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TI-SN888C.pdf
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TI-SN888C.pdf
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120
A
B
D
DE
R
RE
D
R
Vcc
1k
A
B
D
DE
R
RE
POLCOR
D
R
A B
DDER
POLCOR
D
R
RE
A B
DDER
POLCOR
D
R
RE
Master
SN65HVD82
Slave
SN888C
Slave
SN888C
Slave
SN888C
Cross-wire
fault
0
1k
SN888C
www.ti.com.cn
ZHCSC10 –SEPTEMBER 2013
针针对对静静电电计计 (E-Meter) 的的总总线线极极性性纠纠正正 RS-485 收收发发器器
查查询询样样片片: SN888C
1
特特性性
应应用用范范围围
• 超超过过 EIA-485 标标准准的的要要求求 • 静静电电计计
• 76ms 内内的的总总线线极极性性纠纠正正
说说明明
• 数数据据速速率率::300bps 至至 250kbps
SN888C 是一款低功耗 RS-485 收发器,此收发器具
• 具具有有两两个个工工作作配配置置::
有总线极性纠正和瞬态保护功能。 热插拔时,此器件
– 只只作作为为故故障障安安全全电电阻阻器器
在总线闲置的头 76ms 内检测并纠正总线极性。 片载
– 故故障障安安全全和和端端接接电电阻阻器器
瞬态保护功能保护此器件不受 IEC61000 静电放电
• 一一条条总总线线上上多多达达 256 个个节节点点
(ESD) 和瞬态放电 (EFT) 瞬态的影响。
• 小小外外形形尺尺寸寸集集成成电电路路 (SOIC)-8 封封装装以以实实现现向向后后兼兼
容容性性
SN888C 采用 SOIC-8 封装。 此器件额定温度范围介
• 总总线线引引脚脚保保护护::
于 -40°C 和 85°C 之间。
– ±16kV 的的人人体体模模型型 (HBM) 保保护护
– ±12kV IEC61000-4-2 接接触触放放电电
– +4kV IEC61000-4-4 快快速速瞬瞬态态突突发发
图图 1. 支支持持极极性性纠纠正正 (POLCOR) 的的典典型型网网络络应应用用
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not English Data Sheet: SLLSEI4
necessarily include testing of all parameters.
Vcc
GND
B
A
D
DE
R
RE
POLCOR
D
R
DE
RE
Vcc
B
A
GND
1
2
3
4
8
7
6
5
SN888C
ZHCSC10 –SEPTEMBER 2013
www.ti.com.cn
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
SOIC-8
Block Diagram
(TOP VIEW)
DRIVER PIN FUNCTIONS
INPUT ENABLE OUTPUTS
DESCRIPTION
D DE A B
NORMAL MODE
H H H L Actively drives bus high
L H L H Actively drives bus low
X L Z Z Driver disabled
X OPEN Z Z Driver disabled by default
OPEN H H L Actively drives bus high
POLARITY-CORRECTING MODE
(1)
H H L H Actively drives bus low
L H H L Actively drives bus high
X L Z Z Driver disabled
X OPEN Z Z Driver disabled by default
OPEN H L H Actively drives bus low
(1) The polarity-correcting mode is entered when V
ID
< V
IT–
and t > t
FS
and DE = low. This state is latched when /RE turns from low to high.
RECEIVER PIN FUNCTIONS
DIFFERENTIAL
ENABLE OUTPUT
INPUT
DESCRIPTION
V
ID
= V
A
– V
B
/RE R
NORMAL MODE
V
IT+
< V
ID
L H Receive valid bus high
V
IT–
< V
ID
< V
IT+
L ? Indeterminate bus state
V
ID
< V
IT–
L L Receive valid bus low
X H Z Receiver disabled
X OPEN Z Receiver disabled
Open, short, idle bus L ? Indeterminate bus state
POLARITY-CORRECTING MODE
(1)
V
IT+
< V
ID
L L Receive valid bus low
V
IT–
< V
ID
< V
IT+
L ? Indeterminate bus state
V
ID
< V
IT–
L H Receive polarity corrected bus high
X H Z Receiver disabled
X OPEN Z Receiver disabled
Open, short, idle bus L ? Indeterminate bus state
(1) The polarity-correcting mode is entered when V
ID
< V
IT–
and t > t
FS
and DE = low. This state is latched when /RE turns from low to high.
