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本文档旨在为方便起见,提供有关 TI 产品中文版本的信息,以确认产品的概要。 有关适用的官方英文版本的最新信息,请访问 www.ti.com,其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SLLSF67
THVD1520
ZHCSKF1 –OCTOBER 2019
具具有有 ±8kV IEC ESD 保保护护功功能能的的 THVD1520 10Mbps RS-485 收收发发器器
1
1 特特性性
1
• 符合或超出 TIA/EIA-485A 标准要求
• 4.5V 至 5.5V 电源电压
• 10Mbps 半双工 RS-422/RS-485
• 总线 I/O 保护
– ± 16kV HBM ESD
– ± 8kV IEC 61000-4-2 接触放电
– ± 8kV IEC 61000-4-2 空气间隙放电
– ± 4kV IEC 61000-4-4 快速瞬变脉冲
• 工业工作温度范围:-40°C 至 125°C
• 用于噪声抑制的较大接收器滞后
• 低功耗
– 低待机电源电流:< 1µA
– 运行期间静态电流:< 840µA
• 适用于热插拔功能的无干扰上电/断电
• 开路、短路和空闲总线失效防护
• 1/8 单位负载(多达 256 个总线节点)
2 应应用用
• 工厂自动化和控制
• 楼宇自动化
• HVAC 系统
• 视频监控
• 智能仪表
3 说说明明
THVD1520 是适用于工业应用的强大半双工 RS-485
收发器。这些总线引脚可耐受高级别的 IEC 接触放电
ESD 事件,因此无需使用其他系统级保护组件。
该器件由 5V 单电源供电。总线引脚具备宽共模电压范
围和低输入泄漏,因此 THVD1520 适用于长电缆上的
多点 应用 。
THVD1520 采用可实现快插兼容性的业界通用 8 引脚
SOIC 封装。该器件的额定温度范围为 –40°C 至 125°
C。
器器件件信信息息
(1)
器器件件型型号号 封封装装 封封装装尺尺寸寸((标标称称值值))
THVD1520 SOIC (8) 4.90mm × 3.91mm
(1) 如需了解所有可用封装,请参阅产品说明书末尾的可订购产品
附录。
空白
空白
简简化化原原理理图图

2
THVD1520
ZHCSKF1 –OCTOBER 2019
www.ti.com.cn
Copyright © 2019, Texas Instruments Incorporated
目目录录
1 特特性性.......................................................................... 1
2 应应用用.......................................................................... 1
3 说说明明.......................................................................... 1
4 修修订订历历史史记记录录 ........................................................... 2
5 Pin Configuration and Functions......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 ESD Ratings [IEC] .................................................... 4
6.4 Recommended Operating Conditions....................... 5
6.5 Thermal Information.................................................. 5
6.6 Electrical Characteristics........................................... 6
6.7 Power Dissipation Characteristics ............................ 7
6.8 Switching Characteristics.......................................... 7
6.9 Typical Characteristics.............................................. 8
7 Parameter Measurement Information .................. 9
8 Detailed Description............................................ 11
8.1 Overview ................................................................. 11
8.2 Functional Block Diagrams ..................................... 11
8.3 Feature Description................................................. 11
8.4 Device Functional Modes........................................ 11
9 Application and Implementation ........................ 13
9.1 Application Information........................................ 13
9.2 Typical Application ................................................. 13
10 Power Supply Recommendations ..................... 18
11 Layout................................................................... 19
11.1 Layout Guidelines ................................................. 19
11.2 Layout Example .................................................... 19
12 器器件件和和文文档档支支持持 ..................................................... 20
12.1 器件支持................................................................ 20
12.2 第三方产品免责声明.............................................. 20
12.3 接收文档更新通知 ................................................. 20
12.4 社区资源................................................................ 20
12.5 商标 ....................................................................... 20
12.6 静电放电警告......................................................... 20
12.7 Glossary................................................................ 20
13 机机械械、、封封装装和和可可订订购购信信息息....................................... 20
4 修修订订历历史史记记录录
注:之前版本的页码可能与当前版本有所不同。
日日期期 修修订订版版本本 说说明明
2019 年 10 月 * 初始发行版。

