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TI-DS90UB913A-Q1.pdf
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FPD-Link串行器
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DSP, FPGA/
µ-Processor/
ECU
Deserializer
DS90UB913A-
Q1
Serializer
FPD-Link III
Bidirectional
Control Channel
DS90UB914A-
Q1
Bidirectional
Control Bus
Bidirectional
Control Bus
Parallel
Data In
Parallel
Data Out
10 or 12
2
2
Megapixel
Imager/Sensor
10 or 12
GPO
GPIO
4
4
2
HSYNC,
VSYNC
2
HSYNC,
VSYNC
Copyright © 2016, Texas Instruments Incorporated
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本文档旨在为方便起见,提供有关 TI 产品中文版本的信息,以确认产品的概要。 有关适用的官方英文版本的最新信息,请访问 www.ti.com,其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SNLS443
DS90UB913A-Q1
ZHCSEW6F –MAY 2013–REVISED JANUARY 2020
DS90UB913A-Q1 25MHz 至至 100MHz 10/12 位位 FPD-Link III 串串行行器器
1
1 特特性性
1
• 符合AEC-Q100 车规认证
– 器件温度等级 2:环境工作温度范围为 -40℃ 至
+105℃
• 25MHz 至 100MHz 输入像素时钟支持
• 可编程数据有效载荷:
– 10 位有效载荷,高达 100MHz
– 12 位有效载荷,高达 75MHz
• 连续低延迟双向控制接口通道,带有 I2C 接口,支
持 400kHz 传输速率
• 嵌入式时钟具有 DC 均衡编码,用于支持 AC 耦合
互连
• 可驱动长达 15m 的同轴电缆或 20m 的屏蔽双绞线
电缆
• 稳健的同轴电缆供电 (PoC) 运行
• 4 个专用通用输入/输出
• 串行器上提供 1.8V、2.8V 或 3.3V 兼容并行输入
• 1.8V 单电源
• 符合 ISO 10605 和 IEC 61000-4-2 ESD 标准
• 小尺寸串行器 (5mm × 5mm)
2 应应用用
• 汽车
– 环视系统 (SVS)
– 前置摄像头 (FC)
– 后视摄像头 (RVC)
– 传感器融合
– 驾驶员监视摄像头 (DMS)
– 远距卫星雷达、ToF 和激光雷达传感器
• 安防和监控
• 机器视觉 应用
3 说说明明
DS90UB913A-Q1 器件提供一个具有高速正向通道和
双向控制通道的 FPD-Link III 接口,用来实现单一同轴
电缆或差分对上的数据传输。DS90UB913A-Q1 器件
的高速正向通道和双向控制通道数据路径上均包含差分
信令。串行器/解串器对主要用于电子控制单元 (ECU)
中成像器与视频处理器的连接。该器件非常适用于驱动
需要高达 12 位像素深度、2 个同步信号以及双向控制
通道总线的视频数据。
凭借德州仪器 (TI) 的嵌入式时钟技术,可在单一差分
对上进行透明的全双工通信,从而运载不对称的双向控
制通道信息。这个单个串行数据流通过消除并行数据与
时钟路径间的偏差,简化了印刷电路板 (PCB) 走线和
电缆上的宽数据总线传输。这样,通过限制数据路径的
宽度,大大节省了系统成本,相应地减少了 PCB 层
数、电缆宽度以及连接器尺寸和引脚数量。内部 DC
均衡编码/解码用于支持 AC 耦合互连。
器器件件信信息息
(1)
器器件件型型号号 封封装装 封封装装尺尺寸寸((标标称称值值))
DS90UB913A-Q1 WQFN (32) 5.00mm × 5.00mm
(1) 如需了解所有可用封装,请参阅数据表末尾的可订购产品附
录。
简简化化原原理理图图

2
DS90UB913A-Q1
ZHCSEW6F –MAY 2013 –REVISED JANUARY 2020
www.ti.com.cn
版权 © 2013– 2020, Texas Instruments Incorporated
目目录录
1 特特性性.......................................................................... 1
2 应应用用.......................................................................... 1
3 说说明明.......................................................................... 1
4 修修订订历历史史记记录录 ........................................................... 2
5 Device Comparison Table..................................... 5
6 Pin Configuration and Functions......................... 5
7 Specifications......................................................... 7
7.1 Absolute Maximum Ratings ...................................... 7
7.2 ESD Ratings.............................................................. 7
7.3 Recommended Operating Conditions....................... 7
7.4 Thermal Information.................................................. 8
7.5 Electrical Characteristics........................................... 8
7.6 Recommended Serializer Timing For PCLK .......... 11
7.7 AC Timing Specifications (SCL, SDA) - I2C-
Compatible............................................................... 12
7.8 Bidirectional Control Bus DC Timing Specifications
(SCL, SDA) - I2C-Compatible ................................. 12
7.9 Timing Diagrams..................................................... 13
7.10 Serializer Switching Characteristics...................... 15
7.11 Typical Characteristics.......................................... 16
8 Detailed Description............................................ 17
8.1 Overview ................................................................. 17
8.2 Functional Block Diagram ....................................... 17
8.3 Feature Description................................................. 18
8.4 Device Functional Modes........................................ 21
8.5 Programming .......................................................... 26
8.6 Register Maps......................................................... 30
9 Application and Implementation ........................ 37
9.1 Application Information............................................ 37
9.2 Typical Applications ................................................ 39
10 Power Supply Recommendations ..................... 43
11 Layout................................................................... 44
11.1 Layout Guidelines ................................................. 44
11.2 Layout Example .................................................... 45
12 器器件件和和文文档档支支持持 ..................................................... 47
12.1 文档支持................................................................ 47
12.2 接收文档更新通知 ................................................. 47
12.3 支持资源................................................................ 47
12.4 商标 ....................................................................... 47
