional Control Channel (BCC)Tuning. ..................................................................... 47
• Added deserializer 0x4C SEL register.................................................................................................................................. 48
• Updated EQ Register Bits 0x4E[3:0] to be Reserved. Also changed EQ gain values (dB) @ maximum line rate
(1.4Gbps).............................................................................................................................................................................. 48
• Added reference to Power over Coax Application report ..................................................................................................... 49
• Updated power up sequencing information and timing diagram. ........................................................................................ 49
• Added power up sequencing information and timing diagram. ............................................................................................ 49
• Added 914A PDB Reset timing constraints and diagram. ................................................................................................... 50
• Removed Figure 21 and Figure 43 regarding adaptive equalizer graphs for loss compensation (Coax/STP). .................. 52
• Renamed C1 and C2 to C22 and C23 for RIN0+ and RIN0- respectively on Typical Application Diagrams (Coax &
STP). .................................................................................................................................................................................... 54
• Added description specifying that the voltage applied on V
DDIO
(1.8 V, 3.3 V) or V
DD_n
(1.8 V) should be at the input
pin – any board level DC drop should be compensated. .................................................................................................... 57
• Added 914A EVM layout example image. ........................................................................................................................... 60
5 Device Comparison Table
PART NUMBER FPD-III FUNCTION PACKAGE TRANSMISSION MEDIA PCLK FREQUENCY
DS90UB914Q-Q1 Deserializer WQFN RHS (48) STP 10 to 100 MHz
DS90UB914A-Q1 Deserializer WQFN RHS (48) Coax or STP 25 to 100 MHz

DS90UB914A-Q1
Deserializer
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
36
35
34
33
32
31
30
29
28
27
26
25
48
47
46
45
44
43
42
41
40
39
38
37
ROUT[10]
ROUT[11]
VSYNC
PCLK
OEN
OSS_SEL
SCL
SDA
GPIO[3]
GPIO[2]
GPIO[0]
VDDIO1
RIN1+
RIN1-
IDx[0]
VDDR
VDDSSCG
BISTEN
VDDIO3
HSYNC GPIO[1]
VDDCML1
IDx[1]
ROUT[9]
ROUT[7]
ROUT[2]
ROUT[0]
ROUT[8]
ROUT[1]
ROUT[6]
VDDD
ROUT[5]
LOCK
PDB
VDDPLL
RES
RES
RIN0-
RIN0+
VDDCML0
CMLOUTN
CMLOUTP
PASS
MODE
ROUT[4]
ROUT[3]
VDDIO2
DAP = GND
SEL
5
DS90UB914A-Q1
www.ti.com.cn
ZHCSEY3D –APRIL 2016–REVISED OCTOBER 2019
Copyright © 2016–2019, Texas Instruments Incorporated
6 Pin Configuration and Functions
RHS Package
48-Pin WQFN
Top View
Pin Functions: DS90UB914A-Q1 Deserializer
PIN
I/O DESCRIPTION
NAME NO.
LVCMOS PARALLEL INTERFACE
ROUT[11:0]
11,12,13,14,
15,16,18,19,
21,22,23,24
Outputs,
LVCMOS
Parallel Data Outputs
For 10-bit MODE, parallel outputs ROUT[9:0] are active. ROUT[11:10] are inactive and
should not be used. Any unused outputs (including ROUT[11:10]) should be No Connect.
For 12-bit MODE (HF or LF), parallel outputs ROUT[11:0] are active. Any unused outputs
should be No Connect.
HSYNC 10
Output,
LVCMOS
Horizontal SYNC Output. Note: HS transition restrictions: 1. 12-bit Low-Frequency mode: No
HS restrictions (raw) 2. 12-bit High-Frequency mode: No HS restrictions (raw) 3. 10-bit
mode: HS restricted to no more than one transition per 10 PCLK cycles. Leave open if
unused.
VSYNC 9
Output,
LVCMOS
Vertical SYNC Output. Note: VS transition restrictions: 1. 12-bit Low-Frequency mode: No
VS restrictions (raw) 2. 12-bit High-Frequency mode: No VS restrictions (raw) 3. 10-bit mode:
VS restricted to no more than one transition per 10 PCLK cycles. Leave open if unused.
PCLK 8
Output,
LVCMOS
Pixel Clock Output Pin
Strobe edge set by RRFB control register.
In the 12-bit low frequency mode and 10-bit mode, the PCLK will become active before
LOCK goes high.
In the 12-bit high frequency mode, the PCLK and LOCK become active at the same time.
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