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TI-DS90UB924-Q1.pdf
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100Q STP Cable
LVDS Display
720p or
Graphic
Proccesor
DS90UB924-Q1
Deserializer
FPD-Link III
1 Pair/AC Coupled
FPD-Link
(Open LDI)
TxOUT1+/-
TxCLKOUT+/-
TxOUT2+/-
TxOUT0+/-
TxOUT3+/-
V
DDIO
(1.8V or 3.3V)
RIN+
RIN-
SDA
SCL
I2S
MCLK
6
V
DD33
(3.3V)
MODE_SEL
BISTEN
LFMODE
MAPSEL
PDB
OSS_SEL
OEN
LOCK
PASS
INTB_IN
IDx
R[7:0]
HS
VS
PCLK
PDB
Serializer
DE
RGB Digital Display Interface
HOST
Graphics
Processor
DS90UB921-Q1
V
DDIO
SCL
SDA
I2S AUDIO
(STEREO)
IDx
DAP
G[7:0]
B[7:0]
DOUT+
DOUT-
(1.8V or 3.3V)
(3.3V)
3
V
DD33
INTB
MODE_SEL
Copyright © 2016, Texas Instruments Incorporated
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Design
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
English Data Sheet: SNLS512
DS90UB924-Q1
ZHCSEY4 –APRIL 2016
DS90UB924-Q1 具具有有双双向向控控制制通通道道的的 5MHz 至至 96MHz 24 位位彩彩色色 FPD-
Link III 转转 OpenLDI 解解串串器器
1
1 特特性性
1
• 适用于汽车电子 应用 AEC-Q100
– 器件温度 2 级:-40℃ 至 +105℃ 的环境运行温
度范围
– 器件人体放电模型 (HBM) 静电放电 (ESD) 分类
等级 ±8kV
– 带电器件模型 (CDM) ESD 分类等级 C6
• 支持 5MHz 至 96MHz 像素时钟
• 双向控制通道接口,可连接兼容 I
2
C 的串行控制总
线
• 低电磁干扰 (EMI) OpenLDI 视频输出
• 支持高清 (720p) 数字视频
• 支持 RGB888 + VS,HS,DE 和 I2S 音频
• 多达 4 个适用于环绕立体声应用的 I2S 数字音频
输出
• 4 条具有 2 个专用引脚的双向通用输入输出 (GPIO)
通道
• 通过兼容 1.8V 或 3.3V 的低电压互补金属氧化物半
导体 (LVCMOS) I/O 接口实现 3.3V 单电源供电运
行
• 具有嵌入式时钟的直流均衡和扰频数据
• 自适应电缆均衡
• 内部模式生成
• 向后兼容模式
2 应应用用范范围围
• 汽车用触摸显示屏
• 汽车导航显示屏
• 汽车仪表板
3 说说明明
DS90UB924-Q1 解串器与 DS90UB921-Q1、
DS90UB925Q-Q1、DS90UB927Q-Q1、DS90UB929-
Q1、DS90UB949-Q1 或 DS90UB947-Q1 串行器配套
使用,可针对汽车信息娱乐系统内的数字视频和音频的
分配提供一套解决方案。该器件可将嵌入时钟的高速串
行化接口(通过单信号对 (FPD-Link III) 传输)转换为
四个 LVDS 数据/控制流、一个 LVDS 时钟对
(OpenLDI) 以及 I2S 音频数据。FPD-Link III 串行总线
方案支持通过单条差分链路实现高速正向通道数据传输
和低速反向通道通信的全双工控制。通过单个差分对整
合音频、视频和和控制数据可减小互连线尺寸和重量,
同时还消除了偏差问题并简化了系统设计。
通过对串行输入数据流使用自适应输入均衡功能,可对
传输介质损耗和确定性抖动进行补偿。通过使用低压差
分信令可最大限度减少电磁干扰 (EMI)。
器器件件信信息息
(1)
部部件件号号 封封装装 封封装装尺尺寸寸((标标称称值值))
DS90UB924-Q1 WQFN (48) 7.00mm x 7.00mm
(1) 要了解所有可用封装,请参见数据表末尾的可订购产品附录。

2
DS90UB924-Q1
ZHCSEY4 –APRIL 2016
www.ti.com.cn
Copyright © 2016, Texas Instruments Incorporated
目目录录
1 特特性性.......................................................................... 1
2 应应用用范范围围................................................................... 1
3 说说明明.......................................................................... 1
4 修修订订历历史史记记录录 ........................................................... 2
5 Pin Configuration and Functions......................... 3
6 Specifications......................................................... 6
6.1 Absolute Maximum Ratings ..................................... 6
6.2 ESD Ratings.............................................................. 6
6.3 Recommended Operating Conditions....................... 6
6.4 Thermal Information.................................................. 7
6.5 DC Electrical Characteristics .................................... 7
6.6 AC Electrical Characteristics..................................... 9
6.7 DC and AC Serial Control Bus Characteristics....... 10
6.8 Timing Requirements for the Serial Control Bus .... 10
6.9 Timing Requirements.............................................. 11
6.10 Typical Characteristics.......................................... 15
7 Detailed Description............................................ 16
7.1 Overview ................................................................. 16
7.2 Functional Block Diagram ....................................... 16
7.3 Feature Description................................................. 17
7.4 Device Functional Modes........................................ 27
7.5 Programming........................................................... 33
7.6 Register Maps......................................................... 35
8 Application and Implementation ........................ 50
