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TI-DS90UB947N-Q1.pdf
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DS90UB948-Q1
Deserializer
DS90UB947N-Q1
Serializer
FPD-Link III
2 lanes @ 3Gbps / per Lane
VDDIO
1.8 V
DOUT0+
DOUT0±
1.1 V
DOUT1+
DOUT1±
RIN0+
RIN0±
RIN1+
RIN1±
CLK+/±
CLK2+/±
FPD-Link
(OpenLDI)
D0+/±
D1+/±
D2+/±
D3+/±
D4+/±
D5+/±
D6+/±
D7+/±
IDx
D_GPIO
(SPI)
D_GPIO
(SPI)
Graphics
Processor
LVDS Display
1080p60
or Graphic
Processor
VDDIO
1.8 V or 3.3 V
1.2 V
I2C
3.3 V
1.8 V
CLK+/±
D0+/±
D1+/±
D2+/±
D3+/±
D4+/±
D5+/±
D6+/±
D7+/±
FPD-Link
(OpenLDI)
IDx
I2C
Product
Folder
Order
Now
Technical
Documents
Tools &
Software
Support &
Community
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
DS90UB947N-Q1
SNLS627 –DECEMBER 2019
DS90UB947N-Q1 1080p OpenLDI to FPD-Link III Serializer
1
1 Features
1
• AEC-Q100 qualified for automotive applications
– Device temperature grade 2: –40°C to +105°C,
T
A
• Supports clock frequency up to 170 MHz for
WUXGA (1920x1200) and 1080p60 resolutions
with 24-bit color depth
• Single and dual FPD-Link III outputs
– Single link: up to 96-MHz pixel clock
– Dual link: up to 170-MHz pixel clock
• Single and dual OpenLDI (LVDS) receiver
– Configurable 18-bit RGB or 24-bit RGB
• High-speed back channel supporting GPIO up to 2
Mbps
• Supports up to 15 meters of cable with automatic
temperature and aging compensation
• I2C (master/slave) with 1-Mbps fast-mode plus
• SPI pass-through interface
• Backward-compatible with DS90UB926Q-Q1 and
DS90UB928Q-Q1 FPD-Link III deserializers
2 Applications
• Automotive infotainment:
– IVI head units and HMI modules
– Rear seat entertainment systems
– Digital instrument clusters
• Security and surveillance camera
3 Description
The DS90UB947N-Q1 is an OpenLDI to FPD-Link III
bridge device which, in conjunction with the FPD-Link
III DS90UB940-Q1/DS90UB948-Q1 deserializers,
provides 1-lane or 2-lane high-speed serial streams
over cost-effective 50-Ω single-ended coaxial or 100-
Ω differential shielded twisted-pair (STP) cables. It
serializes an OpenLDI input supporting video
resolutions up to WUXGA and 1080p60 with 24-bit
color depth.
The FPD-Link III interface supports video and audio
data transmission and full duplex control, including
I2C and SPI communication, over the same
differential link. Consolidation of video data and
control over two differential pairs reduces the
interconnect size and weight and simplifies system
design. EMI is minimized by the use of low voltage
differential signaling, data scrambling, and
randomization. In backward compatible mode, the
device supports up to WXGA and 720p resolutions
with 24-bit color depth over a single differential link.
The DS90UB947N-Q1 supports multi-channel audio
received through an external I2S interface. Audio
data received by the device is encrypted and sent
over the FPD-Link III interface where it is regenerated
by the deserializer.
Device Information
(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
DS90UB947N-Q1 VQFN (64) 9.00 mm × 9.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Applications Diagram

2
DS90UB947N-Q1
SNLS627 –DECEMBER 2019
www.ti.com
Product Folder Links: DS90UB947N-Q1
Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated
Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions......................... 3
6 Specifications......................................................... 6
6.1 Absolute Maximum Ratings ..................................... 6
6.2 ESD Ratings.............................................................. 6
6.3 Recommended Operating Conditions....................... 6
6.4 Thermal Information.................................................. 7
6.5 DC Electrical Characteristics .................................... 7
6.6 AC Electrical Characteristics..................................... 8
6.7 DC and AC Serial Control Bus Characteristics......... 9
6.8 Recommended Timing for the Serial Control Bus .... 9
6.9 Timing Diagrams..................................................... 11
6.10 Typical Characteristics.......................................... 13
7 Detailed Description............................................ 14
7.1 Overview ................................................................. 14
7.2 Functional Block Diagram ....................................... 14
7.3 Feature Description................................................. 14
7.4 Device Functional Modes........................................ 31