12.5 静电放电警告......................................................... 47
12.6 Glossary................................................................ 47
13 机机械械、、封封装装和和可可订订购购信信息息....................................... 47
4 修修订订历历史史记记录录
Changes from Revision E (September 2018) to Revision F Page
• Clarified GPO2 description by removing statement about leaving pin open if unused ......................................................... 6
• Added register 0x27[5] to register map ............................................................................................................................... 35
• Fixed missing register 0x29 typo ......................................................................................................................................... 36
• Added maximum power up timing constraint between VDD_n and PDB ........................................................................... 37
• Added recommended software programming steps if VDD_n to PDB maximum power up timing constraint can not
be met .................................................................................................................................................................................. 38
Changes from Revision D (October 2016) to Revision E Page
• Added recommendation to ensure GPO2 is low when PDB goes high ................................................................................ 6
• Added Power Over Coax supply noise to the recommended operating conditions table ...................................................... 8
• Clarified PCLK clock frequency range and added external clock input frequency range ...................................................... 8
• Added strap pin input current specification for MODE and IDX pins .................................................................................... 9
• Updated T
JIT1
PCLK input jitter in the external oscillator mode ........................................................................................... 11
• Added clarification on MODE pin description in PCLK from imager mode ......................................................................... 22
• Updated pullup and pulldown resistor to R
1
and R
2
in MODE pin configuration diagram ................................................... 22
• Updated the MODE setting values to ratio........................................................................................................................... 23
• Updated pullup and pulldown resistor for IDX to R
3
and R
4
in the diagram......................................................................... 28
• Updated IDX setting values to ratio ..................................................................................................................................... 28
• Updated register "TYPE" column per legend ...................................................................................................................... 30
• Added type and default value to the reserved register bits that were missing this information .......................................... 30
• Added that register 0x00[7:1] does not auto update IDX strapped address ....................................................................... 30
• Added description for 0x05 bits 1 and 0 (TX_MODE_12b and TX_MODE_10b) ............................................................... 32
• Clarified description on PDB pin usage during power up .................................................................................................... 37

3
DS90UB913A-Q1
www.ti.com.cn
ZHCSEW6F –MAY 2013–REVISED JANUARY 2020
版权 © 2013– 2020, Texas Instruments Incorporated
• Added paragraph to explain setting registers if GPO2 state is not determined when PDB goes high ............................... 37
• Added GPO2 to suggested power-up sequencing diagram ................................................................................................ 37
• Added timing constraint for PDB to GPO2 delay ................................................................................................................ 38
• Revised coax connection diagram to include pulldown resistor for GPO2 ......................................................................... 40
• Revised STP connection diagram to include pulldown resistor for GPO2 .......................................................................... 42
Changes from Revision C (April 2016) to Revision D Page
• Added back channel line rate = 5.5 MHz as test condition; also added footnote for clarification between MHz and
Mbps distinction.................................................................................................................................................................... 10
• Removed 'ns' unit from specifications referencing period in units of T. ............................................................................... 11
