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TI-CC1150.pdf
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CC1150
SWRS037B –JANUARY 2006–REVISED MARCH 2015
CC1150 Low Power Sub-1 GHz RF Transmitter
1 Device Overview
1.1 Features
1
• Small Size • 64-byte TX Data FIFO
– QLP 4-mm × 4-mm Package, 16 Pins • Suited for Systems Compliant with EN 300 220
and FCC CFR Part 15
• True Single Chip UHF RF Transmitter
• Many Powerful Digital Features Allow a High-
• Frequency Bands
performance RF system to be made Using an
– 300 to 348 MHz
Inexpensive Microcontroller
– 400 to 464 MHz
• Efficient SPI interface: All Registers Can be
– 800 to 928 MHz
Programmed With One "Burst" Transfer
• Programmable Data Rate Up to 500 kBaud
• Integrated Analog Temperature Sensor
• Low Current Consumption
• Lead-free “Green” Package
• Programmable Output Power Up to +10 dBm for
• Flexible Support for Packet Oriented Systems
All Supported Frequencies
– On-chip Support for Sync-Word Insertion,
• Programmable Baseband Modulator
Flexible Packet Length and Automatic CRC
• Ideal For Multi-channel Operation
Handling
• Very Few External Components
• OOK and Flexible ASK Shaping Supported
– Completely On-chip Frequency Synthesizer
• 2-FSK, GFSK and MSK Supported
– No External Filters Needed
• Optional Automatic Whitening of Data
• Configurable Packet Handling Hardware
• Support for Asynchronous Transparent Transmit
• Suitable for Frequency Hopping Systems Due to a
Mode for Backwards Compatibility with Existing
Fast Settling Frequency Synthesizer
Radio Communication Protocols
• Optional Forward Error Correction with Interleaving
1.2 Applications
• Ultra-low Power UHF Wireless Transmitters • Low Power Telemetry
• Operating in the 315-, 433-, 868-, and 915-MHz • Home and Building Automation
ISM/SRD bands
• Wireless Alarm and Security Systems
• AMR – Automatic Meter Reading
• Industrial Monitoring and Control
• Consumer Electronics
• Wireless Sensor Networks
• RKE – Remote Keyless Entry
1.3 Description
The CC1150 is a true single-chip UHF transmitter designed for very low power wireless applications. The
circuit is mainly intended for the ISM (Industrial, Scientific and Medical) and SRD (Short Range Device)
frequency bands at 315-, 433-, 868-, and 915-MHz, but can easily be programmed for operation at other
frequencies in the 300 to 348 MHz, 400 to 464 MHz and 800 to 928 MHz bands.
The RF transmitter is integrated with a highly configurable baseband modulator. The modulator supports
various modulation formats and has a configurable data rate up to 500 kBaud. The CC1150 device
provides extensive hardware support for packet handling, data buffering and burst transmissions.
The main operating parameters and the 64-byte transmit FIFO of CC1150 can be controlled via an SPI
interface. In a typical system, the CC1150 device will be used together with a microcontroller and a few
additional passive components.
CC1150 is part of the SmartRF™ technology platform based on 0.18-μm CMOS technology from Texas
Instruments.
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
BIAS
XOSC_Q1 XOSC_Q2
XOSC
FREQ
SYNTH
RADIO CONTROL
RF_P
RF_N
CSn
SI
SO (GDO1)
SCLK
GDO0 (ATEST)
RBIAS
PA
FEC /
INTERLEAVER
PACKET
HANDLER
MODULATOR
TX FIFO
DIGITAL
INTERFACE
TO MCU
CC1150
SWRS037B –JANUARY 2006–REVISED MARCH 2015
www.ti.com
Table 1-1. Device Information
(1)
PART NUMBER PACKAGE BODY SIZE
CC1150 VQFNP (16) 4.00 mm × 4.00 mm
(1) For more information, see Section 8, Mechanical Packaging and Orderable Information.
