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TI-DS90UB953-Q1.pdf
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DS90UB953-Q1
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本文档旨在为方便起见,提供有关 TI 产品中文版本的信息,以确认产品的概要。 有关适用的官方英文版本的最新信息,请访问 www.ti.com,其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SNLS552
DS90UB953-Q1
ZHCSGW1B –SEPTEMBER 2017–REVISED SEPTEMBER 2018
DS90UB953-Q1 适适用用于于 2.3MP/60fps 摄摄像像头头、、雷雷达达和和其其他他传传感感器器并并具具有有
CSI-2 接接口口的的 FPD-Link III 4.16Gbps 串串行行器器
1
1 特特性性
1
• 符合面向汽车应用的 AEC-Q100 标准:
– 器件温度等级 2:环境工作温度范围为 –40°C
至 +105°C
• 符合 ISO 10605 和 IEC 61000-4-2 ESD 标准
• 同轴电缆供电 (PoC) 兼容收发器
• 4.16Gbps 级串行器支持高速传感器包括全高清
1080p 2MP 60fps 和 4MP 30fps 成像器
• 符合 D-PHY v1.2 和 CSI-2 v1.3 标准的系统接口
– 多达 4 条数据通道,每通道速率为 832Mbps
– 支持多达四个虚拟通道
• 精密多传感器时钟和同步
• 灵活的可编程输出时钟发生器
• 高级数据保护和诊断,包括 CRC 数据保护、传感
器数据完整性检查、I2C 写保护、电压和温度测
量、可编程警报器以及线路故障检测
• 支持单端同轴或屏蔽双绞线 (STP) 电缆
• 超低延迟双向 I2C 和 GPIO 控制通道支持从 ECU
侧进行 ISP 控制,
• 1.8V 单电源
• 低功耗(0.25W 典型值)
• 兼容 DS90UB954-Q1、DS90UB960-Q1、
DS90UB934-Q1、DS90UB914A-Q1 解串器
• 宽温度范围:–40°C 至 105°C
• 小型 5mm × 5mm VQFN 封装和 PoC 解决方案尺
寸,适合紧凑型摄像头模块设计
2 应应用用
• 汽车驾驶员辅助系统 (ADAS)
– 环视系统 (SVS)
– 摄像头监控系统 (CMS)
– 前视摄像头 (FC)
– 驾驶员监控系统 (DMS)
– 后视摄像头 (RVC)
– 汽车卫星雷达和激光雷达模块
– 飞行时间 (ToF) 传感器
• 安防和监控摄像头
• 工业和医疗成像
3 说说明明
DS90UB953-Q1 串行器是 TI FPD-Link III 器件系列的
一部分,旨在支持高速原始数据传感器,包括 60fps
的 2MP 成像器以及 4MP 30fps 摄像头、卫星雷达、
激光雷达和飞行时间 (ToF) 传感器。该芯片提供
4.16Gbps 正向通道和超低延迟的 50Mbps 双向控制通
道,并支持单根同轴 (PoC) 或 STP 电缆进行供电。
DS90UB953-Q1 具有 高级数据保护和诊断 特性 ,可
支持 ADAS 和自主驾驶。DS90UB953-Q1 与配套的解
串器一起提供精确的多摄像头传感器时钟和传感器同
步。
DS90UB953-Q1 完全符合 AEC-Q100 标准,具有
–40°C 至 105°C 的宽温度范围。该串行器采用 5mm ×
5mm 的小型 VQFN 封装,非常适合空间受限型传感器
应用。
器器件件信信息息
(1)
器器件件型型号号 封封装装 封封装装尺尺寸寸((标标称称值值))
DS90UB953-Q1 VQFN (32) 5.00mm × 5.00mm
(1) 要了解所有可用封装,请见产品说明书末尾的可订购产品附
录。
典典型型应应用用

2
DS90UB953-Q1
ZHCSGW1B –SEPTEMBER 2017 –REVISED SEPTEMBER 2018
www.ti.com.cn
版权 © 2017–2018, Texas Instruments Incorporated
目目录录
1 特特性性.......................................................................... 1
2 应应用用.......................................................................... 1
3 说说明明.......................................................................... 1
4 修修订订历历史史记记录录 ........................................................... 2
5 Pin Configuration and Functions......................... 5
6 Specifications......................................................... 7
6.1 Absolute Maximum Ratings ...................................... 7
6.2 ESD Ratings.............................................................. 7
6.3 Recommended Operating Conditions....................... 7
6.4 Thermal Information.................................................. 8
6.5 Electrical Characteristics........................................... 9
6.6 Recommended Timing for the Serial Control Bus .. 13
6.7 Timing Diagrams..................................................... 14
6.8 Typical Characteristics............................................ 14
7 Detailed Description............................................ 15
7.1 Overview ................................................................. 15
7.2 Functional Block Diagram ....................................... 15
7.3 Feature Description................................................. 16
7.4 Device Functional Modes........................................ 22
7.5 Programming........................................................... 26
7.6 Pattern Generation ................................................. 28
7.7 Register Maps ........................................................ 32
8 Application and Implementation ........................ 69
8.1 Application Information............................................ 69
8.2 Typical Applications ................................................ 72
9 Power Supply Recommendations...................... 75
9.1 Power-Up Sequencing ............................................ 75
9.2 Power Down (PDB)................................................. 76
10 Layout................................................................... 76
10.1 Layout Guidelines ................................................. 76
10.2 Layout Examples................................................... 77
11 器器件件和和文文档档支支持持 ..................................................... 80
11.1 器件支持................................................................ 80
11.2 文档支持 ............................................................... 80
11.3 接收文档更新通知 ................................................. 80
11.4 社区资源................................................................ 80
11.5 商标 ....................................................................... 80
11.6 静电放电警告......................................................... 80
11.7 术语表 ................................................................... 80
12 机机械械、、封封装装和和可可订订购购信信息息....................................... 81
4 修修订订历历史史记记录录
Changes from Revision A (February 2018) to Revision B Page
• Updated GPIO pin descriptions. ............................................................................................................................................ 6
• Replace CLK_IN with clock throughout document. ............................................................................................................... 6
• Changed Supply voltage from 2.5V to 2.16V ......................................................................................................................... 7
• Changed asynchronous to non-synchronous......................................................................................................................... 8
