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FPD-Link串行器

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100Q STP Cable

FPD-Link Display Interface

RGB Display

720p

24-bit Color Depth

DS90UB927Q-Q1

Serializer

DS90UB928Q-Q1

Deserializer

FPD-Link III

1 Pair/AC Coupled

DDIO

(1.8V or 3.3V)

FPD-Link

RxIN1+/-

RxCLKIN+/-

RxIN2+/-

RxIN0+/-

RxIN3+/-

TxOUT1+/-

TxCLKOUT+/-

TxOUT2+/-

TxOUT0+/-

TxOUT3+/-

DDIO

(1.8V or 3.3V)

HOST

Graphics

Processor

DOUT+

DOUT-

RIN+

RIN-

SDA

SCL

I2S

MCLK

DD33

(3.3V)

DD33

(3.3V)

MODE_SEL

BISTEN

LFMODE

MAPSEL

PDB

OSS_SEL

OEN

BKWD

REPEAT

LFMODE

MAPSEL

IDx

SDA

SCL

LOCK

PASS

PDB

INTB

I2S

INTB_IN

IDx

Product

Folder

Sample &

Buy

Technical

Documents

Tools &

Software

Support &

Community

DS90UB927Q-Q1

ZHCSDA3D –JUNE 2012–REVISED JANUARY 2015

DS90UB927Q-Q1 具具有有双双向向控控制制通通道道的的 5MHz 至至 85MHz 24 位位彩彩色色 FPD-

Link III 串串行行器器

1 特特性性 3 说说明明

• 双向控制通道接口，可连接到 I

C 兼容串行控制总

DS90UB927Q-Q1 串行器与 DS90UB928Q-Q1 或

线

DS90UB926Q-Q1 解串器配套使用，可提供完整的数

• 低电磁干扰 (EMI) FPD-Link 视频输入

字接口以实现汽车显示屏和图像传感应用中视频、音频

• 支持高清 (720p) 数字视频格式

和控制数据的高速并行传输。

• 支持 5MHz 至 85MHz 像素时钟 (PCLK)

该芯片组非常适合高清 (HD) 格式的车载视频显示系统

• 支持 RGB888 + VS、HS、DE 和 I

S 音频

以及具有百万象素级分辨率的车载视觉系统。

• 多达 4 个针对环绕立体声应用的 I

S 数字音频输入

DS90UB927Q-Q1 整合了嵌入式双向控制通道和低延

• 4 条具有 2 个专用引脚的双向通用输入输出 (GPIO)

迟 GPIO 控制。该器件将 FPD-Link 视频接口转换为

通道

单对高速串行化接口。 FPD-Link III 串行总线方案支持

• 通过 1.8V 或 3.3V 兼容 LVCMOS I/O 接口实现

通过单个差分链路实现高速正向通道数据传输和低速反

3.3V 单电源运行

向通道通信的全双工控制。通过单个差分对整合音

• 长达 10 米的交流耦合屏蔽双绞线 (STP) 互连

频、视频和和控制数据可减小互连线尺寸和重量，同时

• 具有嵌入式时钟的直流均衡和扰频数据

还消除了偏差问题并简化了系统设计。

• 支持中继器应用

• 内部模式生成

DS90UB927Q-Q1 串行器嵌入了时钟，并将信号电平

• 低功率模式最大限度地减少了功率耗散

位移至高速低压差分信令。多达 24 个 RGB 数据位连

• 汽车应用级产品：符合 AEC-Q100 2 级要求

同 3 个视频控制信号和多达 4 个 I

S 数据输入一起被

• >8kV 的人体模型 (HBM) 和 ISO 10605 静电放电

串行化。

(ESD) 额定值

凭借 FPD-Link 数据接口，该器件可轻松连接数据源，

• 向后兼容模式

同时还能减小 EMI 和总线宽度。通过使用低压差分信

令、数据扰频和随机生成以及直流均衡功能可最大程度

2 应应用用范范围围

减少高速 FPD-Link III 总线上的 EMI。

• 汽车导航显示屏

• 后座娱乐系统

器器件件信信息息

(1)