7.5 Programming........................................................... 33
7.6 Register Maps......................................................... 36
8 Application and Implementation ........................ 57
8.1 Applications Information.......................................... 57
8.2 Typical Applications ................................................ 57
9 Power Supply Recommendations...................... 62
9.1 Power-Up Requirements and PDB Pin................... 62
10 Layout................................................................... 63
10.1 Layout Guidelines ................................................. 63
10.2 Layout Example .................................................... 64
11 Device and Documentation Support ................. 65
11.1 Documentation Support ....................................... 65
11.2 Receiving Notification of Documentation Updates 65
11.3 Support Resources ............................................... 65
11.4 Trademarks........................................................... 65
11.5 Electrostatic Discharge Caution............................ 65
11.6 Glossary................................................................ 65
12 Mechanical, Packaging and Orderable
Information ........................................................... 65
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
DATE VERSION NOTES
December 2019 * Initial Release

GPIO1
VDDHS11
VDD18
RES1
PDB
DOUT0±
DOUT0+
VDDIO
VDDS11
DOUT1±
DOUT1+
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
I2S_DA / GPIO6_REG
I2S_DB / GPIO5_REG
LF
MODE_SEL0
IDx
D_GPIO2 / SPLK
VDDL11
I2S_DC / GPIO2
RES3
RES0
VDDHS11
SDA
SCL
GPIO0
I2CSEL
VDDA11
MODE_SEL1
I2S_CLK / GPIO8_REG
VDDIO
I2S_WC / GPIO7_REG
D_GPIO3 / SS
DAP = GND
VDDP11
RES2
I2S_DD / GPIO3
D0+
D1±
D0±
CLK+
CLK±
VDDOA11
D2±
D2+
D3±
D1+
INTB
VDD18
D3+
VDDOP11
D5±
D5+
VDDL11
D7+
D6+
D7±
NC
REM_INTB
D6±
VDDOA11
D4±
D4+
D_GPIO1 / MISO
D_GPIO0 / MOSI
LFOLDI
DS90UB947N-Q1
Top View
3
DS90UB947N-Q1
www.ti.com
SNLS627 –DECEMBER 2019
Product Folder Links: DS90UB947N-Q1
Submit Documentation FeedbackCopyright © 2019, Texas Instruments Incorporated
5 Pin Configuration and Functions
RGC Package
64-Pin VQFN
Top View
Pin Functions
PIN
I/O, TYPE DESCRIPTION
NAME NO.
LVDS INPUT PINS
D7-
D6-
D5-
D4-
D3-
D2-
D1-
D0-
7
5
3
1
59
55
53
51
I, LVDS Inverting LVDS Data Inputs
Each pair requires external 100-Ω differential termination for standard LVDS levels
D7+
D6+
D5+
D4+
D3+
D2+
D1+
D0+
8
6
4
2
60
56
54
52
I, LVDS True LVDS Data Inputs
Each pair requires external 100-Ω differential termination for standard LVDS levels
CLK- 57 I, LVDS Inverting LVDS Clock Input
Each pair requires external 100-Ω differential termination for standard LVDS levels

4
DS90UB947N-Q1
SNLS627 –DECEMBER 2019
www.ti.com
Product Folder Links: DS90UB947N-Q1
Submit Documentation Feedback Copyright © 2019, Texas Instruments Incorporated
Pin Functions (continued)
PIN
I/O, TYPE DESCRIPTION
NAME NO.
CLK+ 58 I, LVDS True LVDS Clock Input
Each pair requires external 100-Ω differential termination for standard LVDS levels
LFOLDI 63 Analog OpenLDI Loop Filter
Connect to a 10-nF capacitor to GND
FPD-LINK III SERIAL PINS
DOUT0- 26 I/O FPD-Link III Inverting Output 0
The output must be coupled with a 100-nF or 33-nF capacitor
DOUT0+ 27 I/O FPD-Link III True Output 0
The output must be coupled with a 100-nF or 33-nF capacitor
DOUT1- 22 I/O FPD-Link III Inverting Output 1
The output must be coupled with a 100-nF or 33-nF capacitor
DOUT1+ 23 I/O FPD-Link III True Output 1
The output must be coupled with a 100-nF or 33-nF capacitor
LF 20 Analog FPD-Link III Loop Filter
Connect to a 10-nF capacitor to GND
CONTROL PINS
SDA 48 IO, Open-Drain I2C Data Input / Output Interface
Open-drain. Must have an external pullup resistor to 1.8 V or 3.3 V. DO NOT FLOAT.
Recommended pullup: 4.7 kΩ.
SCL 47 IO, Open-Drain I2C Clock Input / Output Interface
Open-drain. Must have an external pullup resistor to 1.8 V or 3.3 V. DO NOT FLOAT.
Recommended pullup: 4.7 kΩ.
I2CSEL 13 I, LVCMOS I2C Voltage Level Strap Option
Tie to V
DDIO
with a 10-kΩ resistor for 1.8-V I2C operation.
Leave floating for 3.3-V I2C operation.
This pin is read as an input at power up.
IDx 19 I, Analog I2C Address Select
External pullup to VDD18 is required under all conditions. DO NOT FLOAT.
Connect to external pullup and pulldown resistors to create a voltage divider.
MODE_SEL0 18 Analog Mode Select 0 Input. Refer to Table 7.
MODE_SEL1 32 Analog Mode Select 1 Input. Refer to Table 8.