• Deleted "for synchronous mode" ............................................................................................................................................ 8
• Added internal reference frequency in EC table................................................................................................................... 10
• Added Internal AON Clock to Block Diagram....................................................................................................................... 15
• 已更改 mode to modes. ....................................................................................................................................................... 18
• Changed 130ns to 225ns. .................................................................................................................................................... 22
• Changed latency to 1.5us and jitter to 0.7us. ...................................................................................................................... 22
• Changed CLK_IN Mode to Modes. ..................................................................................................................................... 22
• Added DVP Mode ................................................................................................................................................................ 22
• Changed table formatting. ................................................................................................................................................... 23
• 已更改 REFLCK to Back Channel ....................................................................................................................................... 23
• 已添加 Frequency for Synchronous Mode .......................................................................................................................... 23
• 已更改 naming convention from "asynchronous CLK_IN" to "Non-Synchronous external CLK_IN" mode column dor
CLKIN_DIV = 2..................................................................................................................................................................... 23
• 已更改 from CLK_IN to Back Channel (Half Rate)............................................................................................................... 23
• 已添加 Non-Synchronous Internal Clock Mode ................................................................................................................... 23
• 已更改 the value from 24.2 - 25.5 MHz to 48.4 - 51 MHz ................................................................................................... 23
• 已更改 the value from 25 - 52 MHz to 24.2 to 25.5 MHz .................................................................................................... 23
• Added DVP External Clock................................................................................................................................................... 23
• 已添加 text "Deserializer Mode" to clarify mode RAW10 .................................................................................................... 23
• 已添加 additional information to note. ................................................................................................................................. 23

3
DS90UB953-Q1
www.ti.com.cn
ZHCSGW1B –SEPTEMBER 2017–REVISED SEPTEMBER 2018
版权 © 2017–2018, Texas Instruments Incorporated
修修订订历历史史记记录录 (接接下下页页)
• 已添加 text "Deserializer Mode" to clarify mode RAW12 HF .............................................................................................. 23
• 已更改 CLK_IN to Clock. ...................................................................................................................................................... 23
• Added Non-Synchronous Internal Clocking Mode section. ................................................................................................. 24
• 已更改 the internal clock 25 MHz to 24.2 MHz .................................................................................................................... 24
• 已更改 forward channel rate to1.936 Gbps instead of 2 Gbps ............................................................................................ 24
• 已更改 the average CSI-2 throughput value to 3.1 Gbps instead of 1.6 Gbps ................................................................... 24
• Added DVP Backwards Compatibility Mode section. ........................................................................................................... 24
• 已更改 "asynchronous CLK_IN" to "Non-Synchronous external CLK_IN " ........................................................................... 24
• Added sentence "CLK_OUT functionality is not..."............................................................................................................... 24
• 已添加 Non-Synchronous Internal Clock Mode ................................................................................................................... 26
• Deleted "with accuracy of 25 MHz ±10%. ............................................................................................................................ 28
• Changed clock to from 25 MHz ±10% to 26.25 MHz. ......................................................................................................... 28
• Changed clock to from 25 MHz ±10% to 26.25 MHz. ......................................................................................................... 28
• Updated registers map ........................................................................................................................................................ 32