• 汽车驾驶员辅助系统

器器件件型型号号封封装装封封装装尺尺寸寸（（标标称称值值））

• 车载百万象素级摄像机系统

DS90UB927Q-Q1 WQFN (40) 6.00mm x 6.00mm

(1) 如需了解所有可用封装，请见数据表末尾的可订购产品附录。

应应用用图图

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

English Data Sheet: SNLS416

DS90UB927Q-Q1

ZHCSDA3D –JUNE 2012–REVISED JANUARY 2015

www.ti.com.cn

目目录录

7.2 Functional Block Diagram ....................................... 15

1 特特性性.......................................................................... 1

7.3 Feature Description................................................. 16

2 应应用用范范围围................................................................... 1

7.4 Device Functional Modes........................................ 23

3 说说明明.......................................................................... 1

7.5 Programming........................................................... 29

4 修修订订历历史史记记录录 ........................................................... 2

7.6 Register Maps......................................................... 31

5 Pin Configuration and Functions......................... 3

8 Application and Implementation ........................ 44

6 Specifications......................................................... 5

8.1 Application Information............................................ 44

6.1 Absolute Maximum Ratings ...................................... 5

8.2 Typical Application .................................................. 44

6.2 ESD Ratings.............................................................. 5

8.3 System Examples ................................................... 46

6.3 Recommended Operating Conditions....................... 6

9 Power Supply Recommendations...................... 48

6.4 Thermal Information.................................................. 6

10 Layout................................................................... 48

6.5 DC Electrical Characteristics .................................... 7

10.1 Layout Guidelines ................................................. 48

6.6 AC Electrical Characteristics..................................... 9

10.2 Layout Example .................................................... 49

6.7 Electrical Characteristics: DC and AC Serial Control

Bus........................................................................... 10

11 器器件件和和文文档档支支持持 ..................................................... 51

6.8 Timing Requirements for the Serial Control Bus .... 11

11.1 文档支持................................................................ 51

6.9 Timing Requirements - DC and AC Serial Control

11.2 商标 ....................................................................... 51

Bus Characteristics .................................................. 11

11.3 静电放电警告......................................................... 51

6.10 Typical Characteristics.......................................... 14

11.4 术语表 ................................................................... 51

7 Detailed Description............................................ 15

12 机机械械封封装装和和可可订订购购信信息息 .......................................... 51

7.1 Overview ................................................................. 15

4 修修订订历历史史记记录录

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision C (October 2012) to Revision D Page

• 已添加 ESD

额定值

表，

特性描述

部分，

器件功能模式

，

应用和实施

部分，

电源相关建议

部分，

布局

部分，

器件和文档

支持

部分以及

机械、封装和可订购信息

部分 ........................................................................................................................... 1

Changes from Revision B (June 2012) to Revision C Page

• Changed layout of National data sheet to tI format.............................................................................................................. 49

DS90UB927Q-Q1

ZHCSDA3D –JUNE 2012–REVISED JANUARY 2015

www.ti.com.cn

Pin Functions (continued)

I/O DESCRIPTION

NAME NO.

Low Frequency Mode Select

I, LVCMOS LFMODE = 0, 15 MHz ≤ RxCLKIN ≤ 85 MHz (Default)

LFMODE 25

with pulldown LFMODE = 1, 5 MHz ≤ RxCLKIN < 15 MHz

Requires a 10-kΩ pullup if set HIGH

FPD-Link Input Map Select

MAPSEL = 0, LSBs on RxIN3± (Default)

I, LVCMOS

MAPSEL 23 MAPSEL = 1, MSBs on RxIN3±

with pulldown

See Figure 19 and Figure 20

Requires a 10-kΩ pullup if set HIGH

Repeater Mode Select

I, LVCMOS REPEAT = 0, Repeater Mode disabled (Default)

REPEAT 21

with pulldown REPEAT = 1, Repeater Mode enabled

Requires a 10-kΩ pullup if set HIGH

OPTIONAL PARALLEL INTERFACE

I/O, LVCMOS General Purpose I/O

GPIO[3:2] 6, 5

with pulldown Shared with I2S_DD and I2S_DC (See Table 1)

GPIO_REG I/O, LVCMOS Register-Only General Purpose I/O

2, 1, 3, 4

[8:5] with pulldown Shared with I2S_CLK, I2S_WC, I2S_DA, I2S_DB (See Table 2)

CONTROL AND CONFIGURATION

C Address Select

External pullup to V

DD33

is required under all conditions. DO NOT FLOAT.