PDB 31 I, LVCMOS Power-Down Mode Input Pin
INTB 49 O, Open-Drain Remote interrupt
INTB = H, Normal Operation
INTB = L, Interrupt Request
Recommended pullup: 4.7 kΩ to V
DDIO
. DO NOT FLOAT.
REM_INTB 10 O, LVCMOS LVCMOS Output
REM_INTB will directly mirror the status of the INTB_IN signal from the remote device. No
separate serializer register read will be required to reset and change the status of this pin.
SPI PINS
MOSI 46 IO, LVCMOS SPI Master Output Slave Input
Only available in Dual Link Mode. Shared with D_GPIO0
MISO 45 IO, LVCMOS SPI Master Input Slave Output
Only available in Dual Link Mode. Shared with D_GPIO1
SPLK 44 IO, LVCMOS SPI Clock
Only available in Dual Link Mode. Shared with D_GPIO2
SS 43 IO, LVCMOS SPI Slave Select
Only available in Dual Link Mode. Shared with D_GPIO3
HIGH-SPEED GPIO PINS
D_GPIO0 46 IO, LVCMOS High-Speed GPIO0
Only available in Dual Link Mode. Shared with MOSI
D_GPIO1 45 IO, LVCMOS High-Speed GPIO1
Only available in Dual Link Mode. Shared with MISO
D_GPIO2 44 IO, LVCMOS High-Speed GPIO2
Only available in Dual Link Mode. Shared with SPLK

5
DS90UB947N-Q1
www.ti.com
SNLS627 –DECEMBER 2019
Product Folder Links: DS90UB947N-Q1
Submit Documentation FeedbackCopyright © 2019, Texas Instruments Incorporated
Pin Functions (continued)
PIN
I/O, TYPE DESCRIPTION
NAME NO.
D_GPIO3 43 IO, LVCMOS High-Speed GPIO3
Only available in Dual Link Mode. Shared with SS
GPIO PINS
GPIO0 14 IO, LVCMOS General-Purpose Input/Output 0
GPIO1 15 IO, LVCMOS General-Purpose Input/Output 1
GPIO2 38 IO, LVCMOS General-Purpose Input/Output 2
Shared with I2S_DC
GPIO3 39 IO, LVCMOS General-Purpose Input/Output 3
Shared with I2S_DD
REGISTER-ONLY GPIO PINS
GPIO5_REG 37 IO, LVCMOS General-Purpose Input/Output 5
Local register control only. Shared with I2S_DB
GPIO6_REG 36 IO, LVCMOS General-Purpose Input/Output 6
Local register control only. Shared with I2S_DA
GPIO7_REG 34 IO, LVCMOS General-Purpose Input/Output 7
Local register control only. Shared with I2S_WC
GPIO8_REG 35 IO, LVCMOS General-Purpose Input/Output 8
Local register control only. Shared with I2S_CLK
SLAVE MODE LOCAL I2S CHANNEL PINS
I2S_WC 34 I, LVCMOS Slave Mode I2S Word Clock Input. Shared with GPIO7_REG
I2S_CLK 35 I, LVCMOS Slave Mode I2S Clock Input. Shared with GPIO8_REG
I2S_DA 36 I, LVCMOS Slave Mode I2S Data Input. Shared with GPIO6_REG
I2S_DB 37 I, LVCMOS Slave Mode I2S Data Input. Shared with GPIO5_REG
I2S_DC 38 I, LVCMOS Slave Mode I2S Data Input. Shared with GPIO2
I2S_DD 39 I, LVCMOS Slave Mode I2S Data Input. Shared with GPIO3
POWER AND GROUND PINS
VDD18 24
62
Power 1.8-V (±5%) supply. Refer to Figure 36 or Figure 37.
VDDOA11 50
64
Power 1.1-V (±5%) supply. Refer to or Figure 36 or Figure 37.
VDDA11 12 Power 1.1-V (±5%) supply. Refer to or Figure 36 or Figure 37.
VDDHS11 21
28
Power 1.1-V (±5%) supply. Refer to or Figure 36 or Figure 37.
VDDL11 9
42
Power 1.1-V (±5%) supply. Refer to or Figure 36 or Figure 37.
VDDOP11 61 Power 1.1-V (±5%) supply. Refer to or Figure 36 or Figure 37.
VDDP11 17 Power 1.1-V (±5%) supply. Refer to or Figure 36 or Figure 37.
VDDS11 25 Power 1.1-V (±5%) supply. Refer to or Figure 36 or Figure 37.
VDDIO 16
33
Power 1.8-V (±5%) LVCMOS I/O Power. Refer to or Figure 36 or Figure 37.
GND Thermal
Pad
Ground.
OTHER PINS
RES0
RES2
RES3
29
40
41
Reserved. Tie to GND.
RES1 30 Reserved. Connect with 50Ω to GND.
NC 11 No connect. Leave floating Do not connect to VDD or GND.
剩余73页未读,继续阅读
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