TI-TRS3237E.pdf

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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

TRS3237E

SLLS796A –JUNE 2007–REVISED JANUARY 2010

www.ti.com

SLLS796A –JUNE 2007–REVISED JANUARY 2010

TRS3237E

SLLS796A –JUNE 2007–REVISED JANUARY 2010

Storage temperature range –65 150 °C

(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltages are with respect to network GND.

(3) The package thermal impedance is calculated in accordance with JESD 51-7.

See Figure 5

Driver and control high-level input voltage DIN, SHDN, MBAUD, EN V

Driver and control low-level input voltage DIN, SHDN, MBAUD, EN 0 0.8 V

Receiver input voltage –25 25 V

Operating free-air temperature °C

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)

PARAMETER TEST CONDITIONS MIN TYP

(2)

I

Input leakage current DIN, SHDN, MBAUD, EN 9 18 mA

No load, SHDN = V

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0.5 2 mA

Supply current SHDN = GND 1 10 mA

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(T

= 25°C)

(2) All typical values are at V

= 5 V, and T