8.1 Application Information............................................ 50
8.2 Typical Application .................................................. 50
9 Power Supply Recommendations...................... 53
9.1 Power Up Requirements and PDB Pin................... 53
9.2 Analog Power Signal Routing ................................. 55
10 Layout................................................................... 55
10.1 Layout Guidelines ................................................. 55
10.2 Layout Example .................................................... 57
11 器器件件和和文文档档支支持持 ..................................................... 58
11.1 文档支持................................................................ 58
11.2 社区资源................................................................ 58
11.3 商标 ....................................................................... 58
11.4 静电放电警告......................................................... 58
11.5 Glossary................................................................ 58
12 机机械械、、封封装装和和可可订订购购信信息息....................................... 58
4 修修订订历历史史记记录录
日日期期 修修订订版版本本 注注释释
2016 年 4 月 * 首次发布。

38
39
40
41
42
43
44
45
46
47
48
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
36
35
34
33
32
31
30
29
28
27
26
25
DS90UB924-Q1
TOP VIEW
DAP = GND
CAPLV12
BISTC/INTB_IN
CAPR12
CMF
RIN-
VDD33_A
TxOUT3-
GPIO1/SDOUT
TxCLKOUT-
TxOUT2+
TxOUT1+
TxOUT1-
RIN+
CMLOUTP
CMLOUTN
IDx
TxOUT3+
GPIO0/SWC
TxCLKOUT+
TxOUT2-
PDB
I2S_WC/GPIO_REG7
MCLK
OSS_SEL
RES1
OEN
BISTEN
VDD33_B
LOCK
I2S_CLK/GPIO_REG8
I2S_DA/GPIO_REG6
PASS
I2S_DB/GPIO_REG5
SDA
SCL
VDDIO
37
CAPP12
CAPL12
CAPI2S
LFMODE
TxOUT0+
TxOUT0-
RES0
I2S_DC/GPIO2
I2S_DD/GPIO3
CAPLV25
MODE_SEL
MAPSEL
3
DS90UB924-Q1
www.ti.com.cn
ZHCSEY4 –APRIL 2016
Copyright © 2016, Texas Instruments Incorporated
5 Pin Configuration and Functions
RHS Package
48-Pin WQFN
Top View
Pin Functions
PIN
I/O, TYPE DESCRIPTION
NAME NO.
FPD-LINK (OpenLDI) OUTPUT INTERFACE
TxCLKOUT- 18 O, LVDS Inverting LVDS Clock Output
The pair requires external 100-Ω differential termination for standard LVDS levels
TxCLKOUT+ 17 O, LVDS True LVDS Clock Output
The pair requires external 100-Ω differential termination for standard LVDS levels
TxOUT[3:0]- 16, 20, 22,
24
O, LVDS Inverting LVDS Data Outputs
Each pair requires external 100-Ω differential termination for standard LVDS levels
TxOUT[3:0]+ 15, 19, 21,
23
O, LVDS True LVDS Data Outputs
Each pair requires external 100-Ω differential termination for standard LVDS levels
LVCMOS INTERFACE
GPIO[1:0] 13, 14 I/O, LVCMOS
with pulldown
General Purpose IO
Shared with SDOUT, SWC
GPIO[3:2] 36, 37 I/O, LVCMOS
with pulldown
General Purpose I/O
Shared with I2S_DD, I2S_DC

4
DS90UB924-Q1
ZHCSEY4 –APRIL 2016
www.ti.com.cn
Copyright © 2016, Texas Instruments Incorporated
Pin Functions (continued)
PIN
I/O, TYPE DESCRIPTION
NAME NO.
GPIO_REG[8
:5]
8, 10, 7, 3 I/O, LVCMOS
with pulldown
General Purpose I/O, register access only
Shared with I2S_CLK, I2S_WC, I2S_DA, I2S_DB
I2S_DA
I2S_DB
I2S_DC
I2S_DD
7
3
37
36
O, LVCMOS Digital Audio Interface I2S Data Outputs
Shared with GPIO_REG6, GPIO_REG5, GPIO2, GPIO3
INTB_IN 43 I, LVCMOS
with pulldown
Interrupt Input
Shared with BISTC
MCLK
I2S_WC
I2S_CLK
11
10
8
O, LVCMOS Digital Audio Interface I2S Master Clock, Word Clock and I2S Bit Clock Outputs
I2S_WC and I2S_CLK are shared with GPIO_REG7 and GPIO_REG8
SDOUT
SWC
13
14
O, LVCMOS
with pulldown
Auxiliary Digital Audio Interface I2S Data Output and Word Clock
Shared with GPIO1 and GPIO0
CONTROL AND CONFIGURATION
BISTC 43 I, LVCMOS
with pulldown
BIST Clock Select
Shared with INTB_IN
Requires a 10-KΩ pullup if set HIGH
BISTEN 9 I, LVCMOS
with pulldown
BIST Enable
Requires a 10-KΩ pullup if set HIGH
IDx 12 I, Analog I2C Address Select
External pullup to VDD33 is required under all conditions. DO NOT FLOAT.
