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TI-THVD1500.pdf
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本文档旨在为方便起见,提供有关 TI 产品中文版本的信息,以确认产品的概要。 有关适用的官方英文版本的最新信息,请访问 www.ti.com,其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SLLSEY4
THVD1500
ZHCSGF8A –JULY 2017–REVISED NOVEMBER 2018
具具有有 ±8kV IEC ESD 保保护护功功能能的的 THVD1500 500kbps RS-485 收收发发器器
1
1 特特性性
1
• 达到或超出 TIA/EIA-485A 标准和中国国家电网公
司 (SGCC) 第 11 部分串行通信协议 RS-485 标准
的要求
• 4.5V 至 5.5V 电源电压
• 半双工 RS-422/RS-485
• 总线 I/O 保护
– ±16kV HBM ESD
– ±8kV IEC 61000-4-2 接触放电
– ±10kV IEC 61000-4-2 空气间隙放电
– ±2kV IEC 61000-4-4 快速瞬变脉冲
• 扩展的工业温度范围:-40°C 至 125°C
• 用于噪声抑制的大接收器滞后
• 低功耗
– 低待机电源电流:小于 1µA
– 运行静态电流:小于 660µA
• 适用于热插拔功能的无干扰加电/断电
• 开路、短路和空闲总线失效防护
• 1/8 单位负载选项(多达 256 个总线节点)
• 低 EMI 500kbps
2 应应用用
• 电量计
• 逆变器
• HVAC 系统
• 视频监控系统
3 说说明明
THVD1500 是适用于工业应用的强大半双工 RS-485
收发器。这些总线引脚可耐受高级别的 IEC 接触放电
ESD 事件,从而无需使用其他系统级保护组件。
该器件由 5V 单电源供电。总线引脚具备宽共模电压范
围和低输入泄漏,因此 THVD1500 适用于长电缆上的
多点 应用。
THVD1500 采用可实现简易兼容性的工业标准 8 引脚
SOIC 封装。该器件的温度范围是 -40°C 至 125°C。
器器件件信信息息
(1)
器器件件编编号号 封封装装 封封装装尺尺寸寸((标标称称值值))
THVD1500 SOIC (8) 4.90mm × 3.91mm
(1) 如需了解所有可用封装,请参阅产品说明书末尾的可订购产品
附录。
空白
空白
空白
简简化化原原理理图图
2
THVD1500
ZHCSGF8A –JULY 2017–REVISED NOVEMBER 2018
www.ti.com.cn
Copyright © 2017–2018, Texas Instruments Incorporated
目目录录
1 特特性性.......................................................................... 1
2 应应用用.......................................................................... 1
3 说说明明.......................................................................... 1
4 修修订订历历史史记记录录 ........................................................... 2
5 Pin Configuration and Functions......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings ............................................................ 4
6.3 Recommended Operating Conditions....................... 5
6.4 Thermal Information.................................................. 5
6.5 Power Dissipation ..................................................... 5
6.6 Electrical Characteristics........................................... 6
6.7 Switching Characteristics.......................................... 7
6.8 Typical Characteristics.............................................. 8
7 Parameter Measurement Information ................ 10
8 Detailed Description............................................ 13
8.1 Overview ................................................................. 13
8.2 Functional Block Diagrams ..................................... 13
8.3 Feature Description................................................. 13
8.4 Device Functional Modes........................................ 13
9 Application and Implementation ........................ 15
9.1 Application Information........................................ 15
9.2 Typical Application ................................................. 15
10 Power Supply Recommendations ..................... 19
11 Layout................................................................... 20
11.1 Layout Guidelines ................................................. 20
11.2 Layout Example .................................................... 20
12 器器件件和和文文档档支支持持 ..................................................... 21
12.1 器件支持................................................................ 21
12.2 第三方产品免责声明.............................................. 21
12.3 接收文档更新通知 ................................................. 21
12.4 社区资源................................................................ 21
12.5 商标 ....................................................................... 21
12.6 静电放电警告......................................................... 21
12.7 术语表 ................................................................... 21
13 机机械械、、封封装装和和可可订订购购信信息息....................................... 22
4 修修订订历历史史记记录录
Changes from Original (July 2018) to Revision A Page
• 将标题中的“300kbps RS-485”更改成了“500kbps RS-485”..................................................................................................... 1
• 将
特性
中的“低 EMI 300kbps”更改成了“低 EMI 500kbps” ...................................................................................................... 1
• Changed Signaling rate From: 300 kbps To: 500 kbps in the Recommended Operating Condition ..................................... 5
• Changed text From: "data transmission up to 300 kbps" To: "data transmission up to 500 kbps" in the Overview
section .................................................................................................................................................................................. 13
1R 8 VCC
2RE 7 B
3DE 6 A
4D 5 GND
Not to scale
3
THVD1500
www.ti.com.cn
ZHCSGF8A –JULY 2017–REVISED NOVEMBER 2018
Copyright © 2017–2018, Texas Instruments Incorporated
5 Pin Configuration and Functions
D Package
8-Pin SOIC
Top View
Pin Functions
PIN
I/O DESCRIPTION
NAME NO.