• Updated test condition specs for jitter bandwidth regarding t
JIT0
, t
JIT1
, and t
JIT2
. .................................................................. 11
• Added input external oscillator frequency range for pin/freq. .............................................................................................. 11
• Added parameter for typical external oscillator frequency stability. ..................................................................................... 11
• Added test conditions to t
JIND
, t
JINR
, and t
JINT
. ....................................................................................................................... 15
• Added DOUT± as measured output pins for jitter parameters. ............................................................................................ 15
• Added note (6) for "Serializer output peak-to-peak total jitter includes deterministic jitter, random jitter, and jitter
transfer from serializer input". .............................................................................................................................................. 15
• Added jitter tolerance curve for typical system IJT configuration with DS90UB913A linked to DS90UB914A. .................. 16
• Added device functional mode table for external oscillator operation with example XCLKIN = 48MHz. ............................ 21
Changes from Revision B (December 2014) to Revision C Page
• 将文档拆分为有关器件 DS90UB913A-Q1 和 DS90UB914A-Q1 的两个独立文档 .................................................................. 1
• 已修改汽车 特性 .................................................................................................................................................................... 1
• Updated pin description for DIN to include active/inactive outputs corresponding to MODE setting..................................... 5
• Added pin description to GPO pins to leave open if unused. ................................................................................................ 6
• Changed Air Discharge ESD Rating (IEC61000-4-2: RD = 330 Ω, CS = 150 pF) to minimum ±25000 V. .......................... 7
• Added RTV text to Thermal Information table........................................................................................................................ 8
• Added GPO[3:0] typical pin capacitances. ............................................................................................................................ 9
• Changed Differential Output Voltage minimum specification. ............................................................................................... 9
• Changed Single-Ended Output Voltage minimum specification............................................................................................. 9
• Added Back Channel Differential Input Voltage minimum specification............................................................................... 10
• Added Back Channel Single-Ended Input Voltage minimum specification. ......................................................................... 10
• Updated IDDT for V
DD_n
=1.89V, V
DDIO
=3.6V, RL=100Ω, Random Pattern with f=100 MHz, 10-bit mode to typical
value of 65 mA; value is currently 54 mA............................................................................................................................. 10
• Updated IDDT for V
DD_n
=1.89V, V
DDIO
=3.6V, RL=100Ω, Random Pattern with f=75 MHz, 12-bit high freq mode to
typical value of 64 mA; value is currently 54 mA.................................................................................................................. 10
• Updated IDDT for V
DD_n
=1.89V, V
DDIO
=3.6V, RL=100Ω, Random Pattern with f=50 MHz, 12-bit low freq mode to
typical value of 63 mA; value is currently 54 mA. ............................................................................................................... 10
• Updated frequency ranges for MODE settings and also revised with correct maximum clock periods. Added footnote
and nominal clock period to be in terms of 'T'.
(5)
.................................................................................................................. 11
• Deleted Revised jitter freq. test conditions to be > f/20 and also updated typical values for t
jit0
and t
jit2
. ............................. 11
• Updated V
OL
Output Low Level row with revised I
OL
currents and max V
OL
voltages, dependent upon V
DDIO
voltage. ...... 12
• Updated Figure 2 title to state ‘“Worst-Case” Test Pattern for Power Consumption’. ......................................................... 13
• Added footnote that states the following: “UI – Unit Interval is equivalent to one serialized data bit width. The UI
