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TI-THVD2450.pdf
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本文档旨在为方便起见,提供有关 TI 产品中文版本的信息,以确认产品的概要。 有关适用的官方英文版本的最新信息,请访问 www.ti.com,其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SLLSF20
THVD2410
THVD2450
ZHCSJZ4A –JULY 2019–REVISED OCTOBER 2019
具具有有 IEC ESD 保保护护功功能能的的 THVD24x0 ±70V 故故障障保保护护 3.3V 至至 5V RS-485
收收发发器器
1
1 特特性性
1
• 符合或超过
TIA/EIA-485A 和 TIA/EIA-422B 标准的要求
• 3V 至 5.5V 电源电压
• 差分输出超过 2.1V,在 5V 电源下与 PROFIBUS
兼容
• 总线 I/O 保护
– ±70V 直流总线故障
– ±16kV HBM ESD
– ±12kV IEC 61000-4-2 接触放电
– ±12kV IEC 61000-4-2 空气间隙放电
– ±4kV IEC 61000-4-4 快速瞬变脉冲
• 提供两种速度等级的半双工器件
– THVD2410:500kbps
– THVD2450:50Mbps
• 扩展环境
温度范围:-40°C 至 125°C
• 扩展运行
共模范围:±25V
• 增强型接收器迟滞,
可获得抗噪能力
• 低功耗
– 低关断电源电流:< 1µA
– 运行期间的电流:< 5.6mA
• 适用于热插拔功能的无干扰上电/断电
• 开路、短路和空闲总线失效防护
• 热关断
• 1/8 单位负载(多达 256 个总线节点)
• 小型 VSON 和 VSSOP 封装(可节省布板空间)或
SOIC 封装(可实现快插兼容性)
2 应应用用
• 电机驱动器
• 工厂自动化与控制
• HVAC 系统
• 楼宇自动化
• 电网基础设施
• 电表
• 过程分析
• 视频监控
3 说说明明
THVD2410 和 THVD2450 是 ±70V 故障保护、半双
工、RS-422/RS-485 收发器,由 3V 至 5.5V 的单电源
供电。在所有运行模式下均可保护总线接口引脚不受过
压条件破坏,可确保在恶劣的工业环境中实现稳定可靠
的通信。
这些器件具有集成式 IEC ESD 保护,无需外部系统级
保护组件。在更长的电缆敷设长度和/或存在大接地环
路电压的情况下,扩展 ±25V 输入共模范围可保证数据
通信稳定可靠。增强型 250mV 接收器迟滞可确保实现
高噪声抑制。此外,当输入同时开路或短路时,接收器
失效防护功能可保证处于逻辑高电平。
THVD24x0 器件采用小型 VSSOP 和 VSON 封装,适
用于空间受限型 应用。这些器件在自然通风环境下的
额定温度范围为 –40°C 至 125°C。
器器件件信信息息
(1)
器器件件型型号号 封封装装 封封装装尺尺寸寸((标标称称值值))
THVD2410
THVD2450
VSON (8) 3.00mm × 3.00mm
VSSOP (8) 3.00mm × 3.00mm
SOIC (8) 4.90mm × 3.91mm
(1) 如需了解所有可用封装,请参阅数据表末尾的可订购产品附
录。
THVD2410 和和 THVD2450 简简化化原原理理图图
2
THVD2410
THVD2450
ZHCSJZ4A –JULY 2019–REVISED OCTOBER 2019
www.ti.com.cn
Copyright © 2019, Texas Instruments Incorporated
目目录录
1 特特性性.......................................................................... 1
2 应应用用.......................................................................... 1
3 说说明明.......................................................................... 1
4 修修订订历历史史记记录录 ........................................................... 2
5 Pin Configuration and Functions......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings ............................................................ 4
6.3 ESD Ratings [IEC] .................................................... 4
6.4 Recommended Operating Conditions....................... 5
6.5 Thermal Information.................................................. 5
6.6 Power Dissipation ..................................................... 5
6.7 Electrical Characteristics........................................... 6
6.8 Switching Characteristics.......................................... 7
6.9 Switching Characteristics.......................................... 7
6.10 Typical Characteristics............................................ 8
7 Parameter Measurement Information ................ 10
8 Detailed Description............................................ 12
8.1 Overview ................................................................. 12
8.2 Functional Block Diagrams ..................................... 12
8.3 Feature Description................................................. 12
8.4 Device Functional Modes........................................ 13
9 Application and Implementation ........................ 15
9.1 Application Information........................................ 15
9.2 Typical Application ................................................. 15
10 Power Supply Recommendations ..................... 20
11 Layout................................................................... 21
11.1 Layout Guidelines ................................................. 21
11.2 Layout Example .................................................... 21
12 器器件件和和文文档档支支持持 ..................................................... 22
12.1 器件支持................................................................ 22
12.2 第三方产品免责声明.............................................. 22
12.3 相关链接................................................................ 22
12.4 接收文档更新通知 ................................................. 22
12.5 社区资源................................................................ 22
12.6 商标 ....................................................................... 22
12.7 静电放电警告......................................................... 22
12.8 Glossary................................................................ 22
13 机机械械、、封封装装和和可可订订购购信信息息....................................... 22
