没有合适的资源?快使用搜索试试~ 我知道了~
资源推荐
资源详情
资源评论








RE
DE
D
R
GND
A
B
V
CC
Product
Folder
Order
Now
Technical
Documents
Tools &
Software
Support &
Community
本文档旨在为方便起见,提供有关 TI 产品中文版本的信息,以确认产品的概要。 有关适用的官方英文版本的最新信息,请访问 www.ti.com,其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SLLSF32
THVD1419
,
THVD1429
ZHCSJ05C –NOVEMBER 2018–REVISED MARCH 2019
具具有有浪浪涌涌保保护护功功能能的的 THVD14x9 3.3V 至至 5V RS-485 收收发发器器
1
1 特特性性
1
• 满足或超过 TIA/EIA-485A 标准的要求
• 3V 至 5.5V 电源电压
• 总线 I/O 保护
– ±16kV HBM ESD
– ±8kV IEC 61000-4-2 接触放电
– ±30kV IEC 61000-4-2 气隙放电
– ±4kV IEC 61000-4-4 电气快速瞬变
– ±2.5kV IEC 61000-4-5 1.2/50μs 浪涌
• 有两种速度等级
– THVD1419:250kbps
– THVD1429:20Mbps
• 扩展环境
温度范围:–40°C 至 125°C
• 扩展运行
共模范围:±12V
• 用于噪声抑制的接收器迟滞值:30mV
• 低功耗
– 待机电源电流:< 2µA
– 运行期间的电流:< 3mA
• 适用于热插拔功能的无干扰加电/断电
• 开路、短路和空闲总线失效防护
• 1/8 单位负载(多达 256 个总线节点)
• 采用可实现快插兼容性的行业标准 8 引脚 SOIC
封装
2 应应用用
• 无线基础设施
• 楼宇自动化
• HVAC 系统
• 工厂自动化和控制
• 电网基础设施
• 智能仪表
• 过程分析
• 视频监控
3 说说明明
THVD1419 和 THVD1429 是半双工 RS-485 收发器,
集成了浪涌保护功能。电涌保护是通过在标准 8 引脚
SOIC (D) 封装中集成瞬态电压抑制器 (TVS) 二极管实
现的。此功能大大提高了可靠性,可以更好地抵抗耦合
到数据电缆的噪声瞬变,无需外部保护元件。
每个器件由 3.3V 或 5V 单电源供电。该系列中的器件
具有很宽的共模电压范围,因此非常适合长电缆上的
应用 长线缆。
THVD1419 和 THVD1429 器件采用行业标准 SOIC 封
装,无需变更 PCB 即可轻松插入。这些器件在自然通
风环境下的额定温度范围为 –40°C 至 125°C。
器器件件信信息息
(1)
器器件件型型号号 封封装装 封封装装尺尺寸寸((标标称称值值))
THVD1419
THVD1429
SOIC (8) 4.90mm × 3.91mm
(1) 如需了解所有可订购器件,请参阅数据表末尾的可订购产品附
录。
THVD1419 和和 THVD1429 方方框框图图

