2
DS90UB926Q-Q1
ZHCSDA1D –JULY 2012–REVISED AUGUST 2017
www.ti.com.cn
版权 © 2012–2017, Texas Instruments Incorporated
目目录录
1 特特性性.......................................................................... 1
2 应应用用范范围围................................................................... 1
3 说说明明.......................................................................... 1
4 修修订订历历史史记记录录 ........................................................... 2
5 说说明明 （（续续））.............................................................. 4
6 Pin Configuration and Functions......................... 5
7 Specifications......................................................... 8
7.1 Absolute Maximum Ratings ..................................... 8
7.2 ESD Ratings.............................................................. 8
7.3 Recommended Operating Conditions....................... 8
7.4 Thermal Information.................................................. 9
7.5 DC Electrical Characteristics .................................... 9
7.6 AC Electrical Characteristics................................... 11
7.7 DC and AC Serial Control Bus Characteristics....... 12
7.8 Timing Requirements.............................................. 12
7.9 Timing Requirements for the Serial Control Bus .... 13
7.10 Switching Characteristics...................................... 13
7.11 Timing Diagrams................................................... 14
7.12 Typical Characteristics.......................................... 17
8 Detailed Description............................................ 18
8.1 Overview ................................................................. 18
8.2 Functional Block Diagram ....................................... 18
8.3 Feature Description................................................. 18
8.4 Device Functional Modes........................................ 31
8.5 Programming........................................................... 35
8.6 Register Maps......................................................... 36
9 Application and Implementation ........................ 48
9.1 Application Information............................................ 48
9.2 Typical Application .................................................. 49
10 Power Supply Recommendations ..................... 51
10.1 Power Up Requirements and PDB Pin ................. 51
11 Layout................................................................... 52
11.1 Layout Guidelines ................................................. 52
11.2 Layout Examples................................................... 54
12 器器件件和和文文档档支支持持 ..................................................... 55
12.1 文档支持................................................................ 55
12.2 接收文档更新通知 ................................................. 55
12.3 社区资源................................................................ 55
12.4 商标 ....................................................................... 55
12.5 静电放电警告......................................................... 55
12.6 Glossary................................................................ 55
13 机机械械、、封封装装和和可可订订购购信信息息....................................... 55
4 修修订订历历史史记记录录
注：之前版本的页码可能与当前版本有所不同。
Changes from Revision C (February 2017) to Revision D Page
• 将修订版 C 中以前所做的所有 MLCK 内容更改恢复为修订版 B ............................................................................................ 1
• Deleted the disable I2S jitter cleaner note.............................................................................................................................. 6
Changes from Revision B (January 2015) to Revision C Page
• Changed pin 60 from MCLK to RES2 ................................................................................................................................... 5
• Changed MCLK to RES2 ....................................................................................................................................................... 6
• Added note to disable I2S jitter cleaner ................................................................................................................................ 6
• Changed MCLK to RES2 ....................................................................................................................................................... 6
• Deleted reference to MCLK in this section ............................................................................................................................ 9
• Deleted reference to MCLK in this section .......................................................................................................................... 13
• Deleted reference to MCLK.................................................................................................................................................. 28
• Changed MCLK section ....................................................................................................................................................... 28
• Changed MCLK columns of Audio Interface Frequencies table ......................................................................................... 28
• Changed the values in columns 2 through 5 in Configuration Select (MODE_SEL) table................................................... 32
• Changed the values in columns 2 to 5 in Serial Control Bus Addresses for IDx table ........................................................ 35
• Changed register reference to MCLK .................................................................................................................................. 45
• Changed Typical Display System Diagram (removed reference to MCLK) ........................................................................ 49
• Changed wording of Power Up Requirements and PDB Pin subsection and added Power-Up Sequence graphic............ 51