4 修修订订历历史史记记录录
Changes from Original (July 2019) to Revision A Page
• 删除了
应用
:地震测试设备..................................................................................................................................................... 1
• 已删除 删除了
器件信息
表中 THVD2410 的产品预览说明 ..................................................................................................... 1
1R 8 VCC
2RE 7 B
3DE 6 A
4D 5 GND
No t to scale
Th ermal
Pad
1R 8 VCC
2RE 7 B
3DE 6 A
4D 5 GND
Not to scale
3
THVD2410
THVD2450
www.ti.com.cn
ZHCSJZ4A –JULY 2019–REVISED OCTOBER 2019
Copyright © 2019, Texas Instruments Incorporated
5 Pin Configuration and Functions
THVD2410, THVD2450 Devices
8-Pin D (SOIC) and DGK (VSSOP) Packages
Top View
THVD2410, THVD2450 Devices
8-Pin DRB Package (VSON)
Top View
Pin Functions
PIN
I/O DESCRIPTION
NAME D DGK DRB
A 6 6 6 Bus input/output Bus I/O port, A (complementary to B)
B 7 7 7 Bus input/output Bus I/O port, B (complementary to A)
D 4 4 4 Digital input Driver data input
DE 3 3 3 Digital input Driver enable, active high (2-MΩ internal pull-down)
GND 5 5 5 Ground Device ground
R 1 1 1 Digital output Receive data output
V
CC
8 8 8 Power 3.3-V to 5-V supply
RE 2 2 2 Digital input Receiver enable, active low (2-MΩ internal pull-up)
Thermal
Pad
— — — —
No electrical connection. Should be connected to GND plane for
optimal thermal performance
4
THVD2410
THVD2450
ZHCSJZ4A –JULY 2019–REVISED OCTOBER 2019
www.ti.com.cn
Copyright © 2019, Texas Instruments Incorporated
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
Supply voltage V
CC
–0.5 7 V
Bus voltage
Range at any bus pin (A or B) as differential or
common-mode with respect to GND
–70 70 V
Input voltage Range at any logic pin (D, DE, or RE) –0.3 5.7 V
Receiver output current I
O
–24 24 mA
Storage temperature T
stg
–65 170 °C
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE UNIT
V
(ESD)
Electrostatic discharge
Human-body model (HBM), per
ANSI/ESDA/JEDEC JS-001
(1)
Bus terminals and GND ±16,000 V
All pins except bus terminals
and GND
±8,000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101
(2)
±1,500 V
6.3 ESD Ratings [IEC]
VALUE UNIT
V
(ESD)
Electrostatic discharge
Contact discharge, per IEC 61000-4-2 Bus terminals and GND ±12,000
V
Air-gap discharge, per IEC 61000-4-2 Bus terminals and GND ±12,000
V
(EFT)
Electrical fast transient Per IEC 61000-4-4 Bus terminals ±4,000 V
5
THVD2410
THVD2450
www.ti.com.cn
ZHCSJZ4A –JULY 2019–REVISED OCTOBER 2019
Copyright © 2019, Texas Instruments Incorporated
(1) The algebraic convention, in which the least positive (most negative) limit is designated as minimum is used in this data sheet.
6.4 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
V
CC
Supply voltage 3 5.5 V
V
I
Input voltage at any bus terminal (separately or common mode)
(1)
–25 25 V
V
IH
High-level input voltage (driver, driver enable, and receiver enable inputs) 2 V
V
IL
Low-level input voltage (driver, driver enable, and receiver enable inputs) 0.8 V
V
ID
Differential input voltage –25 25 V
I
O
Output current, driver –60 60 mA
I
OR
Output current, receiver –8 8 mA
R
L
Differential load resistance 54 60 Ω
1/t
UI
Signaling rate
THVD2410 500 kbps
THVD2450 50 Mbps
T
A
Operating ambient temperature -40 125 °C
T
J
Junction temperature -40 150 °C
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.5 Thermal Information
THERMAL METRIC
(1)
THVD2410
THVD2450
THVD2410
THVD2450
THVD2410
THVD2450
UNITD
(SOIC)
DGK
(VSSOP)
DRB
(VSON)
8 PINS 8 PINS 8 PINS
R
θJA
Junction-to-ambient thermal resistance 115.9 164.0 47.6 °C/W
R
θJC(top)
Junction-to-case (top) thermal resistance 53.1 49.5 49.4 °C/W
R
θJB
Junction-to-board thermal resistance 60.1 85.5 20.3 °C/W
ψ
JT
Junction-to-top characterization parameter 10.1 5.1 0.9 °C/W
ψ
JB
Junction-to-board characterization parameter 59.2 83.7 20.2 °C/W
R
θJC(bot)
Junction-to-case (bottom) thermal resistance N/A N/A 5.6 °C/W
6.6 Power Dissipation
PARAMETER TEST CONDITIONS VALUE UNIT
P
D
Driver and receiver enabled,
V
CC
= 5.5 V, T
A
= 125 °C,
random data (PRBS7) at signaling rate
Unterminated
R
L
= 300 Ω, C
L
= 50 pF (driver)
THVD2410 500 kbps 130
mW
THVD2450 50 Mbps 340
RS-422 load
R
L
= 100 Ω, C
L
= 50 pF (driver)
THVD2410 500 kbps 170
mW
THVD2450 50 Mbps 340
RS-485 load
R
L
= 54 Ω, C
L
= 50 pF (driver)
THVD2410 500 kbps 240
mW
THVD2450 50 Mbps 370
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