R 1 Digital output Receive data output
RE 2 Digital input Receiver enable, active low (internal 2-MΩ pull-up)
DE 3 Digital input Driver enable, active high (internal 2-MΩ pull-down)
D 4 Digital input Driver data input
GND 5 Ground Local device ground
A 6 Bus input/output Bus I/O port, A (complementary to B)
B 7 Bus input/output Bus I/O port, B (complementary to A)
V
CC
8 Power 5-V supply
4
THVD1500
ZHCSGF8A –JULY 2017–REVISED NOVEMBER 2018
www.ti.com.cn
Copyright © 2017–2018, Texas Instruments Incorporated
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
Supply voltage V
CC
–0.5 7 V
Bus voltage Range at any bus pin (A or B) –18 18 V
Input voltage
Range at any logic pin (D, DE, or RE) –0.3 5.7
V
Transient pulse voltage range at any bus pin
(A or B) through 100 Ω
–100 100
Receiver output current I
O
–24 24 mA
Junction temperature 170 °C
Absolute ambient temperature, T
A
–55 125 °C
Storage temperature, T
stg
–65 150 °C
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE UNIT
V
(ESD)
Electrostatic discharge
Contact Discharge, per IEC 61000-4-2
Pins Bus terminals and
GND
±8,000
V
Air Gap Discharge, per IEC 61000-4-2
Pins Bus terminals and
GND
±10,000
Human-body model (HBM), per
ANSI/ESDA/JEDEC JS-001
(1)
Pins Bus terminals and
GND
±16,000
All pins except Bus
terminals and GND
±4,000
Charged-device model (CDM), per JEDEC specification JESD22-
C101
(2)
±1,500
Machine model (MM), per JEDEC JESD22-A115-A ±400
V
(EFT)
Electrical fast transient Per IEC 61000-4-4 Pins Bus terminals ±2,000 V
5
THVD1500
www.ti.com.cn
ZHCSGF8A –JULY 2017–REVISED NOVEMBER 2018
Copyright © 2017–2018, Texas Instruments Incorporated
(1) The algebraic convention, in which the least positive (most negative) limit is designated as minimum is used in this data sheet.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
V
CC
Supply voltage 4.5 5.5 V
V
I
Input voltage at any bus terminal
(1)
-7 12 V
V
IH
High-level input voltage (Driver, driver enable, and receiver enable
inputs)
2 V
CC
V
V
IL
Low-level input voltage (Driver, driver enable, and receiver enable
inputs)
0 0.8 V
V
ID
Differential input voltage -12 12 V
I
O
Output current, Driver -60 60 mA
I
OR
Output current, Receiver -8 8 mA
R
L
Differential load resistance 54 Ω
1/t
UI
Signaling rate 500 kbps
T
A
Operating ambient temperature -40 125 °C
T
J
Junction temperature -40 150 °C
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.4 Thermal Information
THERMAL METRIC
(1)
THVD1500
UNITD (SOIC)
8 PINS
R
θJA
Junction-to-ambient thermal resistance 130.1 °C/W
R
θJC(top)
Junction-to-case (top) thermal resistance 72.8 °C/W
R
θJB
Junction-to-board thermal resistance 73.6 °C/W
ψ
JT
Junction-to-top characterization parameter 25.0 °C/W
ψ
JB
Junction-to-board characterization parameter 72.9 °C/W
R
θJC(bot)
Junction-to-case (bottom) thermal resistance NA °C/W
T
J(TSD)
Thermal shut-down temperature 170 °C
6.5 Power Dissipation
over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS VALUE UNIT
PD
Driver and receiver enabled,
V
CC
= 5.5 V, T
J
= 150 °C,
50% duty cycle square wave at signaling
rate
Unterminated R
L
= 300 Ω,
C
L
= 50 pF (driver)
300 kbps 50 mW
RS-422 load R
L
= 100 Ω,
C
L
= 50 pF (driver)
300 kbps 110 mW
RS-485 load R
L
= 54 Ω,
C
L
= 50 pF (driver)
300 kbps 170 mW
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