IDx 11 I, Analog

Connect to external pullup to V

DD33

and pulldown to GND to create a voltage divider.

See Figure 25 and Table 4

Power-down Mode Input Pin

Must be driven or pulled up to V

DD33

. Refer to Power Supply Recommendations.

I, LVCMOS PDB = H, device is enabled (normal operation)

PDB 18

with pulldown PDB = L, device is powered down.

When the device is in the powered down state, the Driver Outputs are both HIGH, the PLL is

shutdown, and I

is minimized. Control Registers are RESET.

C Clock Input / Output Interface

I/O, LVCMOS

SCL 9 Must have an external pullup to V

DD33

. DO NOT FLOAT.

Open Drain

Recommended pullup: 4.7 kΩ.

C Data Input / Output Interface

I/O, LVCMOS

SDA 10 Must have an external pullup to V

DD33

. DO NOT FLOAT.

Open Drain

Recommended pullup: 4.7 kΩ.

STATUS

Interrupt

O, LVCMOS INTB = H, normal

INTB 27

Open Drain INTB = L, Interrupt request

Recommended pullup: 4.7 kΩ to V

DDIO

. DO NOT FLOAT.

FPD-LINK III SERIAL INTERFACE

Common Mode Filter.

CMF 20 Analog

Connect 0.1 µF to GND (required)

Inverting Output

DOUT- 16 I/O, LVDS

The output must be AC-coupled with a 0.1-µF capacitor.

True Output

DOUT+ 17 I/O, LVDS

The output must be AC-coupled with a 0.1-µF capacitor.

DS90UB927Q-Q1

www.ti.com.cn

ZHCSDA3D –JUNE 2012–REVISED JANUARY 2015

Pin Functions (continued)

I/O DESCRIPTION

NAME NO.

POWER

(1)

AND GROUND

Large metal contact at the bottom center of the device package Connect to the ground

GND DAP Ground

plane (GND) with at least 9 vias.

VDD33_A 19

Power Power to on-chip regulator 3.0 V - 3.6 V. Each pin requires a 4.7-µF capacitor to GND

VDD33_B 26

VDDIO 7, 24 Power LVCMOS I/O Power 1.8 V ±5% OR 3.0 V - 3.6 V. Each pin requires 4.7-µF capacitor to GND

REGULATOR CAPACITOR

Decoupling capacitor connection for on-chip regulator

CAPL12 8 CAP

Requires two 4.7-µF decoupling capacitors to GND

CAPP12 12

Decoupling capacitor connection for on-chip regulator

CAPHS12 14 CAP

Each requires a 4.7-µF decoupling capacitor to GND.

CAPLVD12 28

OTHER

Reserved

RES[1:0] 15, 13 GND

Connect to GND.

(1) The V

DD33

and V

DDIO

) supply ramp should be faster than 1.5 ms with a monotonic rise.

6 Specifications

6.1 Absolute Maximum Ratings

(1)(2)(3)

MIN MAX UNIT

Supply Voltage – V

DD33

−0.3 4.0 V

Supply Voltage – V

DDIO

−0.3 4.0 V

LVCMOS I/O Voltage −0.3 V

DDIO

+ 0.3 V

Serializer Output Voltage −0.3 2.75 V

Junction Temperature 150 °C

Storage Temperature, T

stg

−65 150 °C

(1) For soldering specifications: see product folder at www.ti.com and SNOA549.

(2) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

6.2 ESD Ratings

VALUE UNIT

Human body model (HBM), per AEC Q100-002

(1)

±8000

Charged device model (CDM), per AEC Q100-011 ±1250

Machine model (MM) ±250

(IEC 61000-4-2, powered-up only) Air Discharge

±15000

= 330 Ω, C

= 150 pF (Pin 16 and 17)

Electrostatic

(ESD)

Contact Discharge

discharge

±8000

(Pin 16 and 17)

(ISO 10605) Air Discharge

±15000

= 330 Ω, C

= 150 pF/330 pF (Pin 16 and 17)

= 2 kΩ, C

= 150 pF/330 pF

Contact Discharge

±8000

(Pin 16 and 17)

(1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

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