Connect to external pullup to VDD33 and pulldown to GND to create a voltage divider.
See Table 7
LFMODE 32 I, LVCMOS
with pulldown
Low Frequency Mode Select
LFMODE = 0, 15-MHz ≤ TxCLKOUT ≤ 96-MHz (Default)
LFMODE = 1, 5-MHz ≤ TxCLKOUT < 15-MHz
Requires a 10-KΩ pullup if set HIGH
MAPSEL 26 I, LVCMOS
with pulldown
FPD-Link (OpenLDI) Output Map Select
MAPSEL = 0, LSBs on TxOUT3± (Default)
MAPSEL = 1, MSBs on TxOUT3±
Requires a 10-KΩ pullup if set HIGH
MODE_SEL 48 I, Analog Device Configuration Select
Configures Backwards Compatibility (BKWD), Repeater (REPEAT), I2S 4 channel (I2S_B),
and Long Cable (LCBL) modes
Connect to external pullup to VDD33 and pulldown to GND resistors to create a voltage
divider. DO NOT FLOAT
See Table 6
OEN 30 I, LVCMOS
with pulldown
Output Enable
Requires a 10-KΩ pullup if set HIGH
See Table 5
OSS_SEL 35 I, LVCMOS
with pulldown
Output Sleep State Select
Requires a 10 KΩ pullup if set HIGH
See Table 5
PDB 1 I, LVCMOS Power-down Mode Input Pin
Must be driven or pulled up to VDD33. Refer to Power Up Requirements and PDB PinPower
Up Requirements and PDB Pin in Application and Implementation.
PDB = H, device is enabled (normal operation)
PDB = L, device is powered down
When the device is in the powered down state, the LVDS and LVCMOS outputs are tri-state,
the PLL is shutdown, and I
DD
is minimized. Control Registers are RESET.
SCL 5 I/O, Open
Drain
I
2
C Clock Input/Output Interface
Must have an external pullup to V
DD33
. DO NOT FLOAT
Recommended pullup: 4.7 KΩ
SDA 4 I/O, Open
Drain
I2C Data Input/Output Interface
Must have an external pullup to VDD33. DO NOT FLOAT
Recommended pullup: 4.7 kΩ

5
DS90UB924-Q1
www.ti.com.cn
ZHCSEY4 –APRIL 2016
Copyright © 2016, Texas Instruments Incorporated
Pin Functions (continued)
PIN
I/O, TYPE DESCRIPTION
NAME NO.
(1) The V
DD
(V
DD33
and V
DDIO
) supply ramp must be faster than 1.5 ms with a monotonic rise.
STATUS
LOCK 27 O, LVCMOS LOCK Status Output
0: PLL is unlocked, I2S, GPIO, TxOUT[3:0]±, and TxCLKOUT± are idle with output states
controlled by OEN and OSS_SEL. May be used to indicate Link Status or Display Enable.
1: PLL is locked, outputs are active with output states controlled by OEN and OSS_SEL
Route to test point or pad (recommended). Float if unused.
PASS 28 O, LVCMOS PASS Status Output
0: One or more errors were detected in the received BIST payload (BIST Mode)
1: Error-free transmission (BIST Mode)
Route to test point or pad (Recommended). Float if unused.
FPD-LINK III SERIAL INTERFACE
CMF 42 Analog Common Mode Filter
Requires a 0.1-µF capacitor to GND
CMLOUTN 45 O, LVDS Inverting Loop-through Driver Output
Monitor point for equalized forward channel differential signal
CMLOUTP 44 O, LVDS True Loop-through Driver Output
Monitor point for equalized forward channel differential signal
RIN- 41 I/O, LVDS FPD-Link III Inverting Input
The output must be AC-coupled with a 0.1-µF capacitor
RIN+ 40 I/O, LVDS FPD-Link III True Input
The output must be AC-coupled with a 0.1-µF capacitor
POWER AND GROUND
(1)
GND DAP Ground Large metal contact at the bottom center of the device package
Connect to the ground plane (GND) with at least 9 vias
VDD33_A
VDD33_B
38
31
Power 3.3-V power to on-chip regulator
Each pin requires a 4.7-µF capacitor to GND
VDDIO 6 Power 1.8-V / 3.3-V LVCMOS I/O Power
Requires a 4.7-µF capacitor to GND
REGULATOR CAPACITOR
CAPI2S
CAPLV25
CAPLV12
CAPR12
CAPP12
2
25
29
46
47
CAP Decoupling capacitor connection for on-chip regulator
Each requires a 4.7-µF decoupling capacitor to GND
CAPL12 33 CAP Decoupling capacitor connection for on-chip regulator
Requires two 4.7-µF decoupling capacitors to GND
OTHER
RES[1:0] 39, 34 GND Reserved
Connect to GND
剩余64页未读,继续阅读
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