1.4 Functional Block Diagram
2 Device Overview Copyright © 2006–2015, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC1150
CC1150
www.ti.com
SWRS037B –JANUARY 2006–REVISED MARCH 2015
Table of Contents
1 Device Overview ......................................... 1 5.7 Data Rate Programming ............................ 18
1.1 Features .............................................. 1 5.8 Packet Handling Hardware Support................. 19
1.2 Applications........................................... 1 5.9 Modulation Formats ................................. 23
1.3 Description............................................ 1 5.10 Forward Error Correction with Interleaving.......... 24
1.4 Functional Block Diagram ............................ 2 5.11 Radio Control........................................ 26
2 Revision History ......................................... 4 5.12 Data FIFO ........................................... 29
3 Terminal Configuration and Functions.............. 5 5.13 Frequency Programming ........................... 31
3.1 Pin Attributes ......................................... 5 5.14 VCO ................................................. 31
4 Specifications ............................................ 6 5.15 Voltage Regulators.................................. 32
4.1 Absolute Maximum Ratings .......................... 6 5.16 Output Power Programming......................... 32
4.2 ESD Ratings.......................................... 6 5.17 General Purpose and Test Output Control Pins .... 33
4.3 Recommended Operating Conditions ................ 6 5.18 Asynchronous and Synchronous Serial Operation.. 35
4.4 General Characteristics .............................. 6 5.19 System Considerations and Guidelines ............. 36
4.5 Current Consumption................................. 7 5.20 Memory.............................................. 38
4.6 RF Transmit .......................................... 7 6 Applications, Implementation, and Layout........ 51
4.7 Crystal Oscillator ..................................... 8 6.1 Application Information .............................. 51
4.8 Frequency Synthesizer Characteristics .............. 8 6.2 Design Requirements ............................... 53
4.9 Analog Temperature Sensor ......................... 9 6.3 PCB Layout Recommendations..................... 55
4.10 DC Characteristics ................................... 9 7 Device and Documentation Support ............... 58
4.11 Power-On Reset .................................... 10 7.1 Device Support ...................................... 58
4.12 Thermal Resistance Characteristics for VQFNP
7.2 Documentation Support ............................. 58
Package ............................................. 10
7.3 Trademarks.......................................... 59
5 Detailed Description ................................... 11
7.4 Electrostatic Discharge Caution..................... 59
5.1 Overview ............................................ 11
7.5 Export Control Notice ............................... 59
5.2 Functional Block Diagram........................... 11
7.6 Glossary............................................. 59
5.3 Configuration Overview ............................. 11
8 Mechanical Packaging and Orderable
5.4 Configuration Software.............................. 12
Information .............................................. 59
5.5 4-wire Serial Configuration and Data Interface ..... 13
8.1 Packaging Information .............................. 59
5.6 Microcontroller Interface and Pin Configuration..... 17
Copyright © 2006–2015, Texas Instruments Incorporated Table of Contents 3
Submit Documentation Feedback
Product Folder Links: CC1150
CC1150
SWRS037B –JANUARY 2006–REVISED MARCH 2015
www.ti.com
2 Revision History
This data manual revision history highlights the changes made to the SWRS037A device-specific data
manual to make it an SWRS037B revision.
Changes from January 1, 2006 to February 19, 2015 Page
• Updated RST package to RGV. .................................................................................................. 58
4 Revision History Copyright © 2006–2015, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: CC1150
GND
Exposed die
attach pad
5
XOSC_Q1
6
AVDD
7
XOSC_Q2
8
GDO0 (ATEST)
9 CSn
10 RF_P
11 RF_N
12 AVDD
13
AVDD
14
RBIAS
15
DGUARD
16
SI
1SCLK
2SO (GDO1)
3DVDD
4DCOUPL
CC1150
www.ti.com
SWRS037B –JANUARY 2006–REVISED MARCH 2015
3 Terminal Configuration and Functions
The CC1150 pinout is shown in Figure 3-1 and Table 3-1
Figure 3-1. Pinout Top View
3.1 Pin Attributes
Table 3-1. Pin Attributes
(1)
PIN NO. PIN NAME TYPE DESCRIPTION
1 SCLK Digital Input Serial configuration interface, clock input.
Serial configuration interface, data output.
2 SO (GDO1) Digital Output
Optional general output pin when CSn is high.
1.8-V to 3.6-V digital power supply for digital I/Os and for the digital
3 DVDD Power (Digital)
core voltage regulator.
4 DCOUPL
(2)
Power (Digital) 1.6-V to 2.0-V digital power supply output for decoupling.
5 XOSC_Q1 Analog I/O Crystal oscillator pin 1, or external clock input.
6 AVDD Power (Analog) 1.8-V to 3.6-V analog power supply connection.
7 XOSC_Q2 Analog I/O Crystal oscillator pin 2.
Digital output pin for general use:
• Test signals
GDO0 • FIFO status signals
8 Digital I/O
(ATEST)
• Clock output, down-divided from XOSC
• Serial input TX data
Also used as analog test I/O for prototype/production testing.
9 CSn Digital Input Serial configuration interface, chip select.
10 RF_P RF I/O Positive RF output signal from PA.
11 RF_N RF I/O Negative RF output signal from PA.
12 AVDD Power (Analog) 1.8-V to 3.6-V analog power supply connection.
13 AVDD Power (Analog) 1.8-V to 3.6-V analog power supply connection.
14 RBIAS Analog I/O External bias resistor for reference current.
15 DGUARD Power (Digital) Power supply connection for digital noise isolation.
16 SI Digital Input Serial configuration interface, data input.
(1) The exposed die attach pad must be connected to a solid ground plane as this is the main ground connection for the chip.
(2) This pin is intended for use with the CC1150 only. It can not be used to provide supply voltage to other devices.
Copyright © 2006–2015, Texas Instruments Incorporated Terminal Configuration and Functions 5
Submit Documentation Feedback
Product Folder Links: CC1150
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