2
THVD1419
,
THVD1429
ZHCSJ05C –NOVEMBER 2018 –REVISED MARCH 2019
www.ti.com.cn
Copyright © 2018–2019, Texas Instruments Incorporated
目目录录
1 特特性性.......................................................................... 1
2 应应用用.......................................................................... 1
3 说说明明.......................................................................... 1
4 修修订订历历史史记记录录 ........................................................... 2
5 Device Comparison Table..................................... 3
6 Pin Configuration and Functions......................... 4
7 Specifications......................................................... 5
7.1 Absolute Maximum Ratings ...................................... 5
7.2 ESD Ratings.............................................................. 5
7.3 ESD Ratings [IEC] .................................................... 5
7.4 Recommended Operating Conditions....................... 6
7.5 Thermal Information.................................................. 6
7.6 Power Dissipation ..................................................... 6
7.7 Electrical Characteristics........................................... 7
7.8 Switching Characteristics.......................................... 8
7.9 Typical Characteristics.............................................. 9
8 Parameter Measurement Information ................ 11
9 Detailed Description............................................ 13
9.1 Overview ................................................................. 13
9.2 Functional Block Diagrams ..................................... 13
9.3 Feature Description................................................. 13
9.4 Device Functional Modes........................................ 16
10 Application and Implementation........................ 17
10.1 Application Information...................................... 17
10.2 Typical Application ............................................... 17
11 Power Supply Recommendations ..................... 20
12 Layout................................................................... 21
12.1 Layout Guidelines ................................................. 21
12.2 Layout Example .................................................... 21
13 器器件件和和文文档档支支持持 ..................................................... 22
13.1 器件支持................................................................ 22
13.2 第三方产品免责声明.............................................. 22
13.3 相关链接................................................................ 22
13.4 接收文档更新通知 ................................................. 22
13.5 社区资源................................................................ 22
13.6 商标 ....................................................................... 22
13.7 静电放电警告......................................................... 22
13.8 术语表 ................................................................... 22
14 机机械械、、封封装装和和可可订订购购信信息息....................................... 22
4 修修订订历历史史记记录录
Changes from Revision B (December 2018) to Revision C Page
• 将 THVD1419 从:“
产品预览
” 更改为:“
生产
数据“................................................................................................................ 1
• Changed power dissipation numbers of THVD1419 ............................................................................................................. 6
• Changed THVD1419 driver switching characteristics ............................................................................................................ 8
• Changed THVD1419 receiver switching characteristics......................................................................................................... 8
• Added 图 7 to 图 9 ................................................................................................................................................................. 9
Changes from Revision A (December 2018) to Revision B Page
• 将 THVD1429 从:“
预告信息
” 更改为:“
生产
数据”................................................................................................................ 1

1R 8 VCC
2RE 7 B
3DE 6 A
4D 5 GND
Not to scale
4
THVD1419
,
THVD1429
ZHCSJ05C –NOVEMBER 2018 –REVISED MARCH 2019
www.ti.com.cn
Copyright © 2018–2019, Texas Instruments Incorporated
6 Pin Configuration and Functions
THVD1419, THVD1429 Devices
8-Pin D Package (SOIC)
Top View
Pin Functions
PIN
I/O DESCRIPTION
NAME NO.
A 6 Bus input/output Bus I/O port, A (complementary to B)
B 7 Bus input/output Bus I/O port, B (complementary to A)
D 4 Digital input Driver data input
DE 3 Digital input Driver enable, active high (2-MΩ internal pull-down)
GND 5 Ground Device ground
R 1 Digital output Receive data output
V
CC
8 Power 3.3-V to 5-V supply
RE 2 Digital input Receiver enable, active low (2-MΩ internal pull-up)

5
THVD1419
,
THVD1429
www.ti.com.cn
ZHCSJ05C –NOVEMBER 2018–REVISED MARCH 2019
Copyright © 2018–2019, Texas Instruments Incorporated
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
Supply voltage V
CC
-0.5 7 V
Bus voltage
Range at any bus pin (A or B) as differential or
common-mode with respect to GND
-15 15 V
Input voltage Range at any logic pin (D, DE, or /RE) -0.3 5.7 V
Receiver output
current
I
O
-24 24 mA
Storage temperature range -65 150 ℃
7.2 ESD Ratings
VALUE UNIT
V
(ESD)
Electrostatic discharge
Human body model (HBM), per
ANSI/ESDA/JEDEC JS-001, 2010
Bus terminals
and GND
±16 kV
All other pins ±8 kV
Charged device model (CDM), per
JEDEC JESD22-C101E
All pins ±1.5 kV
7.3 ESD Ratings [IEC]
VALUE UNIT
V
(ESD)
Electrostatic discharge
Contact Discharge, per IEC 61000-
4-2
Bus pins and
GND
±8 kV
Air-Gap Discharge, per IEC 61000-
4-2
Bus pins and
GND
±30 kV
V
(EFT)
Electrical fast transient Per IEC 61000-4-4
Bus pins and
GND
±4 kV
V
(surge)
Surge Per IEC 61000-4-5, 1.2/50 μs
Bus pins and
GND
±2.5 kV
剩余30页未读,继续阅读
资源评论

不觉明了
- 粉丝: 691
- 资源: 4046

上传资源 快速赚钱
我的内容管理 收起
我的资源 快来上传第一个资源
我的收益
登录查看自己的收益我的积分 登录查看自己的积分
我的C币 登录后查看C币余额
我的收藏
我的下载
下载帮助

会员权益专享
安全验证
文档复制为VIP权益,开通VIP直接复制