• Added information for DVP mode to register 0x04. ............................................................................................................. 33
• Added "operating with Non-Synchronous internal clock or" ................................................................................................. 34
• Changed the frequency value from 26 MHz to range value (24.2 MHz to 25.5 MHz) ........................................................ 34
• Added "set for 2 Gbps line rate" .......................................................................................................................................... 34
• Changed the frequency value from 52 MHz to range value (48.4 MHz to 51 MHz) ........................................................... 34
• Added "set for 4 Gbps line rate" .......................................................................................................................................... 34
• Updated unit time and clock frequency. .............................................................................................................................. 36
• Added DVP information to register 0x10. ............................................................................................................................ 37
• Added DVP information to register 0x11. ............................................................................................................................ 37
• 已删除 the value -25dB and added -20dB in typcial ............................................................................................................ 71
• 已更改 –26.4+14.4f to log equation –12+8*log(f) ................................................................................................................ 71
• Moved Return Loss, S11 MAX values to TYP ..................................................................................................................... 71
• 已添加 Typical connection diagram for STP ........................................................................................................................ 72
• 已更改 the capacitance value from 33nF to 33nF – 100 nF. ............................................................................................... 73
• 已更改 the capacitance value from 15 nF to 15 nF – 47 nF................................................................................................. 73
• 已更改 the capacitance value from 33nF to 33nF – 100 nF. ............................................................................................... 73
Changes from Original (September 2017) to Revision A Page
• Changed RES1 pin description from "Leave OPEN " to "Do not connect" ............................................................................ 5
• Added "Internal 1-MΩ pulldown" text to PDB pin description................................................................................................. 5
• Expanded MODE pin description .......................................................................................................................................... 6
• Changed "Requires" to "Typically connected to" in the Power and Ground pin descriptions ............................................... 6
• Changed "and should not be connected to an external supply" to "Do not connect to an external supply rail" in the
Power and Ground pin descriptions ...................................................................................................................................... 6
• Changed the CSI_ERR_COUNT (0x5C) text to CSI_ERR_CNT (0x5C)............................................................................. 18
• Changed DS90UBUB954-Q1 to DS90UB954-Q1................................................................................................................ 20
• Changed the GPIO_INPUT_CTL text to GPIO_INPUT_CTRL in the GPIO Input Control and GPIO Output Control
sections................................................................................................................................................................................. 21
• Changed CLK_IN lower limit with CLKIN_DIV =1 from 46 MHz to 25 MHz and CLK_IN lower limit from 92 MHz to
50 MHz. ................................................................................................................................................................................ 23
• Corrected typo in MODE description saying the number of modes is 3 to the correct value of 2 ....................................... 25

4
DS90UB953-Q1
ZHCSGW1B –SEPTEMBER 2017 –REVISED SEPTEMBER 2018
www.ti.com.cn
Copyright © 2017–2018, Texas Instruments Incorporated
• Changed I2C START description to "A START occurs when SDA transitions Low while SCLK is High" .......................... 27
• Added registers tables for reserved registers 0x04, 0x0F-0x12, 0x16, 0x1F, 0x25-0x30, 0x34, 0x36, 0x38, 0x4A-
0x4F, 0x5B, 0x65-0xAF, and 0xB3-0xEF. ............................................................................................................................ 32
• Changed bit 6 and bit 7 in the MODE_SEL register to RESERVED.................................................................................... 33
• Changed the SENSE_VO_HI and SENSE_VO_LO registers to SENSE_V0_HI and SENSE_V0_LO to match the
title in Table 36 ..................................................................................................................................................................... 39