2 Copyright © 2013, Texas Instruments Incorporated
SN888C
www.ti.com.cn
ZHCSC10 –SEPTEMBER 2013
ABSOLUTE MAXIMUM RATINGS
(1)
VALUE UNIT
MIN MAX
V
CC
Supply voltage –0.5 7
Input voltage range at any logic pin –0.3 5.7
V
Voltage input range, transient pulse, A and B, through 100 Ω –100 100
Voltage range at A or B inputs –18 18
Receiver output current –24 24 mA
Continuous total-power dissipation See THERMAL INFORMATION table
IEC 61000-4-2 ESD (Contact Discharge), bus terminals and GND ±12
IEC 61000-4-4 EFT (Fast transient or burst) bus terminals and GND ±4
IEC 60749-26 ESD (HBM), bus terminals and GND ±16 kV
Test Method A114 (HBM), all pins ±8
JEDEC Standard 22 Test Method C101 (Charged Device Model), all pins ±1.5
Test Method A115 (Machine Model), all pins ±200 V
T
J
Junction temperature 170
°C
T
STG
Storage temperature –65 150
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
THERMAL INFORMATION
SN888C
THERMAL METRIC
(1)
UNITS
PACKAGE SOIC
(D)
θ
JA
Junction-to-ambient thermal resistance 116.1
θ
JCtop
Junction-to-case (top) thermal resistance 60.8
θ
JB
Junction-to-board thermal resistance
(2)
57.1
°C/W
ψ
JT
Junction-to-top characterization parameter 13.9
ψ
JB
Junction-to-board characterization parameter 56.5
θ
JCbot
Junction-to-case (bottom) thermal resistance NA
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
POWER DISSIPATION
PARAMETER TEST CONDITIONS VALUE UNITS
R
L
= 300 Ω, 164
Unterminated
Power dissipation
C
L
= 50 pF (driver)
Driver and receiver enabled,
R
L
= 100 Ω, 247
PD V
CC
= 5.5 V, T
J
= 150°C RS-422 load mW
C
L
= 50 pF (driver)
50% duty cycle square-wave signal at
R
L
= 54 Ω, 316
250-kbps signaling rate:
RS-485 load
C
L
= 50 pF (driver)
Copyright © 2013, Texas Instruments Incorporated 3
SN888C
ZHCSC10 –SEPTEMBER 2013
www.ti.com.cn
RECOMMENDED OPERATING CONDITIONS
MIN NOM MAX UNIT
V
CC
Supply voltage 4.5 5 5.5
V
ID
Differential input voltage –12 12
V
I
Input voltage at any bus terminal (separate or common mode)
(1)
–7 12 V
V
IH
High-level input voltage (driver, driver-enable, and receiver-enable inputs) 2 V
CC
V
IL
Low-level input voltage (driver, driver-enable, and receiver-enable inputs) 0 0.8
Driver –60 60
I
O
Output current mA
Receiver –8 8
C
L
Differential load capacitance 50 pF
R
L
Differential load resistance 60 Ω
1/t
UI
Signaling rate 0.3 250 kbps
T
J
Junction temperature –40 150
°C
T
A
(2)
Operating free-air temperature (see THERMAL INFORMATION for additional –40 85
information)
(1) The algebraic convention in which the least positive (most negative) limit is designated as minimum is used in this data sheet.
(2) Operation is specified for internal (junction) temperatures up to 150°C. Self-heating due to internal power dissipation should be
considered for each application. Maximum junction temperature is internally limited by the thermal shut-down (TSD) circuit which
disables the driver outputs when the junction temperature reaches 170°C.
ELECTRICAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
RL = 60 Ω, 375 Ω on each See Figure 2 1.5 2.5
output from –7 to +12 V
Driver differential-output
│V
OD
│ V
voltage magnitude RL = 54 Ω (RS-485) 1.5 2.5
See Figure 3
RL = 100 Ω (RS-422) 2 3
Change in magnitude of RL = 54 Ω, CL = 50 pF –0.2 0 0.2
Δ│V
OD
driver differential-output See Figure 3 V
│
voltage
Steady-state common-mode 1 V
CC
/ 2 3
V
OC(SS)
V
output voltage
Change in differential driver –0.2 0 0.2
Center of two 27-Ω load
ΔV
OC
common-mode output See Figure 3
resistors
voltage
mV
Peak-to-peak driver common- 850
V
OC(PP)
mode output voltage
Differential output 8
C
OD
pF
capacitance
Positive-going receiver 35 100
V
IT+
differential-input voltage mV
threshold
Negative-going receiver –100 –35
V
IT–
differential-input voltage mV
threshold
Receiver differential-input 40 60
V
HYS
(1)
voltage threshold hysteresis mV
(V
IT
+ – V
IT–
)
Receiver high-level output I
OH
= –8 mA 2.4 V
CC
– 0.3
V
OH
V
voltage
Receiver low-level output I
OL
= 8 mA 0.2 0.4
V
OL
V
voltage
Driver input, driver enable, –2 2
I
I
and receiver enable input µA
current
(1) Under any specific conditions, V
IT+
is ensured to be at least V
HYS
higher than V
IT–
.
4 Copyright © 2013, Texas Instruments Incorporated
SN888C
www.ti.com.cn
ZHCSC10 –SEPTEMBER 2013
ELECTRICAL CHARACTERISTICS (continued)
over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Receiver high-impedance VO = 0 V or VCC, /RE at VCC –10 10
I
OZ
µA
output current
Driver short-circuit output │I
OS
│ with V
A
or V
B
from –7 to +12 V 150
│I
OS
│ mA
current
V
CC
= 4.5 to 5.5 V or V
I
= 12 V 75 125
Bus input current (driver
I
I
µA
disabled)
V
CC
= 0 V, DE at 0 V V
I
= –7 V –100 –40
Driver and receiver enabled DE = V
CC
, /RE = 750 900
GND, No load
Driver enabled, receiver DE = V
CC
, /RE = V
CC
, 650
disabled No load
I
CC
Supply current (quiescent) µA
Driver disabled, receiver DE = GND, /RE = 750
enabled GND, No load
Driver and receiver disabled DE = GND, D = GND 0.4 5
/RE = VCC, No load
Supply current (dynamic) See
SWITCHING CHARACTERISTICS
3.3 ms > bit time > 4 μs (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
DRIVER
t
r
, t
f
Driver differential-output rise and 400 700 1200
fall times
RL = 54 Ω, CL = 50
See Figure 4 ns
t
PHL
, t
PLH
Driver propagation delay pF 90 700 1000
t
SK(P)
Driver pulse skew, |t
PHL
– t
PLH
| 25 200
t
PHZ
, t
PLZ
Driver disable time 50 500
ns
See Figure 5 and
t
PHZ
, t
PLZ
Driver enable time Receiver enabled 500 1000
Figure 6
Receiver disabled 3 9 µs
RECEIVER
t
r
, t
f
Receiver output rise and fall times 18 30
t
PHL
, t
PLH
Receiver propagation delay time CL = 15 pF See Figure 7 85 195 ns
t
SK(P)
Receiver pulse skew, |t
PHL
– t
PLH
| 1 15
t
PHZ
, t
PLZ
Receiver disable time 50 500
t
PZL(1)
, Driver enabled See Figure 8 20 130 ns
t
PZH(1)
Driver disabled See Figure 9 2 8 µs
Receiver enable time
t
PZL(2)
,
t
PZH(2)
t
FS
Bus failsafe time Driver disabled See Figure 10 44 58 76 ms
Copyright © 2013, Texas Instruments Incorporated 5
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