scales with PCLK frequency.” Add below calculations to footnote. 12-bit LF mode 1 UI = 1 / ( PCLK_Freq. x 28 ) 12-
bit HF mode 1 UI = 1 / ( PCLK_Freq. x 2/3 x 28 ) 10-bit mode 1 UI = 1 / ( PCLK_Freq. /2 x 28 ) ..................................... 15
• Updated frequency requirements for 10-bit and 12-bit HF modes. 10-bit mode – 50 MHz to 100 MHz; 12-bit HF

4
DS90UB913A-Q1
ZHCSEW6F –MAY 2013 –REVISED JANUARY 2020
www.ti.com.cn
Copyright © 2013–2020, Texas Instruments Incorporated
mode – 37.5 MHz to 75 MHz; 12-bit LF mode (no change) – 25 MHz to 50 MHz. ............................................................ 17
• Updated register 0x01[1] default value to be “0”. ................................................................................................................. 30
• Changed GPO0 Enable for 0x0D[4] to GPO1 Enable.......................................................................................................... 33
• Added Inject Forward Channel Error Register 0x2D............................................................................................................ 36
• Updated power up sequencing information and timing diagram. ........................................................................................ 37
• Added description specifying that the voltage applied on V
DDIO
(1.8 V, 3.3 V) or V
DD_n
(1.8 V) should be at the input
pin – any board level DC drop should be compensated. .................................................................................................... 43
• Added 913A EVM layout example image. ........................................................................................................................... 46
Changes from Revision A (June 2013) to Revision B Page
• 已添加 数据表流程和版面布局,以符合全新 TI 标准。已添加以下部分:器件比较表;处理额定值;应用和实施;电
源相关建议;布局;器件和文档支持;机械、封装和订购信息............................................................................................... 1
• Added additional thermal characteristics................................................................................................................................ 8
• Changed typo in Vout test condition from R
L
=500Ω to R
L
=50Ω. .......................................................................................... 9
• Changed Figure 6 to use V
ODp-p
and to clarify difference between STP and Coax.............................................................. 14
• Added Internal Oscillator section to Device Functional Modes ............................................................................................ 23
• Added reference to Power over Coax Application report ..................................................................................................... 37
• Added power up sequencing information and timing diagram. ............................................................................................ 37

32 31 30 29 28 27 26
25
1 2 3 4 5 6 7
8
9 10 11 12 13 14 15 16
24 23 22 21 20 19 18 17
DS90UB913A-Q1
Serializer
VDDIO
DIN[8]
DIN[9]
DIN[10]
DIN[11]
DIN[7]
DIN[6]
DIN[5]
DIN[4]
DIN[3]
DIN[2]
DIN[1]
DIN[0]
VDDCML
VDDT
VDDPLL
PDB
DOUT-
DOUT+
HSYNC
VSYNC
PCLK
SCL
SDA
ID[x]
RES
MODE
GPO[2]/
CLKOUT
GPO[1]
GPO[0]
VDDD
GPO[3]/
CLKIN
DAP = GND
5
DS90UB913A-Q1
www.ti.com.cn
ZHCSEW6F –MAY 2013–REVISED JANUARY 2020
Copyright © 2013–2020, Texas Instruments Incorporated
5 Device Comparison Table
PART NUMBER FPD-III FUNCTION PACKAGE TRANSMISSION MEDIA PCLK FREQUENCY
DS90UB913Q-Q1 Serializer WQFN RTV (32) STP 10 to 100 MHz
DS90UB913A-Q1 Serializer WQFN RTV (32) Coax or STP 25 to 100 MHz
6 Pin Configuration and Functions
32-Pin WQFN
Package RTV
Top View
Pin Functions: DS90UB913A-Q1 Serializer
PIN
I/O DESCRIPTION
NAME NO.
LVCMOS PARALLEL INTERFACE
DIN[0:11]
19,20,21,22,
23,24,26,27,
29,30,31,32
Inputs,
LVCMOS
w/ pulldown
Parallel Data Inputs. For 10-bit MODE, parallel inputs DIN[0:9] are active. DIN[10:11] are
inactive and should not be used. Any unused inputs (including DIN[10:11]) should be No
Connect. For 12-bit MODE (HF or LF), parallel inputs DIN[0:11] are active. Any unused
inputs should be No Connect.
HSYNC 1
Input,
LVCMOS
w/ pulldown
Horizontal SYNC Input. Note: HS transition restrictions: 1. 12-bit Low-Frequency mode: No
HS restrictions (raw) 2. 12-bit High-Frequency mode: No HS restrictions (raw) 3. 10-bit
mode: HS restricted to no more than one transition per 10 PCLK cycles. Leave open if
unused.
VSYNC 2
Input,
LVCMOS
w/ pulldown
Vertical SYNC Input. Note: VS transition restrictions: 1. 12-bit Low-Frequency mode: No VS
restrictions (raw) 2. 12-bit High-Frequency mode: No VS restrictions (raw) 3. 10-bit High-
Frequency mode: VS restricted to no more than one transition per 10 PCLK cycles. Leave
open if unused.
PCLK 3
Input,
LVCMOS
w/ pulldown
Pixel Clock Input Pin. Strobe edge set by TRFB control register 0x03[0].
剩余52页未读,继续阅读
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