• Changed the SENSE_V0_HI and SENSE_V0_LO bit descriptions ..................................................................................... 39
• Changed the SENSOR_V0_THRESH bit description ......................................................................................................... 39
• Changed the SENSE_T_HI and SENSE_T_LO bit descriptions.......................................................................................... 39
• Combined the CSI_EN_HSRX register bits 6–0 into one row.............................................................................................. 41
• Combined the CSI_EN_LPRX register bits 6 –0 into one row .............................................................................................. 41
• Combined the CSI_EN_RXTERM register bits 7–4 into one row ........................................................................................ 42
• Changed serializer to deserializer in SLAVE_ID_ALIAS_x bit descriptions ........................................................................ 47
• Changed Slave 0 to Slave 1 in the SLAVE_AUTO_ACK_1 bit description ......................................................................... 48
• Changed Slave 0 to Slave 2 in the SLAVE_AUTO_ACK_2 bit description ......................................................................... 48
• Changed Slave 0 to Slave 3 in the SLAVE_AUTO_ACK_3 bit description ......................................................................... 48
• Changed Slave 0 to Slave 4 in the SLAVE_AUTO_ACK_4 bit description ......................................................................... 49
• Changed Slave 0 to Slave 5 in the SLAVE_AUTO_ACK_5 bit description ......................................................................... 49
• Changed Slave 0 to Slave 6 in the SLAVE_AUTO_ACK_6 bit description ......................................................................... 49
• Changed Slave 0 to Slave 7 in the SLAVE_AUTO_ACK_7 bit description ......................................................................... 50
• Changed CRC_ERR bit description in GENERAL_STATUS to match CRC_ERR_CLR register name ............................ 51
• Changed the CNTRL_ERR_HSRQST_2 bit description ...................................................................................................... 54
• Changed 图 17 caption......................................................................................................................................................... 72
• Added PIN(S) column to 表 178 .......................................................................................................................................... 73
• Changed large bulk capacitor typical range lower limit from 50 µF to 47 µF, removed mentions of dedicated power
plane and tantalum capacitors, and changed recommended power rating for capacitors in layout guidelines .................. 76
• Changed recommended CSI-2 guidelines on matching trace lengths and routing to help trace impedance ...................... 77
• Changed routing guidelines for the DOUT+ and DOUT– pins ............................................................................................ 78
• 在
相关文档
部分添加了新链接 .............................................................................................................................................. 80

DS90UB953-Q1
32L QFN
(Top View)
32
31
30
29
28
27
26
25
CSI_D2P
CSI_D3N
CSI_D3P
GPIO_3
GPIO_2
VDDD_CAP
VDDD
DAP = GND
CSI_D2N
9
10
11
12
13
14
15
16
LPF1
VDDDRV
VDDPLL_CAP
VDDPLL
LPF2
DOUT-
VDDDRV_CAP
DOUT+
24
23
22
21
20
19
18
17
GPIO_1
CLK_OUT/IDX
RES1
I2C_SDA
GPIO_0
MODE
I2C_SCL
CLKIN
1
2
3
4
5
6
7
8
RES0
CSI_CLKN
CSI_D0P
CSI_D1N
CSI_D1P
CSI_D0N
CSI_CLKP
PDB
5
DS90UB953-Q1
www.ti.com.cn
ZHCSGW1B –SEPTEMBER 2017–REVISED SEPTEMBER 2018
Copyright © 2017–2018, Texas Instruments Incorporated
5 Pin Configuration and Functions
RHB Package
32-Pin VQFN
Top View
Pin Functions
PIN
I/O DESCRIPTION
NAME NO.
CSI INTERFACE
CSI_CLKP 5 I, DPHY
CSI-2 clock input pins. Connect to a CSI-2 clock source with matched 100-Ω (±5%) impedance
interconnects.
CSI_CLKN 6 I, DPHY
CSI_D0P 3 I, DPHY
CSI-2 data input pins. Connect to a CSI-2 data sources with matched 100-Ω (±5%) impedance
interconnects. If unused, these pins may be left floating.
CSI_D0N 4 I, DPHY
CSI_D1P 1 I, DPHY
CSI_D1N 2 I, DPHY
CSI_D2P 31 I, DPHY
CSI_D2N 32 I, DPHY
CSI_D3P 29 I, DPHY
CSI_D3N 30 I, DPHY
SERIAL CONTROL INTERFACE
I2C_SDA 23 OD I2C Data and Clock Pins. Typically pulled up by 470-Ω to 4.7-kΩ resistors to either 1.8-V or 3.3-V supply
rail depending on IDX setting. See I2C Interface Configuration for further details on the I2C
implementation of the DS90UB953-Q1.
I2C_SCL 24 OD
CONFIGURATION and CONTROL
RES0 7 I Reserved pin – Connect to GND
RES1 22 I Reserved pin – Do not connect (leave floating)
PDB 8 I, PD
Power-down inverted Input Pin. Internal 1-MΩ pulldown. Typically connected to processor GPIO with pull
down. When PDB input is brought HIGH, the device is enabled and internal register and state machines
are reset to default values. Asserting PDB signal low will power down the device and consume minimum
power. The default function of this pin is PDB = LOW; POWER DOWN. PDB should remain low until after
power supplies are applied and reach minimum required levels. See Power Down (PDB) for further details
on the function of PDB.
PDB INPUT IS NOT 3.3-V TOLERANT.
PDB = 1.8 V, device is enabled (normal operation)
PDB = 0, device is powered down.
剩余88页未读,继续阅读
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