2
THVD1410
THVD1450
,
THVD1451
,
THVD1452
ZHCSI82E –MAY 2018–REVISED MAY 2019
www.ti.com.cn
版权 © 2018–2019, Texas Instruments Incorporated
目目录录
1 特特性性.......................................................................... 1
2 应应用用.......................................................................... 1
3 说说明明.......................................................................... 1
4 修修订订历历史史记记录录 ........................................................... 2
5 Device Comparison Table..................................... 4
6 Pin Configuration and Functions......................... 5
7 Specifications......................................................... 8
7.1 Absolute Maximum Ratings ...................................... 8
7.2 ESD Ratings.............................................................. 8
7.3 ESD Ratings [IEC] .................................................... 8
7.4 Recommended Operating Conditions....................... 9
7.5 Thermal Information.................................................. 9
7.6 Power Dissipation ..................................................... 9
7.7 Electrical Characteristics......................................... 10
7.8 Switching Characteristics........................................ 11
7.9 Typical Characteristics: All Devices........................ 12
7.10 Typical Characteristics: THD1450, THVD1451 and
THVD1452 ............................................................... 14
7.11 Typical Characteristics: THVD1410 ...................... 15
8 Parameter Measurement Information ................ 16
9 Detailed Description............................................ 18
9.1 Overview ................................................................. 18
9.2 Functional Block Diagrams ..................................... 18
9.3 Feature Description................................................. 19
9.4 Device Functional Modes........................................ 19
10 Application and Implementation........................ 22
10.1 Application Information...................................... 22
10.2 Typical Application ............................................... 22
11 Power Supply Recommendations ..................... 28
12 Layout................................................................... 29
12.1 Layout Guidelines ................................................. 29
12.2 Layout Example .................................................... 29
13 器器件件和和文文档档支支持持 ..................................................... 30
13.1 器件支持................................................................ 30
13.2 第三方产品免责声明.............................................. 30
13.3 相关链接................................................................ 30
13.4 接收文档更新通知 ................................................. 30
13.5 社区资源................................................................ 30
13.6 商标 ....................................................................... 30
13.7 静电放电警告......................................................... 30
13.8 Glossary................................................................ 30
14 机机械械、、封封装装和和可可订订购购信信息息....................................... 30
4 修修订订历历史史记记录录
Changes from Revision D (March 2019) to Revision E Page
• 将 THVD1451 从
产品预览
更改为
生产
数据 ........................................................................................................................... 1
Changes from Revision C (February 2019) to Revision D Page
• 将 THVD1410 从
产品预览
更改为
生产
数据 ............................................................................................................................ 1
Changes from Revision B (December 2018) to Revision C Page
• 将 THVD1452 从
产品预览
更改为
生产
数据 ........................................................................................................................... 1
Changes from Revision A (May 2018) to Revision B Page
• 添加
特性
：“差分输出超过 2.1 V...” ......................................................................................................................................... 1
• 更改
特性
：将“±18kV IEC 61000-4-2 气隙放电”更改为：“±25kV IEC 61000-4-2 气隙放电”................................................... 1
• 添加 THVD1451 的 SOIC (8) 封装 ......................................................................................................................................... 1
• Added Thermal Pad to the THVD1450 DRB package ........................................................................................................... 5
• Added Thermal Pad to the THVD1451 DRB package ........................................................................................................... 6
• Changed all pins HBM ESD rating from 4 kV to 8 kV ............................................................................................................ 8
• Changed IEC ESD air-gap discharge rating from 18 kV to 25 kV.......................................................................................... 8
• Changed THVD1410 power dissipation numbers .................................................................................................................. 9
• Changed THVD1410 driver t
r
, t
f
TYP from 400 ns to 460 ns and MAX from 600 ns to 680 ns ........................................... 11
• Changed THVD1410 receiver t
r
, t
f
TYP from 13 ns to 10 ns................................................................................................ 11
• Changed THVD1410 receiver t
PH
L, t
PLH
TYP from 60 ns to 35 ns....................................................................................... 11
• Added Typical Characteristics, THD1450D .......................................................................................................................... 14