1R 8 VCC
2RE 7 B
3DE 6 A
4D 5 GND
Not to scale
3
THVD1520
www.ti.com.cn
ZHCSKF1 –OCTOBER 2019
Copyright © 2019, Texas Instruments Incorporated
5 Pin Configuration and Functions
D Package
8-Pin SOIC
Top View
Pin Functions
PIN
I/O DESCRIPTION
NAME NO.
R 1 Digital output Receive data output
RE 2 Digital input Receiver enable, active low (internal 5-MΩ pull-up)
DE 3 Digital input Driver enable, active high (internal 5-MΩ pull-down)
D 4 Digital input Driver data input (internal 5-MΩ pull-up)
GND 5 Ground Device ground
A 6 Bus input/output Bus I/O port, A (complementary to B)
B 7 Bus input/output Bus I/O port, B (complementary to A)
V
CC
8 Power 5-V supply

4
THVD1520
ZHCSKF1 –OCTOBER 2019
www.ti.com.cn
Copyright © 2019, Texas Instruments Incorporated
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
V
CC
Supply voltage –0.5 7 V
V
L
Input voltage at any logic pin (D, DE or RE) –0.3 5.7 V
V
A
, V
B
Voltage at A or B inputs, as differential or common-mode with respect to GND –18 18 V
I
O
Receiver output current –24 24 mA
T
J
Junction temperature 170 °C
T
STG
Storage temperature –65 150 °C
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE UNIT
V
(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
Bus terminals and GND ±16,000 V
All other pins ±4,000
V
Charged-device model (CDM), per JEDEC specification JESD22-C101
(2)
±1,500
6.3 ESD Ratings [IEC]
VALUE UNIT
V
(ESD)
Electrostatic discharge
IEC 61000-4-2 ESD (Contact Discharge), bus terminals and GND ±8,000
VIEC 61000-4-2 ESD (Air-Gap Discharge), bus terminals and GND ±8,000
IEC 61000-4-4 EFT (Fast transient or burst), bus terminals and GND ±4,000

5
THVD1520
www.ti.com.cn
ZHCSKF1 –OCTOBER 2019
Copyright © 2019, Texas Instruments Incorporated
(1) The algebraic convention in which the least positive (most negative) limit is designated as minimum is used in this data sheet.
(2) Operation is specified for internal (junction) temperatures upto 150°C. Self-heating due to internal power dissipation should be
considered for each application. Maximum junction temperature is internally limited by the thermal shutdown (TSD) circuit which disables
the device when the junction temperature reaches 170°C.
6.4 Recommended Operating Conditions
MIN NOM MAX UNIT
V
CC
Supply voltage 4.5 5 5.5 V
V
ID
Differential input voltage –12 12 V
V
I
Input voltage at any bus terminal
(1)
–7 12 V
V
IH
High-level input voltage (driver, driver-enable, and receiver-enable inputs) 2 V
CC
V
V
IL
Low-level input voltage (driver, driver-enable, and receiver-enable inputs) 0 0.8 V
I
O
Output current
Driver –60 60
mA
Receiver –8 8
R
L
Differential load resistance 54 60 Ω
1/t
UI
Signaling rate 10 Mbps
T
J
Junction temperature –40 150 °C
T
A
(2)
Operating ambient temperature –40 125 °C
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.5 Thermal Information
THERMAL METRIC
(1)
THVD1520
UNITD (SOIC)
8 PINS
R
θJA
Junction-to-ambient thermal resistance 125.3 °C/W
R
θJC(top)
Junction-to-case (top) thermal resistance 67.6 °C/W
R
θJB
Junction-to-board thermal resistance 68.6 °C/W
ψ
JT
Junction-to-top characterization parameter 20.4 °C/W
ψ
JB
Junction-to-board characterization parameter 67.8 °C/W
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